JP2008543092A5 - - Google Patents
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- Publication number
- JP2008543092A5 JP2008543092A5 JP2008514962A JP2008514962A JP2008543092A5 JP 2008543092 A5 JP2008543092 A5 JP 2008543092A5 JP 2008514962 A JP2008514962 A JP 2008514962A JP 2008514962 A JP2008514962 A JP 2008514962A JP 2008543092 A5 JP2008543092 A5 JP 2008543092A5
- Authority
- JP
- Japan
- Prior art keywords
- package
- frame
- chip
- antenna
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 3
- 230000005540 biological transmission Effects 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/144,504 US20060276157A1 (en) | 2005-06-03 | 2005-06-03 | Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications |
| PCT/US2006/021770 WO2006133108A2 (en) | 2005-06-03 | 2006-06-05 | Packaging antennas with integrated circuit chips |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008543092A JP2008543092A (ja) | 2008-11-27 |
| JP2008543092A5 true JP2008543092A5 (enExample) | 2009-03-05 |
Family
ID=37494775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008514962A Pending JP2008543092A (ja) | 2005-06-03 | 2006-06-05 | ミリメートル波アプリケーションのためのアンテナを集積回路チップと共にパッケージングするための装置及び方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20060276157A1 (enExample) |
| EP (1) | EP1886412A4 (enExample) |
| JP (1) | JP2008543092A (enExample) |
| CN (1) | CN101496298A (enExample) |
| TW (1) | TW200735320A (enExample) |
| WO (1) | WO2006133108A2 (enExample) |
Families Citing this family (67)
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| US8878346B2 (en) * | 2006-04-28 | 2014-11-04 | Sandisk Technologies Inc. | Molded SiP package with reinforced solder columns |
| US9103902B2 (en) * | 2007-05-09 | 2015-08-11 | Infineon Technologies Ag | Packaged antenna and method for producing same |
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| US20090066581A1 (en) * | 2006-12-29 | 2009-03-12 | Broadcom Corporation | Ic having in-trace antenna elements |
| US8106489B1 (en) * | 2007-05-25 | 2012-01-31 | Cypress Semiconductor Corporation | Integrated circuit package and packaging method |
| US20080308933A1 (en) * | 2007-06-14 | 2008-12-18 | Lionel Chien Hui Tay | Integrated circuit package system with different connection structures |
| US7696062B2 (en) | 2007-07-25 | 2010-04-13 | Northrop Grumman Systems Corporation | Method of batch integration of low dielectric substrates with MMICs |
| WO2009063387A2 (en) * | 2007-11-13 | 2009-05-22 | Koninklijke Philips Electronics N.V. | Wireless communication module comprising an integrated antenna |
| US8509709B2 (en) * | 2008-08-07 | 2013-08-13 | Wilocity, Ltd. | Consumer electronic device having a distributed form factor millimeter wave receiver and transmitter |
| CN101728369B (zh) * | 2008-10-28 | 2014-05-07 | 赛伊公司 | 表面可安装的集成电路封装方法 |
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| US8256685B2 (en) * | 2009-06-30 | 2012-09-04 | International Business Machines Corporation | Compact millimeter wave packages with integrated antennas |
| US9368873B2 (en) * | 2010-05-12 | 2016-06-14 | Qualcomm Incorporated | Triple-band antenna and method of manufacture |
