CN102217064A - 毫米波射频天线模块 - Google Patents
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Abstract
一种毫米波射频天线模块(600),包含:具有在其表面上提供的天线(602)的天线衬底(603);和包含无线系统IC的半导体裸片(601),所述裸片安装在天线衬底的表面上并配置为向天线提供信号,其中在天线衬底的表面形成球栅阵列(605),用于将天线模块安装到电路板,所述球栅阵列配置为限定天线和电路板之间的空气介电间隙(606)。
Description
技术领域
本发明涉及用于具有集成天线的毫米系统的封装,并且特别涉及用于毫米波收发器系统的天线。
背景技术
用于毫米波通信、雷达和成像系统的集成电路的封装工艺长期以来一直由使用昂贵的专用技术如低损耗陶瓷和薄膜工艺主导。另外,这样的封装倾向于安装在集成了天线的专用毫米波衬底上。使用专用的封装技术和衬底的重要动机是需要在收发器和在毫米波频率上提供低损耗和低寄生效应的天线之间的良好互连。另一个要求是在有源器件和应用电路板之间提供低热阻和机械可靠性。使用专用的用于天线衬底的低损耗和低介电常数材料的主要动机是,使用这样的材料可实现好的效率和阻抗带宽特性。
出于本发明公开的目的,词语毫米波指覆盖通常的毫米量级波长范围的射频信号,即典型频率范围为30到100GHz(对应于10到3mm的波长)。这种特定的波长范围确定了使用的天线的尺寸,并且因此确定了对于工作在相应的频率范围上的收发器系统可能的特定封装工艺。
毫米波应用目前正进入大众消费市场,导致了对于封装工艺和电路板解决方案的低成本替代方案的强烈驱动。主要的成本下降可以通过将天线与封装相集成来实现,其显著缓和了电路板上的互连需求,因为毫米波互连受限于封装内的收发器和天线之间的连接,而不是通过不同的封装之间的有线连接。然而,已知的封装方法为了集成天线功能,仍然倾向于需要特殊昂贵的封装。
用于无线通信、雷达和成像装备的最通用的天线类型之一是微带天线。这种类型的天线具有外形较小、机械简单、鲁棒且不昂贵的结构,其能用作单一元件辐射体,也能用于构建线性和平面共形天线阵列[1]。对于这样的应用的重要的技术规范包括:i)阻抗带宽,其定义了到天线的可用源功率的传输效率;和ii)增益,其定义了该功率到辐射功率的转换效率和辐射波的方向性。
谐振天线的阻抗带宽是有效天线体积的函数。该体积主要依赖于天线电介质的厚度和介电常数。下面的等式描述了阻抗带宽和有效天线体积之间的一般关系[2]:
其中Qant是最小的天线品质因子,η是天线的效率,k是波数(k=2π/λ)和r是包围天线的最小的球的半径。图1(来自参考文献[3])描述了作为衬底厚度和介电常数的函数的标准正方形贴片天线的阻抗带宽。当衬底厚度增加时,2∶1VSWR带宽增加。图1(也在图2上)的x轴上的量是衬底厚度t与自由空间波长λ的比率,其为相对衬底厚度的无量纲量t/λ。图1中展示的不同曲线描述了对于范围从1.0(对于空气/自由空间)到9.8的不同值的相对介电常数的结果。
天线的增益G由效率和方向性的点积定义,由下面等式给出:
G=η·D (3)
其中η是功率效率,并且D是天线的方向性。方向性主要由辐射体、地平面和衬底(或顶衬)的空间分布和方向确定。微带天线的效率不仅由电介质和传导材料损耗确定,还由能进入衬底的表面波中的功率损失来确定。此波中的能量部分在衬底边缘传输进入自由空间,并且部分消耗在衬底内,该能量通常被认为是损耗能量,因为它对在所需的方向上(典型地垂直于天线平面)的辐射发射没有贡献。图2(也来自参考文献[3])描述了标准正方形贴片天线的表面波效率,其也是衬底厚度和介电常数的函数。此外,由于表面波损耗,介电常数的增加将导致损耗增加。
上述提及的结果描述了随衬底厚度增加的阻抗带宽和随衬底厚度降低的表面波效率之间的清晰的折衷。该结果也指出了带宽和效率二者均能通过降低衬底的介电常数得到提高。
