CN101496298A - 用于封装天线和用于毫米波应用的集成电路芯片的装置和方法 - Google Patents

用于封装天线和用于毫米波应用的集成电路芯片的装置和方法 Download PDF

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Publication number
CN101496298A
CN101496298A CNA2006800165667A CN200680016566A CN101496298A CN 101496298 A CN101496298 A CN 101496298A CN A2006800165667 A CNA2006800165667 A CN A2006800165667A CN 200680016566 A CN200680016566 A CN 200680016566A CN 101496298 A CN101496298 A CN 101496298A
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China
Prior art keywords
antenna
chip
package
frame
packaging frame
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Pending
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CNA2006800165667A
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English (en)
Chinese (zh)
Inventor
陈志宁
刘兑现
U·R·普法伊费尔
T·M·兹维克
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International Business Machines Corp
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International Business Machines Corp
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Publication of CN101496298A publication Critical patent/CN101496298A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H01L2924/30111—Impedance matching

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Support Of Aerials (AREA)
CNA2006800165667A 2005-06-03 2006-06-05 用于封装天线和用于毫米波应用的集成电路芯片的装置和方法 Pending CN101496298A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/144,504 US20060276157A1 (en) 2005-06-03 2005-06-03 Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
US11/144,504 2005-06-03

Publications (1)

Publication Number Publication Date
CN101496298A true CN101496298A (zh) 2009-07-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006800165667A Pending CN101496298A (zh) 2005-06-03 2006-06-05 用于封装天线和用于毫米波应用的集成电路芯片的装置和方法

Country Status (6)

Country Link
US (1) US20060276157A1 (enExample)
EP (1) EP1886412A4 (enExample)
JP (1) JP2008543092A (enExample)
CN (1) CN101496298A (enExample)
TW (1) TW200735320A (enExample)
WO (1) WO2006133108A2 (enExample)

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CN102881986A (zh) * 2011-07-12 2013-01-16 三星电机株式会社 半导体封装
CN103563166A (zh) * 2011-03-24 2014-02-05 韦弗科奈公司 具有电磁通信的集成电路
CN103620768A (zh) * 2011-06-28 2014-03-05 丰田自动车株式会社 引线框架及功率组件
CN103765674A (zh) * 2011-08-31 2014-04-30 高通股份有限公司 具有3-d天线系统的无线设备
CN104218014A (zh) * 2014-09-30 2014-12-17 深圳市景邦电子有限公司 一种无线控制芯片以及相应的无线设备
CN104730516A (zh) * 2013-12-19 2015-06-24 英飞凌科技股份有限公司 无线通信系统、雷达系统和用于确定物体位置信息的方法
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US9515365B2 (en) 2012-08-10 2016-12-06 Keyssa, Inc. Dielectric coupling systems for EHF communications
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US9553616B2 (en) 2013-03-15 2017-01-24 Keyssa, Inc. Extremely high frequency communication chip
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CN107924914A (zh) * 2015-09-21 2018-04-17 英特尔公司 具有热稳定无线互连的平台
CN108269790A (zh) * 2016-12-30 2018-07-10 美国亚德诺半导体公司 具有集成天线的封装的装置
CN108370083A (zh) * 2015-09-25 2018-08-03 英特尔公司 用于平台级无线互连的天线
CN108550570A (zh) * 2018-04-25 2018-09-18 成都聚利中宇科技有限公司 集成垂直辐射天线的高频集成电路模块及其封装方法
CN108550571A (zh) * 2018-04-25 2018-09-18 成都聚利中宇科技有限公司 集成端射天线的高频集成电路模块及其封装方法
CN109066053A (zh) * 2018-07-12 2018-12-21 东南大学 一种高增益低副瓣的毫米波封装天线
CN109786932A (zh) * 2019-01-29 2019-05-21 上海安费诺永亿通讯电子有限公司 一种封装天线、通信设备及封装天线的制备方法
CN109888454A (zh) * 2018-12-29 2019-06-14 瑞声精密制造科技(常州)有限公司 一种封装天线模组及电子设备
CN110137158A (zh) * 2019-06-04 2019-08-16 广东气派科技有限公司 一种封装模块天线的封装方法及封装结构
CN112534646A (zh) * 2018-08-02 2021-03-19 维尔塞特公司 天线元件模块
CN113302801A (zh) * 2019-05-30 2021-08-24 华为技术有限公司 封装结构、网络设备以及终端设备
CN115295509A (zh) * 2022-08-17 2022-11-04 甬矽电子(宁波)股份有限公司 Ic射频封装结构和ic射频封装结构的制备方法
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