TW200735320A - Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications - Google Patents

Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

Info

Publication number
TW200735320A
TW200735320A TW095119699A TW95119699A TW200735320A TW 200735320 A TW200735320 A TW 200735320A TW 095119699 A TW095119699 A TW 095119699A TW 95119699 A TW95119699 A TW 95119699A TW 200735320 A TW200735320 A TW 200735320A
Authority
TW
Taiwan
Prior art keywords
methods
integrated circuit
millimeter wave
wave applications
circuit chips
Prior art date
Application number
TW095119699A
Other languages
English (en)
Chinese (zh)
Inventor
Zhi-Ning Chen
Duixian Liu
Ullrich R Pfeiffer
Thomas M Zwick
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of TW200735320A publication Critical patent/TW200735320A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H01L2924/30111—Impedance matching

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Support Of Aerials (AREA)
TW095119699A 2005-06-03 2006-06-02 Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications TW200735320A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/144,504 US20060276157A1 (en) 2005-06-03 2005-06-03 Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

Publications (1)

Publication Number Publication Date
TW200735320A true TW200735320A (en) 2007-09-16

Family

ID=37494775

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095119699A TW200735320A (en) 2005-06-03 2006-06-02 Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

Country Status (6)

Country Link
US (1) US20060276157A1 (enExample)
EP (1) EP1886412A4 (enExample)
JP (1) JP2008543092A (enExample)
CN (1) CN101496298A (enExample)
TW (1) TW200735320A (enExample)
WO (1) WO2006133108A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9705202B2 (en) 2009-01-07 2017-07-11 Sony Corporation Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
TWI674656B (zh) * 2017-10-27 2019-10-11 聯發科技股份有限公司 天線封裝和通訊裝置

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US9705202B2 (en) 2009-01-07 2017-07-11 Sony Corporation Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
TWI674656B (zh) * 2017-10-27 2019-10-11 聯發科技股份有限公司 天線封裝和通訊裝置
US10700410B2 (en) 2017-10-27 2020-06-30 Mediatek Inc. Antenna-in-package with better antenna performance
US11050135B2 (en) 2017-10-27 2021-06-29 Mediatek Inc. Antenna-in-package with better antenna performance

Also Published As

Publication number Publication date
JP2008543092A (ja) 2008-11-27
CN101496298A (zh) 2009-07-29
EP1886412A4 (en) 2009-07-08
WO2006133108A3 (en) 2007-11-29
EP1886412A2 (en) 2008-02-13
US20060276157A1 (en) 2006-12-07
WO2006133108A2 (en) 2006-12-14

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