JP6013041B2 - 無線モジュール - Google Patents
無線モジュール Download PDFInfo
- Publication number
- JP6013041B2 JP6013041B2 JP2012144093A JP2012144093A JP6013041B2 JP 6013041 B2 JP6013041 B2 JP 6013041B2 JP 2012144093 A JP2012144093 A JP 2012144093A JP 2012144093 A JP2012144093 A JP 2012144093A JP 6013041 B2 JP6013041 B2 JP 6013041B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wireless module
- antenna
- wireless
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 68
- 230000005540 biological transmission Effects 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 3
- 238000004891 communication Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000000843 powder Substances 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Transceivers (AREA)
Description
200 基板
200a 第1面
200b 第2面
201 第1領域
202 第2領域
211 第1辺
212 第2辺
213 第3辺
214 第4辺
220 コネクタ
230 ケース
300 無線ICチップ
410 アンテナ(送受信手段、第1アンテナ)
420 アンテナ(送受信手段、第2アンテナ)
430 アンテナ(送受信手段、第3アンテナ)
440 アンテナ(送受信手段、第4アンテナ)
500 電子素子
600 端子
700 樹脂コーティング
Claims (5)
- 送受信信号を処理する無線ICチップと、
上記無線ICチップが搭載された基板と、
少なくとも一部が上記基板に設けられた送受信手段と、
上記基板から当該基板の面内方向に延びる複数の端子と、
を備え、
上記基板の外縁は、当該基板の厚み方向である第1方向と直角な第2方向に沿う第1辺と、上記第1および第2方向のいずれにも直角である第3方向において上記第1辺と離間し、かつ上記第1辺と平行な第2辺と、を有し、
上記複数の端子は、上記第1辺に沿って並び、かつ、各々が、上記第1辺から上記第3方向の一方側に延びており、
上記送受信手段は、上記複数の端子と同じ材料を用いて構成され、上記基板の上記第1辺から上記第3方向の一方側に向かって突出する第3アンテナと、上記複数の端子と同じ材料を用いて構成され、上記第2辺から上記第3方向の他方側に向かって突出する第4アンテナと、を含み、
上記第4アンテナ全体および上記基板を覆う樹脂コーティングを備え、
上記第3アンテナは、中間部から先端部にかけて上記第1方向に沿うように屈曲していることを特徴とする、無線モジュール。 - 上記第4アンテナは、上記第3方向視において上記第3アンテナと重なる位置に設けられる、請求項1に記載の無線モジュール。
- 上記各端子は、中間部から先端部にかけて上記第1方向に沿うように屈曲する、請求項1または2に記載の無線モジュール。
- 上記無線ICチップを覆うケースを備える、請求項1ないし3のいずれかに記載の無線モジュール。
- 上記基板に設けられ、送受信信号の伝送経路を介して上記無線ICチップと接続されたコネクタを備える、請求項1ないし4のいずれかに記載の無線モジュール。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012144093A JP6013041B2 (ja) | 2012-06-27 | 2012-06-27 | 無線モジュール |
US13/927,736 US9129941B2 (en) | 2012-06-27 | 2013-06-26 | Wireless module with plural in-plane terminals |
US14/820,017 US9893420B2 (en) | 2012-06-27 | 2015-08-06 | Wireless module with plural in-plane terminals |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012144093A JP6013041B2 (ja) | 2012-06-27 | 2012-06-27 | 無線モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014007711A JP2014007711A (ja) | 2014-01-16 |
JP6013041B2 true JP6013041B2 (ja) | 2016-10-25 |
Family
ID=49777246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012144093A Expired - Fee Related JP6013041B2 (ja) | 2012-06-27 | 2012-06-27 | 無線モジュール |
Country Status (2)
Country | Link |
---|---|
US (2) | US9129941B2 (ja) |
JP (1) | JP6013041B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101850507B1 (ko) * | 2017-02-17 | 2018-04-19 | 선문대학교 산학협력단 | 어깨 위팔 치료용 운동장치 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017104320A1 (ja) * | 2015-12-16 | 2017-06-22 | ソニー株式会社 | 画像表示装置 |
US9887497B1 (en) * | 2016-06-10 | 2018-02-06 | Amazon Technologies, Inc. | Device connector with reduced electromagnetic noise |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5786626A (en) | 1996-03-25 | 1998-07-28 | Ibm Corporation | Thin radio frequency transponder with leadframe antenna structure |
JP2001196824A (ja) * | 2000-01-17 | 2001-07-19 | Hideo Suyama | 送受信モジュールのアンテナ装置 |
FR2808164B1 (fr) | 2000-04-21 | 2002-06-07 | Wavecom Sa | Procede de blindage d'au moins la partie superieure d'un module de radiocommunication, et module de radiocommunication correspondant |
JP2001352587A (ja) * | 2000-06-07 | 2001-12-21 | Omron Corp | 無線通信機 |
JP3736387B2 (ja) * | 2001-05-25 | 2006-01-18 | 株式会社村田製作所 | 複合電子部品及びその製造方法 |
JP2003179515A (ja) * | 2002-08-30 | 2003-06-27 | Toshiba Corp | 携帯無線機 |
US6849936B1 (en) * | 2002-09-25 | 2005-02-01 | Lsi Logic Corporation | System and method for using film deposition techniques to provide an antenna within an integrated circuit package |
JP2005294885A (ja) | 2004-03-31 | 2005-10-20 | Eudyna Devices Inc | 無線モジュール |
JP4337645B2 (ja) | 2004-06-17 | 2009-09-30 | セイコーエプソン株式会社 | Icタグモジュール、電子機器、情報通信システムおよびicタグモジュールの通信制御方法 |
DE112005002889B4 (de) * | 2004-12-14 | 2015-07-23 | Seoul Viosys Co., Ltd. | Licht emittierendes Bauelement mit einer Mehrzahl Licht emittierender Zellen und Baugruppen-Montage desselben |
US20060276157A1 (en) * | 2005-06-03 | 2006-12-07 | Chen Zhi N | Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications |
US7518221B2 (en) * | 2006-01-26 | 2009-04-14 | International Business Machines Corporation | Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires |
US7893878B2 (en) * | 2006-12-29 | 2011-02-22 | Broadcom Corporation | Integrated circuit antenna structure |
FR2899388B1 (fr) | 2006-03-28 | 2008-12-05 | Saint Gobain | Substrat muni d'un element electroconducteur a fonction d'antenne |
US9166644B2 (en) * | 2010-02-01 | 2015-10-20 | Broadcom Corporation | Transceiver and antenna assembly |
JP5123362B2 (ja) * | 2010-09-13 | 2013-01-23 | ヤマハ発動機株式会社 | スマートキーシステムを備えた鞍乗型車両 |
EP2680305A3 (en) * | 2012-06-29 | 2014-02-26 | Samsung Electro-Mechanics Co., Ltd | Semiconductor package |
-
2012
- 2012-06-27 JP JP2012144093A patent/JP6013041B2/ja not_active Expired - Fee Related
-
2013
- 2013-06-26 US US13/927,736 patent/US9129941B2/en active Active
-
2015
- 2015-08-06 US US14/820,017 patent/US9893420B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101850507B1 (ko) * | 2017-02-17 | 2018-04-19 | 선문대학교 산학협력단 | 어깨 위팔 치료용 운동장치 |
Also Published As
Publication number | Publication date |
---|---|
JP2014007711A (ja) | 2014-01-16 |
US20150349416A1 (en) | 2015-12-03 |
US9129941B2 (en) | 2015-09-08 |
US20140001610A1 (en) | 2014-01-02 |
US9893420B2 (en) | 2018-02-13 |
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