| US8451618B2 (en) * | 2010-10-28 | 2013-05-28 | Infineon Technologies Ag | Integrated antennas in wafer level package |
| KR101582395B1 (ko) | 2011-03-24 | 2016-01-11 | 키사, 아이엔씨. | 전자기 통신의 집적회로 |
| US8811526B2 (en) | 2011-05-31 | 2014-08-19 | Keyssa, Inc. | Delta modulated low power EHF communication link |
| WO2012174350A1 (en) | 2011-06-15 | 2012-12-20 | Waveconnex, Inc. | Proximity sensing and distance measurement using ehf signals |
| JP5793995B2 (ja) * | 2011-06-28 | 2015-10-14 | トヨタ自動車株式会社 | リードフレーム、及び、パワーモジュール |
| KR101208241B1 (ko) * | 2011-07-12 | 2012-12-04 | 삼성전기주식회사 | 반도체 패키지 |
| US9905922B2 (en) * | 2011-08-31 | 2018-02-27 | Qualcomm Incorporated | Wireless device with 3-D antenna system |
| TWI633766B (zh) | 2011-10-21 | 2018-08-21 | 奇沙公司 | 用於非接觸的訊號編接的裝置和系統 |
| US8648454B2 (en) | 2012-02-14 | 2014-02-11 | International Business Machines Corporation | Wafer-scale package structures with integrated antennas |
| CN104272284B (zh) | 2012-03-02 | 2017-09-08 | 凯萨股份有限公司 | 双工通信系统和方法 |
| JP6013041B2 (ja) | 2012-06-27 | 2016-10-25 | ローム株式会社 | 無線モジュール |
| EP2883271B1 (en) | 2012-08-10 | 2020-07-22 | Keyssa, Inc. | Dielectric coupling systems for ehf communications |
| US9577314B2 (en) | 2012-09-12 | 2017-02-21 | International Business Machines Corporation | Hybrid on-chip and package antenna |
| KR20150055030A (ko) | 2012-09-14 | 2015-05-20 | 키사, 아이엔씨. | 가상 히스테리시스를 이용한 무선 연결 |
| KR20150098645A (ko) | 2012-12-17 | 2015-08-28 | 키사, 아이엔씨. | 모듈식 전자장치 |
| EP2974504B1 (en) | 2013-03-15 | 2018-06-20 | Keyssa, Inc. | Ehf secure communication device |
| TWI551093B (zh) | 2013-03-15 | 2016-09-21 | 奇沙公司 | 極高頻通訊晶片 |
| JP6129657B2 (ja) * | 2013-06-20 | 2017-05-17 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US9910145B2 (en) * | 2013-12-19 | 2018-03-06 | Infineon Technologies Ag | Wireless communication system, a radar system and a method for determining a position information of an object |
| US9472859B2 (en) | 2014-05-20 | 2016-10-18 | International Business Machines Corporation | Integration of area efficient antennas for phased array or wafer scale array antenna applications |
| US9620464B2 (en) | 2014-08-13 | 2017-04-11 | International Business Machines Corporation | Wireless communications package with integrated antennas and air cavity |
| CN104218014A (zh) * | 2014-09-30 | 2014-12-17 | 深圳市景邦电子有限公司 | 一种无线控制芯片以及相应的无线设备 |
| US10083923B2 (en) * | 2015-09-21 | 2018-09-25 | Intel Corporation | Platform with thermally stable wireless interconnects |
| WO2017052660A1 (en) * | 2015-09-25 | 2017-03-30 | Intel Corporation | Antennas for platform level wireless interconnects |
| US9966652B2 (en) * | 2015-11-03 | 2018-05-08 | Amkor Technology, Inc. | Packaged electronic device having integrated antenna and locking structure |
| US10410981B2 (en) | 2015-12-31 | 2019-09-10 | International Business Machines Corporation | Effective medium semiconductor cavities for RF applications |
| US10418687B2 (en) | 2016-07-22 | 2019-09-17 | Apple Inc. | Electronic device with millimeter wave antennas on printed circuits |