各种技术和装配方法当前对于实现微带天线来说是熟知的,所述微带天线可根据阻抗带宽和效率来优化,例如如参考文献[4]所公开的,在所述参考文献[4]中,在微波频率处具有低介电常数和低损耗的薄片用作贴片天线和地平面之间的电介质。这种类型的结构在图3中图示,在所述图3中贴片天线301通过电介质303与地平面302隔开,在此示例中,电介质303由基于PTFE的合成物材料(被称为RT-Duroid)构成。整个天线封装300通过球栅阵列(BGA)形式的焊料球305连接到下面的衬底或母板304。微波IC 306、307安装在电介质303的下面。这种方法典型地用于这样的天线,其中通常使用如PTFE(聚四氟乙烯)的电介质材料。
图4描述了在参考文献[5]中提出的另一个天线和收发器模块400,在所述模块400中,在天线401和地平面402之间提供了空气间隙。天线401在熔融二氧化硅电介质顶衬403上构图。顶衬403利用顶衬下面的天线401键合在金属框架404上,并使用导电粘合剂电连接到侧向偏移收发器IC 405。天线401因此悬置在顶衬403之下的空气中,并且封装400的金属底座402充当反射地平面。封装400通过连接盘网格阵列连接到下面的衬底(未示出)。
图5描述了在分解的透视图中展示的另一个天线结构,如参考文献[6]中所公开的。在此示例中,通过使用多个寄生谐振器提高天线的带宽,所述寄生谐振器经过多个电介质层εri到εr8耦合到驱动天线贴片501。多个谐振器的使用提高了系统的阶数(极点的数量),并且允许在阻抗带宽和匹配的品质之间取得折衷。这种结构是以添加额外的天线元件的形式或通过将单一天线辐射体与集总电路谐振器相组合谐振器来使用多个谐振器的天线种类的一个示例。
这些利用集成微带天线实现封装内系统(SiP)的已知方法具有一些缺点。
已知观念的通常缺点是,作为对天线和收发器的不同要求的结果,收发器和天线使用不同的衬底。对于收发器的衬底要求典型地包括高密度倒装芯片互连和低热阻。另一方面,对于天线的要求涉及电介质厚度、相关的介电常数和材料损耗。在SiP中使用不同的衬底的缺点是,其导致的互连结构通常十分复杂,由于寄生效应导致了效率和带宽损失。
另外,使用具有低介电常数和低损耗的特定衬底(或顶衬)材料的缺点是,这样的材料通常与主流大规模生产工艺不兼容。基于PTFE的材料,如RT-DuroidTM(εr=2.9,tanδ=0.0012),Ultralam2000TM(εr=2.5,tan δ=0.0022)或挤压成形的泡沫聚苯乙烯(εr≈1.1,tanδ<0.002),由于低产量和对于准确控制和保证介电特性达到高频的要求,基本上比较昂贵。
另外,典型的介电材料的机械和热特性基本上偏离了其它标准薄片材料,例如环氧树脂,这使得材料更不适合如小口距倒装芯片和球栅阵列封装的标准装配方法。
进一步,当前方法的性能仍受所使用的材料的介电常数限制,其典型地显著高于自由空间的介电常数。
发明内容
本发明的目的是解决一个或多个上述提及的问题,并且提供一种新的对于具有集成天线的毫米波系统的低成本封装原理。
根据本发明的第一方面,提供了毫米波射频天线模块,其包含:-天线衬底,具有在其表面上提供的天线;和
-半导体裸片,所述半导体裸片包含无线系统IC,所述半导体裸片被安装在天线衬底的表面上并配置为向天线提供信号,
其中在天线衬底的表面上形成球栅阵列,用于将天线模块安装到电路板,所述球栅阵列配置为限定天线和安装所述模块的下部衬底之间的空气介电间隙。
可以在天线衬底的第一表面上提供天线,并且半导体裸片安装到天线衬底的第二相反表面上。可选的,天线可以提供在天线衬底安装半导体裸片的同一个表面。在其中任一示例中,可以在天线衬底安装半导体裸片的同一个表面上,或在相反的表面上,形成球栅阵列。
无线系统IC(集成电路)包含接收器和/或发射器,即可在毫米波频率处操作,以从天线接收信号或传输信号到天线。
该模块可以用做毫米波通信、雷达和成像系统中的集成电路和天线,或天线阵列的低成本封装。
