JP2008547205A - チップコネクタ - Google Patents

チップコネクタ Download PDF

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Publication number
JP2008547205A
JP2008547205A JP2008517092A JP2008517092A JP2008547205A JP 2008547205 A JP2008547205 A JP 2008547205A JP 2008517092 A JP2008517092 A JP 2008517092A JP 2008517092 A JP2008517092 A JP 2008517092A JP 2008547205 A JP2008547205 A JP 2008547205A
Authority
JP
Japan
Prior art keywords
wafer
chip
contact
malleable
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008517092A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008547205A5 (cg-RX-API-DMAC7.html
Inventor
ジョン・トレッツァ
ジョン・コーラハン
グレゴリー・デュドフ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cubic Wafer Inc
Original Assignee
Cubic Wafer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/329,875 external-priority patent/US7969015B2/en
Application filed by Cubic Wafer Inc filed Critical Cubic Wafer Inc
Priority claimed from PCT/US2006/023246 external-priority patent/WO2006138423A2/en
Publication of JP2008547205A publication Critical patent/JP2008547205A/ja
Publication of JP2008547205A5 publication Critical patent/JP2008547205A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP2008517092A 2005-06-14 2006-06-14 チップコネクタ Pending JP2008547205A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US69075905P 2005-06-14 2005-06-14
US11/329,875 US7969015B2 (en) 2005-06-14 2006-01-10 Inverse chip connector
US11/329,575 US7884483B2 (en) 2005-06-14 2006-01-10 Chip connector
US11/329,874 US20060278966A1 (en) 2005-06-14 2006-01-10 Contact-based encapsulation
PCT/US2006/023246 WO2006138423A2 (en) 2005-06-14 2006-06-14 Chip connector

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP2011207007A Division JP5542763B2 (ja) 2005-06-14 2011-09-22 チップコネクタ
JP2011207006A Division JP5542762B2 (ja) 2005-06-14 2011-09-22 チップコネクタ
JP2011207005A Division JP5696016B2 (ja) 2005-06-14 2011-09-22 チップコネクタ

Publications (2)

Publication Number Publication Date
JP2008547205A true JP2008547205A (ja) 2008-12-25
JP2008547205A5 JP2008547205A5 (cg-RX-API-DMAC7.html) 2009-07-30

Family

ID=40239700

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2008517092A Pending JP2008547205A (ja) 2005-06-14 2006-06-14 チップコネクタ
JP2011207005A Expired - Lifetime JP5696016B2 (ja) 2005-06-14 2011-09-22 チップコネクタ
JP2011207006A Expired - Fee Related JP5542762B2 (ja) 2005-06-14 2011-09-22 チップコネクタ
JP2011207007A Expired - Lifetime JP5542763B2 (ja) 2005-06-14 2011-09-22 チップコネクタ

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2011207005A Expired - Lifetime JP5696016B2 (ja) 2005-06-14 2011-09-22 チップコネクタ
JP2011207006A Expired - Fee Related JP5542762B2 (ja) 2005-06-14 2011-09-22 チップコネクタ
JP2011207007A Expired - Lifetime JP5542763B2 (ja) 2005-06-14 2011-09-22 チップコネクタ

Country Status (3)

Country Link
JP (4) JP2008547205A (cg-RX-API-DMAC7.html)
KR (1) KR101191523B1 (cg-RX-API-DMAC7.html)
CN (1) CN101796636B (cg-RX-API-DMAC7.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171432A (ja) * 2009-01-26 2010-08-05 Taiwan Semiconductor Manufacturing Co Ltd ３次元集積回路積上げ用システム及び方法
JP2017045994A (ja) * 2015-08-28 2017-03-02 日立化成株式会社 電子部品装置の製造方法及び電子部品装置
JP2020009997A (ja) * 2018-07-12 2020-01-16 上村工業株式会社 導電性バンプ、及び無電解Ｐｔめっき浴
CN110880490A (zh) * 2014-12-16 2020-03-13 奥特斯奥地利科技与系统技术有限公司 承载电子部件的部件承载件及制造部件承载件的方法
CN113675722A (zh) * 2021-07-14 2021-11-19 威科赛乐微电子股份有限公司 一种Cap layer层蚀刻优化方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103378031B (zh) * 2012-04-20 2016-02-03 南亚科技股份有限公司 半导体芯片与封装结构以及其形成方法
KR102190382B1 (ko) 2012-12-20 2020-12-11 삼성전자주식회사 반도체 패키지
KR102244435B1 (ko) 2014-09-03 2021-04-26 삼성디스플레이 주식회사 회로판 및 이를 포함하는 전자 장치
JP6424297B2 (ja) * 2016-03-25 2018-11-14 住友精密工業株式会社 充填方法
CN106252318B (zh) * 2016-09-29 2019-01-04 华进半导体封装先导技术研发中心有限公司 植球工艺和结构
AU2021480187A1 (en) * 2021-12-22 2024-07-11 Viasat, Inc. Antenna apparatus employing radiation shield for integrated circuits

