JP2008547205A5 - - Google Patents
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- Publication number
- JP2008547205A5 JP2008547205A5 JP2008517092A JP2008517092A JP2008547205A5 JP 2008547205 A5 JP2008547205 A5 JP 2008547205A5 JP 2008517092 A JP2008517092 A JP 2008517092A JP 2008517092 A JP2008517092 A JP 2008517092A JP 2008547205 A5 JP2008547205 A5 JP 2008547205A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- malleable
- metal
- well
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 87
- 229910052751 metal Inorganic materials 0.000 claims 87
- 239000000463 material Substances 0.000 claims 56
- 239000004020 conductor Substances 0.000 claims 34
- 230000004888 barrier function Effects 0.000 claims 32
- 238000000034 method Methods 0.000 claims 32
- 238000010438 heat treatment Methods 0.000 claims 8
- 239000006059 cover glass Substances 0.000 claims 7
- 238000009792 diffusion process Methods 0.000 claims 6
- 239000011521 glass Substances 0.000 claims 6
- 239000011248 coating agent Substances 0.000 claims 4
- 238000000576 coating method Methods 0.000 claims 4
- 230000008878 coupling Effects 0.000 claims 4
- 238000010168 coupling process Methods 0.000 claims 4
- 238000005859 coupling reaction Methods 0.000 claims 4
- 239000007769 metal material Substances 0.000 claims 4
- 239000004593 Epoxy Substances 0.000 claims 3
- 239000004642 Polyimide Substances 0.000 claims 3
- 238000002844 melting Methods 0.000 claims 3
- 230000008018 melting Effects 0.000 claims 3
- 230000035515 penetration Effects 0.000 claims 3
- 229920002120 photoresistant polymer Polymers 0.000 claims 3
- 229920001721 polyimide Polymers 0.000 claims 3
- 239000000956 alloy Substances 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 230000000295 complement effect Effects 0.000 claims 2
- -1 dielectric Polymers 0.000 claims 2
- 238000007499 fusion processing Methods 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 238000003780 insertion Methods 0.000 claims 2
- 230000037431 insertion Effects 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000003989 dielectric material Substances 0.000 claims 1
- 230000004927 fusion Effects 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 230000000452 restraining effect Effects 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US69075905P | 2005-06-14 | 2005-06-14 | |
| US11/329,875 US7969015B2 (en) | 2005-06-14 | 2006-01-10 | Inverse chip connector |
| US11/329,575 US7884483B2 (en) | 2005-06-14 | 2006-01-10 | Chip connector |
| US11/329,874 US20060278966A1 (en) | 2005-06-14 | 2006-01-10 | Contact-based encapsulation |
| PCT/US2006/023246 WO2006138423A2 (en) | 2005-06-14 | 2006-06-14 | Chip connector |
Related Child Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011207007A Division JP5542763B2 (ja) | 2005-06-14 | 2011-09-22 | チップコネクタ |
| JP2011207006A Division JP5542762B2 (ja) | 2005-06-14 | 2011-09-22 | チップコネクタ |
| JP2011207005A Division JP5696016B2 (ja) | 2005-06-14 | 2011-09-22 | チップコネクタ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008547205A JP2008547205A (ja) | 2008-12-25 |
| JP2008547205A5 true JP2008547205A5 (cg-RX-API-DMAC7.html) | 2009-07-30 |
Family
ID=40239700
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008517092A Pending JP2008547205A (ja) | 2005-06-14 | 2006-06-14 | チップコネクタ |
| JP2011207005A Expired - Lifetime JP5696016B2 (ja) | 2005-06-14 | 2011-09-22 | チップコネクタ |
| JP2011207006A Expired - Fee Related JP5542762B2 (ja) | 2005-06-14 | 2011-09-22 | チップコネクタ |
| JP2011207007A Expired - Lifetime JP5542763B2 (ja) | 2005-06-14 | 2011-09-22 | チップコネクタ |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011207005A Expired - Lifetime JP5696016B2 (ja) | 2005-06-14 | 2011-09-22 | チップコネクタ |