该模块通过利用空气间隙达到节省空间的效果,所述空气间隙由在基于薄片的封装中的封装和应用电路板之间的球栅阵列产生,作为用于毫米波天线的高品质电介质。通过利用球栅阵列,所述结构也能提供半导体IC上的有源装置和电路板之间的低热阻路径。
球栅阵列的外部部分优选地包围天线,以便鲁棒地支撑在其上提供天线的衬底,并限定天线衬底和电路板上的地平面之间的间隙。球栅阵列的内部部分可以用于将半导体裸片电连接到电路板。球栅阵列的内部部分可以用于经由天线衬底将半导体裸片热连接到电路板。球栅阵列因此能至少担当四个主要功能:i)提供天线模块和下面的电路板衬底之间的鲁棒连接;ii)提供半导体裸片和下面的衬底之间的电连接;iii)提供热路径以将热量从半导体裸片传导出去;和iv)准确限定天线和电路板上的地平面之间的介电间隙。
天线可以包含多个相控阵天线形式的天线,所述多个天线例如具有半个波长的间隔。所述波长可以在大约10mm到3mm的范围内。
优选地,天线衬底的厚度低于天线衬底和地平面之间的介电空气间隙的宽度。通过具有与空气介电间隙相比较薄的天线衬底,可以降低衬底材料对天线性能的影响。更加优选地,天线衬底的厚度最多为空气介电间隙的宽度的一半。特别典型地,天线衬底的厚度为200微米并且空气介电间隙的厚度为500微米,适合工作在60GHz,对应的自由空间波长为5mm。
根据本发明的第二方面,提供一种制造毫米波射频天线模块的方法,所述方法包含如下步骤:
提供在其表面上具有天线的天线衬底;
在天线衬底的表面上安装包含无线系统IC的半导体裸片,所述无线系统IC配置为向天线提供信号;和
在天线衬底的表面上形成球栅阵列,用于将天线模块安装到电路板,所述球栅阵列具有被配置为限定天线和电路板之间的空气间隙的外部部分和被配置为提供电路板和半导体裸片之间的电连接的内部部分。
应当理解的是,上述方法步骤不必要按照所书写的严格顺序执行。例如,可以在在天线衬底上安装半导体裸片之前提供球栅阵列。
附图说明
通过示例,并参照附图,将描述本发明的实施例,其中:
图1描述了作为衬底厚度和介电常数的函数的正方形微带贴片天线的一系列带宽测量结果;
图2描述了作为衬底厚度和介电常数的函数的正方形微带贴片天线的一系列表面波损耗测量结果;
图3是微波衬底上的贴片天线的示意性横截面视图;
图4是在悬置熔融二氧化硅顶衬上的折叠偶极子天线模块的示意性透视图;
图5是具有多个谐振器元件的贴片天线的示意性分解透视图;
图6是在安装在主板上的球栅阵列封装内的集成有源裸片和微带天线的示意性横截面视图;
图7a是图6的集成有源裸片和微带天线的另一个示意性横截面视图;
图7b是图7a的集成有源裸片和微带天线的示意性俯视图;
图8a和8b是作为空气电介质厚度的函数的偶极天线元件的阻抗带宽的示意图;
图9a是偶极元件的辐射效率图;
图9b是偶极元件的方向性图;
图10a、10b和10c是针对4个折叠偶极元件的阵列,作为扫描角的函数的方向性图;
图11是在安装在母板上的球栅阵列封装内的集成有源裸片和微带天线的可选实施例的示意性横截面视图;
图12a是在安装在母板上的球栅阵列封装内的集成有源裸片和微带天线的另一个可选实施例的示意性横截面视图;
图12b是图12a的封装的一部分的俯视图。
具体实施方式
图1到5在上述涉及本发明的背景时已经讨论。
根据本发明的天线模块封装600的实施例在图6所示的示意性横截面中图示。封装600包含有源半导体裸片601和在标准BT(Bismaleimide Triazine)环氧薄片衬底603上形成的微带天线602。裸片601安装在与天线602相同的衬底603上,并且天线衬底603通过包含导电球阵列605的球栅阵列,安装在下面的衬底或母板604上。
图1中描述的天线模块结构的重要特点是使用在母板604上的天线衬底603和地平面607之间的空气介电间隙606。空气间隙606充当用于微带天线602的高品质电介质。这种构造方法将带来多种优势,下文将详细描述。
如图1和2所描述的,由于在阻抗带宽和表面波效率上的改进,空气间隙606(εr=1,tanδ=0)的低介电常数和低损耗对于微带天线是很理想的。