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07112041B2 (ja) * 1986-12-03 1995-11-29 シャープ株式会社 半導体装置の製造方法
US5608264A (en) * 1995-06-05 1997-03-04 Harris Corporation Surface mountable integrated circuit with conductive vias
JP4026882B2 (ja) * 1997-02-24 2007-12-26 三洋電機株式会社 半導体装置
JPH10270498A (ja) * 1997-03-27 1998-10-09 Toshiba Corp 電子装置の製造方法
JP3731378B2 (ja) * 1999-03-31 2006-01-05 セイコーエプソン株式会社 半導体素子の製造方法、および半導体素子、ならびに実装モジュール
JP2001085600A (ja) * 1999-09-16 2001-03-30 Seiko Epson Corp 半導体チップ、マルチチップパッケージ、半導体装置、並びに電子機器
CN2399842Y (zh) * 1999-10-29 2000-10-04 富士康(昆山)电脑接插件有限公司 电连接器
JP4547523B2 (ja) * 2000-09-25 2010-09-22 太陽誘電株式会社 チップ部品組立体とその製造方法
US6508919B1 (en) * 2000-11-28 2003-01-21 Tokyo Electron Limited Optimized liners for dual damascene metal wiring
US7242099B2 (en) 2001-03-05 2007-07-10 Megica Corporation Chip package with multiple chips connected by bumps
US6732908B2 (en) * 2002-01-18 2004-05-11 International Business Machines Corporation High density raised stud microjoining system and methods of fabricating the same
JP2004047537A (ja) * 2002-07-09 2004-02-12 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
JP2004119773A (ja) * 2002-09-27 2004-04-15 Toshiba Corp 半導体装置及びその製造方法
JP4074862B2 (ja) * 2004-03-24 2008-04-16 ローム株式会社 半導体装置の製造方法、半導体装置、および半導体チップ
JP4551255B2 (ja) * 2005-03-31 2010-09-22 ルネサスエレクトロニクス株式会社 半導体装置

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171432A (ja) * 2009-01-26 2010-08-05 Taiwan Semiconductor Manufacturing Co Ltd ３次元集積回路積上げ用システム及び方法
CN110880490A (zh) * 2014-12-16 2020-03-13 奥特斯奥地利科技与系统技术有限公司 承载电子部件的部件承载件及制造部件承载件的方法
JP7122803B2 (ja) 2015-08-28 2022-08-22 昭和電工マテリアルズ株式会社 電子部品装置の製造方法
JP2017045994A (ja) * 2015-08-28 2017-03-02 日立化成株式会社 電子部品装置の製造方法及び電子部品装置
US12662590B2 (en) 2015-08-28 2026-06-23 Resonac Corporation Method for using a buffer sheet
JP7203481B2 (ja) 2015-08-28 2023-01-13 株式会社レゾナック 電子部品装置の製造方法
JP2017045993A (ja) * 2015-08-28 2017-03-02 日立化成株式会社 電子部品装置の製造方法及び電子部品装置
JP2017045995A (ja) * 2015-08-28 2017-03-02 日立化成株式会社 電子部品装置の製造方法及び電子部品装置
JP2021073748A (ja) * 2015-08-28 2021-05-13 昭和電工マテリアルズ株式会社 緩衝シート用組成物及び緩衝シート
JP7203482B2 (ja) 2015-08-28 2023-01-13 株式会社レゾナック 電子部品装置の製造方法
JP2022009939A (ja) * 2015-08-28 2022-01-14 昭和電工マテリアルズ株式会社 電子部品装置の製造方法及び電子部品装置
JP7056775B2 (ja) 2015-08-28 2022-04-19 昭和電工マテリアルズ株式会社 緩衝シート用組成物及び緩衝シート
KR20200007672A (ko) * 2018-07-12 2020-01-22 우에무라 고교 가부시키가이샤 도전성 범프, 및 무전해 Pt 도금욕
JP7148300B2 (ja) 2018-07-12 2022-10-05 上村工業株式会社 導電性バンプ、及び無電解Ｐｔめっき浴
CN110718523A (zh) * 2018-07-12 2020-01-21 上村工业株式会社 导电性凸块及化学镀Pt浴
KR102641047B1 (ko) * 2018-07-12 2024-02-26 우에무라 고교 가부시키가이샤 도전성 범프, 전자 부품, 및 무전해 Pt 도금욕
JP2020009997A (ja) * 2018-07-12 2020-01-16 上村工業株式会社 導電性バンプ、及び無電解Ｐｔめっき浴
CN113675722A (zh) * 2021-07-14 2021-11-19 威科赛乐微电子股份有限公司 一种Cap layer层蚀刻优化方法

Also Published As

Publication number Publication date
JP5696016B2 (ja) 2015-04-08
JP2012028802A (ja) 2012-02-09
JP5542763B2 (ja) 2014-07-09
KR101191523B1 (ko) 2012-10-15
JP5542762B2 (ja) 2014-07-09
CN101796636B (zh) 2013-02-27
JP2012039129A (ja) 2012-02-23
KR20110132485A (ko) 2011-12-07
JP2012028801A (ja) 2012-02-09
CN101796636A (zh) 2010-08-04

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