| JP2011207006A Expired - Fee Related JP5542762B2 (ja) | 2005-06-14 | 2011-09-22 | チップコネクタ |
| JP2011207007A Expired - Lifetime JP5542763B2 (ja) | 2005-06-14 | 2011-09-22 | チップコネクタ |
Country Status (3)
| Country | Link |
|---|---|
| JP (4) | JP2008547205A (cg-RX-API-DMAC7.html) |
| KR (1) | KR101191523B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN101796636B (cg-RX-API-DMAC7.html) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8309396B2 (en) * | 2009-01-26 | 2012-11-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for 3D integrated circuit stacking |
| CN103378031B (zh) * | 2012-04-20 | 2016-02-03 | 南亚科技股份有限公司 | 半导体芯片与封装结构以及其形成方法 |
| KR102190382B1 (ko) | 2012-12-20 | 2020-12-11 | 삼성전자주식회사 | 반도체 패키지 |
| KR102244435B1 (ko) | 2014-09-03 | 2021-04-26 | 삼성디스플레이 주식회사 | 회로판 및 이를 포함하는 전자 장치 |
| EP3235354B1 (en) * | 2014-12-16 | 2024-01-24 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Contacting embedded electronic component via wiring structure in a component carrier's surface portion with homogeneous ablation properties |
| US20180340056A1 (en) * | 2015-08-28 | 2018-11-29 | Hitachi Chemical Company, Ltd. | Buffer sheet composition and buffer sheet |
| JP6424297B2 (ja) * | 2016-03-25 | 2018-11-14 | 住友精密工業株式会社 | 充填方法 |
| CN106252318B (zh) * | 2016-09-29 | 2019-01-04 | 华进半导体封装先导技术研发中心有限公司 | 植球工艺和结构 |
| JP7148300B2 (ja) * | 2018-07-12 | 2022-10-05 | 上村工業株式会社 | 導電性バンプ、及び無電解Ｐｔめっき浴 |
| CN113675722B (zh) * | 2021-07-14 | 2024-10-29 | 威科赛乐微电子股份有限公司 | 一种Cap layer层蚀刻优化方法 |
| AU2021480187A1 (en) * | 2021-12-22 | 2024-07-11 | Viasat, Inc. | Antenna apparatus employing radiation shield for integrated circuits |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07112041B2 (ja) * | 1986-12-03 | 1995-11-29 | シャープ株式会社 | 半導体装置の製造方法 |
| US5608264A (en) * | 1995-06-05 | 1997-03-04 | Harris Corporation | Surface mountable integrated circuit with conductive vias |
| JP4026882B2 (ja) * | 1997-02-24 | 2007-12-26 | 三洋電機株式会社 | 半導体装置 |
| JPH10270498A (ja) * | 1997-03-27 | 1998-10-09 | Toshiba Corp | 電子装置の製造方法 |
| JP3731378B2 (ja) * | 1999-03-31 | 2006-01-05 | セイコーエプソン株式会社 | 半導体素子の製造方法、および半導体素子、ならびに実装モジュール |
| JP2001085600A (ja) * | 1999-09-16 | 2001-03-30 | Seiko Epson Corp | 半導体チップ、マルチチップパッケージ、半導体装置、並びに電子機器 |
| CN2399842Y (zh) * | 1999-10-29 | 2000-10-04 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
| JP4547523B2 (ja) * | 2000-09-25 | 2010-09-22 | 太陽誘電株式会社 | チップ部品組立体とその製造方法 |
| US6508919B1 (en) * | 2000-11-28 | 2003-01-21 | Tokyo Electron Limited | Optimized liners for dual damascene metal wiring |
| US7242099B2 (en) | 2001-03-05 | 2007-07-10 | Megica Corporation | Chip package with multiple chips connected by bumps |
| US6732908B2 (en) * | 2002-01-18 | 2004-05-11 | International Business Machines Corporation | High density raised stud microjoining system and methods of fabricating the same |
| JP2004047537A (ja) * | 2002-07-09 | 2004-02-12 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| JP2004119773A (ja) * | 2002-09-27 | 2004-04-15 | Toshiba Corp | 半導体装置及びその製造方法 |
| JP4074862B2 (ja) * | 2004-03-24 | 2008-04-16 | ローム株式会社 | 半導体装置の製造方法、半導体装置、および半導体チップ |
| JP4551255B2 (ja) * | 2005-03-31 | 2010-09-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
-
2006
- 2006-06-14 CN CN200680029328XA patent/CN101796636B/zh not_active Expired - Lifetime
- 2006-06-14 JP JP2008517092A patent/JP2008547205A/ja active Pending
- 2006-06-14 KR KR1020117027342A patent/KR101191523B1/ko not_active Expired - Lifetime
-
2011
- 2011-09-22 JP JP2011207005A patent/JP5696016B2/ja not_active Expired - Lifetime
- 2011-09-22 JP JP2011207006A patent/JP5542762B2/ja not_active Expired - Fee Related
- 2011-09-22 JP JP2011207007A patent/JP5542763B2/ja not_active Expired - Lifetime
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