通过使用封装和电路板之间的本来被浪费的间隙的体积,产生的额外的有效天线体积,在无须增加封装面积或高度的情况下,提供了增强的带宽性能。
无须增加天线602的表面积(或孔径),可产生额外的有效天线体积,其可提高元件的方向性,并且从而限制阵列能扫描的角度的范围。根据本发明的实施例,使用天线模块可能的大扫描范围在图10a-c中描述。
天线模块600适合与作为天线衬底的标准薄片材料一起使用。薄介电层和厚空气间隙的组合的介电特性由空气层的特性主导。这显著放松了对天线衬底603的介电常数和介电损耗的要求。
天线模块也适合在标准BGA装配工艺中使用。空气电介质606的厚度由封装的间隙高度(stand-off height)决定,其在高容量装配工艺中是很好控制的参数。
天线模块600的第二重要特点是,可以简化收发器模块601和天线602之间的连接。在天线衬底603的表面上提供的金属迹线可以直接连接到较小的球栅阵列,所述球栅阵列经由焊料球608连接收发器裸片601和天线衬底603。因此优选地在衬底603的安装收发器模块601的相同的表面上提供天线602。这些特征提供了与更复杂的互连结构相比的进一步的优势,包括:i)由于降低了寄生效应,实现了更大的频率带宽和更低的信号损耗;ii)降低了相控阵天线结构的元件之间的耦合,其提升了所需方向上的增益并抑制了干扰方向上的增益;和iii)此结构建模更简单,因此减少了设计时间。
在图6中图示的天线模块实施例的进一步的特征是,在有源裸片601和形成下面的衬底或母板604的电路板的地平面607之间植入了低热阻路径。这可以通过组合安装裸片601到天线衬底的较小的球栅阵列和穿透天线衬底603并且与将天线衬底603和母板604相连的较大的球栅阵列的内部部分热连通的热通孔609来达到。这种特征的组合充当了热沉,因此限制了裸片601的最大器件温度,当应用于功率密集电路如功率放大器和高速数字电路时,最大器件温度特别重要。最大操作温度直接与这些电路的寿命相关,因此任何降低该温度的步骤均能延长模块600的寿命。
天线模块的一项具体应用是用于将收发器芯片与用于毫米波通信、雷达或成像应用的相控阵天线相集成。图7(未按比例)以包含60GHz无线HDMI收发器裸片和具有半波长(λ/2)元件间距的四元件线性相控阵天线的模块的横截面视图(图7a)和俯视图(图7b)的形式,图示了这样的应用的示例。图7a中的横截面视图与图6中描述的天线模块600类似,并且应用了相对应的参考符号。
在标准BT薄片衬底603上形成天线阵列,εr=3.8和tanδ=0.01。利用100μm直径的焊料球608栅格,实现了与收发器IC 601的毫米波互连。500μm直径的焊料球605栅格用于确定天线602和地平面607之间的空气介电间隙,并且也用于收发器IC和母板604之间的低频互连。
如图7a所示,空气介电间隙的厚度710比天线衬底的厚度720大,因此允许空气间隙606的介电特性占主导。空气间隙的厚度710优选地至少为天线衬底的厚度720的两倍。天线衬底的典型厚度为约200μm,空气间隙的厚度可以为约500μm,例如对于工作在60GHz、对应5mm的自由空间波长时,所述空气间隙的厚度介于400到600μm之间。
天线阵列602包含四个天线元件602a-d,所述元件彼此间距半个波长,在此示例中间距2.5mm(λ=5mm,f=60GHz)。天线元件的每一个采取折叠偶极元件的形式,并且具有1.5mm的跨距701。
较大的BGA包含包围天线阵列602的球的外部环702,和连接收发器IC 601的球的内部栅格703,二者均电连接和热连接到母板604。图7b中描述的较小的BGA 704连接收发器IC 601(在图7b中未示出)到天线衬底603。
已经通过执行许多电磁仿真分析了天线阵列的性能。图8a和8b描述了对于标定空气介电间隙厚度为400μm、500μm和600μm的单一折叠偶极元件的阻抗带宽,以研究工艺扩展的效果。图8b上的点m1和m2表示对于500μm的空气间隙当测量VSWR=2时,点m1处于54.5GHz,点m2处于67.9GHz。标定的2∶1VSWR阻抗带宽对于图示的每一个空气间隙的厚度超过15%,因此证明了天线模块的宽带宽性能。