| US10594019B2 (en) | 2016-12-03 | 2020-03-17 | International Business Machines Corporation | Wireless communications package with integrated antenna array |
| US10593634B2 (en) * | 2016-12-30 | 2020-03-17 | Analog Devices, Inc. | Packaged devices with integrated antennas |
| US10700410B2 (en) * | 2017-10-27 | 2020-06-30 | Mediatek Inc. | Antenna-in-package with better antenna performance |
| CN108550570B (zh) * | 2018-04-25 | 2020-04-03 | 成都聚利中宇科技有限公司 | 集成垂直辐射天线的高频集成电路模块及其封装方法 |
| CN108550571B (zh) * | 2018-04-25 | 2021-03-05 | 成都聚利中宇科技有限公司 | 集成端射天线的高频集成电路模块及其封装方法 |
| CN109066053B (zh) * | 2018-07-12 | 2019-05-31 | 东南大学 | 一种高增益低副瓣的毫米波封装天线 |
| US11936124B2 (en) * | 2018-08-02 | 2024-03-19 | Viasat, Inc. | Antenna element module |
| CN109888454B (zh) * | 2018-12-29 | 2021-06-11 | 瑞声精密制造科技(常州)有限公司 | 一种封装天线模组及电子设备 |
| CN109786932B (zh) * | 2019-01-29 | 2021-08-13 | 上海安费诺永亿通讯电子有限公司 | 一种封装天线、通信设备及封装天线的制备方法 |
| CN113302801A (zh) * | 2019-05-30 | 2021-08-24 | 华为技术有限公司 | 封装结构、网络设备以及终端设备 |
| CN110137158B (zh) * | 2019-06-04 | 2024-07-19 | 广东气派科技有限公司 | 一种封装模块天线的封装方法及封装结构 |
| KR102753894B1 (ko) | 2019-09-06 | 2025-01-14 | 삼성전자주식회사 | 무선 통신 보드 및 이를 구비한 전자기기 |
| JP2021197568A (ja) * | 2020-06-09 | 2021-12-27 | 株式会社村田製作所 | 高周波モジュール及び通信装置 |
| JP2021197611A (ja) * | 2020-06-12 | 2021-12-27 | 株式会社村田製作所 | 高周波モジュール及び通信装置 |
| CN113013567A (zh) | 2021-01-29 | 2021-06-22 | 中国电子科技集团公司第三十八研究所 | 基于siw多馈网络的芯片-封装-天线一体化结构 |
| US12046798B2 (en) | 2021-07-14 | 2024-07-23 | Amkor Technology Singapore Holding Pte. Ltd. | Semiconductor devices and methods of manufacturing semiconductor devices |
| CN115295509B (zh) * | 2022-08-17 | 2025-05-30 | 甬矽电子(宁波)股份有限公司 | Ic射频封装结构和ic射频封装结构的制备方法 |
| CN117995788B (zh) * | 2024-04-03 | 2024-06-28 | 德氪微电子(深圳)有限公司 | 用于开关功率转换器的毫米波芯片集成封装结构 |
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| JPS59190717A (ja) * | 1983-04-13 | 1984-10-29 | Omron Tateisi Electronics Co | 近接スイツチ |
| JPS607760A (ja) * | 1983-06-28 | 1985-01-16 | Toshiba Corp | Icカ−ドの製造方法 |
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| US5142698A (en) * | 1988-06-08 | 1992-08-25 | Nec Corporation | Microwave integrated apparatus including antenna pattern for satellite broadcasting receiver |
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| US7119745B2 (en) * | 2004-06-30 | 2006-10-10 | International Business Machines Corporation | Apparatus and method for constructing and packaging printed antenna devices |
| US7295161B2 (en) * | 2004-08-06 | 2007-11-13 | International Business Machines Corporation | Apparatus and methods for constructing antennas using wire bonds as radiating elements |
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-
2005
- 2005-06-03 US US11/144,504 patent/US20060276157A1/en not_active Abandoned
-
2006
- 2006-06-02 TW TW095119699A patent/TW200735320A/zh unknown
- 2006-06-05 CN CNA2006800165667A patent/CN101496298A/zh active Pending
- 2006-06-05 EP EP06760686A patent/EP1886412A4/en not_active Withdrawn
- 2006-06-05 JP JP2008514962A patent/JP2008543092A/ja active Pending
- 2006-06-05 WO PCT/US2006/021770 patent/WO2006133108A2/en not_active Ceased
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