图9a和9b描述了天线模块的单一折叠偶极元件的辐射效率(图9a)和方向性(图9b)的仿真结果。这些结果表明,在表面波中以及在电介质和导体耗散中损耗的功率小于20%,并且证明了空气充当了有效的天线电介质。天线的方向性主要由在天线之下的地平面产生,其充当反射体,以在垂直于地平面和天线衬底的方向上集中发射的射频能量。
图10a到10c描述了图7的天线模块的方向性作为扫描角θ的函数的结果,在所述示例中,选择输入信号的相位,以获得在θ=0°(图10a)、θ=30°(图10b)和θ=60°(图10c)方向上的最大辐射,θ值表示法线与天线衬底的平面的夹角。在这样大范围上的扫描的可能性与在天线模块中的天线和地平面之间的较大距离有关。图11图示了天线模块1100的可选实施例,其中天线阵列602提供在天线衬底与安装半导体裸片601相反的表面上。裸片601和天线阵列602之间的互连依靠过孔连接1110实现。模块1100其余的特征与上述描述的图6中的实施例的特征类似。在天线衬底603的下表面上具有天线阵列602,即,利用天线衬底603作为天线602的顶衬,以降低角度覆盖为代价,提供了提高阵列的每个元件的增益的可能性。这种特定的实施例因此更加适合固定波束应用。
图12a描述了天线模块1200的另一个可选实施例,其中半导体裸片601安装在天线阵列602的相同的表面上,但二者均安装在天线衬底的下表面,并且与球栅阵列605在相同表面。与图11的实施例相比较,裸片601和天线阵列602之间的互连,和裸片和下面的电路板604之间的互连,均可简化,不需要通过天线衬底603的过孔连接。与图11的实施例一致,使用天线衬底603作为天线602的顶衬,以降低角度覆盖的代价,提供了提高阵列的每个元件的增益的可能性。整个模块1200甚至占据比上述图示的实施例更少的空间。因为裸片601连接到天线衬底603的下表面,到电路板604的热连接通过热管布置进行,如图12b中的俯视图所图示。连接到内部球栅阵列1205的热传导热管1206将热从裸片601传导出进入电路板604。在这种布置中,半导体裸片601的高度和较小的球栅阵列608被限制于较大的球栅阵列605所提供的厚度,所述较大的球栅阵列605连接天线衬底603到电路板604,并限定天线602和电路板604上的地平面607之间的空气介电间隙606。
本文所提出的天线模块的其它潜在应用包括其它类型的微带天线或槽辐射体(例如开放偶极天线、贴片天线、背腔槽天线等)的集成,和其它阵列配置(例如矩形阵列、圆形阵列等)的集成。
本文描述的类型的天线模块可以用于针对毫米波通信、雷达和成像系统的集成电路和天线(或天线阵列)的低成本封装。第一示例是在分发高品质流媒体信号或传输超高比特率数据流的60GHz无线系统中使用。第二示例是在自适应导航控制的77GHz汽车雷达系统中使用。第三示例是将该原理用于高于100GHz的基于成像的安全系统中。
由所附权利要求所定义的其它实施例也在本发明的范畴之内。
参考文献
[1]Constantine A.Balanis,″Antenna Theory 3nd ed,″,ISBN-O-471-66782-X,pp.811-812.
[2]L.J.Chu,″Physical limitations of omni-directional antennas″,J.Applied Physics,vol.19,pp.1163-1175,1948.
[3]D.R.Jackson and N.G.Alexopoulas,Simple approximate formulas for input resistance,bandwidth and efficiency of a resonant rectangular patch,IEEE Transactions on Antennas and Propagation,vol.39,no.3,March 1991,pp407-410.
[4]Khandelwal N.and Jackson R.W.,″An X-band System-in-Package Active Antenna Module″,0-7803-8846-1/05/$20.00(C)2005IEEE.
[5]Pfeiffer U.R.et al,″A Chip-Scale Packaging Technology for 60GHz Wireless Chipsets″,IEEE Transactions on Microwave Theory and Techniques,vol.54,no.8,August 2006,pp.3387-3395.
[6]Waterhouse R.B.,″Microstrip Patch Antennas,A Designers Guide″,Kluwer Academic,Boston 2003.par.3.6.
Claims (17)
1.一种毫米波射频天线模块,包含:
-天线衬底,具有在其表面上提供的天线;和
-半导体裸片,所述半导体裸片包含无线系统IC,所述半导体裸片被安装在天线衬底的表面上并配置为向天线提供信号,
其中在天线衬底的表面上形成球栅阵列,用于将天线模块安装到电路板,所述球栅阵列配置为限定天线和电路板之间的空气介电间隙。
2.根据权利要求1所述的天线模块,其中在天线衬底的第一表面上提供天线,并且将半导体裸片安装到天线衬底的第二相反表面上。
3.根据权利要求1所述的天线模块,其中在天线衬底的安装半导体裸片的同一个表面上提供天线。
4.根据权利要求2或权利要求3所述的天线模块,其中在天线衬底的安装半导体裸片的同一个表面上形成球栅阵列。
5.根据前述任何一项权利要求所述的天线模块,其中球栅阵列的外部部分包围天线。
6.根据前述任何一项权利要求所述的天线模块,其中球栅阵列的内部部分配置为将半导体裸片电连接到电路板。
7.根据权利要求2或权利要求3所述的天线模块,其中球栅阵列的内部部分配置为经由天线衬底将半导体裸片热连接到电路板。
8.根据前述任何一项权利要求所述的天线模块,其中天线包含在天线衬底上横向间隔开的多个天线元件,以提供相控天线阵列。
9.根据权利要求8所述的天线模块,其中多个天线元件以半个波长的间距被间隔开。
10.根据权利要求9所述的天线模块,其中波长在约10mm到3mm的范围内。
11.根据前述任何一项权利要求所述的天线模块,其中天线衬底具有比由球栅阵列限定的空气间隙更薄的厚度。
12.根据权利要求11所述的天线模块,其中天线衬底的厚度小于空气间隙的厚度的一半。
13.根据权利要求12所述的天线模块,其中空气间隙约为500μm。
14.根据权利要求12或权利要求13所述的天线模块,其中天线衬底的厚度约为200μm。
15.根据前述任何一项权利要求所述的天线模块,其中天线衬底通过球栅阵列安装到电路板上,以限定天线和电路板上的地平面之间的空气介电间隙。
16.一种制造毫米波射频天线模块的方法,所述方法包含如下步骤:
提供在其表面上具有天线的天线衬底;
在天线衬底的表面上安装包含无线系统IC的半导体裸片,所述无线系统IC配置为向天线提供信号;和
在天线衬底的表面上形成球栅阵列,用于将天线模块安装到电路板,所述球栅阵列具有被配置为限定天线和电路板之间的空气间隙的外部部分和被配置为提供电路板和半导体裸片之间的电连接的内部部分。
17.根据权利要求16所述的方法,包含:将天线衬底安装到电路板上,从而通过天线衬底的第二表面和电路板上的地平面之间的球栅阵列的厚度来限定空气间隙。
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Application Number | Priority Date | Filing Date | Title |
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EP08105825.7 | 2008-11-19 | ||
EP08105825 | 2008-11-19 | ||
PCT/IB2009/055084 WO2010058337A1 (en) | 2008-11-19 | 2009-11-16 | Millimetre-wave radio antenna module |
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CN109888473B (zh) * | 2019-01-30 | 2020-11-24 | 东南大学 | 一种与芯片键合的宽带贴片天线 |
CN112993525A (zh) * | 2021-02-03 | 2021-06-18 | 维沃移动通信有限公司 | 显示装置及电子设备 |
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US20110285606A1 (en) | 2011-11-24 |
US8854277B2 (en) | 2014-10-07 |
EP2347440A1 (en) | 2011-07-27 |
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