FR2808164B1 - Procede de blindage d'au moins la partie superieure d'un module de radiocommunication, et module de radiocommunication correspondant - Google Patents
Procede de blindage d'au moins la partie superieure d'un module de radiocommunication, et module de radiocommunication correspondantInfo
- Publication number
- FR2808164B1 FR2808164B1 FR0005210A FR0005210A FR2808164B1 FR 2808164 B1 FR2808164 B1 FR 2808164B1 FR 0005210 A FR0005210 A FR 0005210A FR 0005210 A FR0005210 A FR 0005210A FR 2808164 B1 FR2808164 B1 FR 2808164B1
- Authority
- FR
- France
- Prior art keywords
- radiocommunication module
- shielding
- module
- radiocommunication
- corresponding radiocommunication
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249962—Void-containing component has a continuous matrix of fibers only [e.g., porous paper, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Casings For Electric Apparatus (AREA)
- Transceivers (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0005210A FR2808164B1 (fr) | 2000-04-21 | 2000-04-21 | Procede de blindage d'au moins la partie superieure d'un module de radiocommunication, et module de radiocommunication correspondant |
AU2001254889A AU2001254889A1 (en) | 2000-04-21 | 2001-04-19 | Method for shielding at least the upper part of a radiocommunication module, andcorresponding radiocommunication module |
PCT/FR2001/001215 WO2001082671A1 (fr) | 2000-04-21 | 2001-04-19 | Procede de blindage d'au moins la partie superieure d'un module de radiocommunication, et module de radiocommunication correspondant |
JP2001578170A JP2003531556A (ja) | 2000-04-21 | 2001-04-19 | 無線通信モジュールの少なくとも上面を遮蔽する方法及び対応する無線通信モジュール |
EP01928014A EP1275281A1 (fr) | 2000-04-21 | 2001-04-19 | Procede de blindage d'au moins la partie superieure d'un module de radiocommunication, et module de radiocommunication correspondant |
US10/257,895 US20040053034A1 (en) | 2000-04-21 | 2001-04-19 | Method for shielding at least the upper part of a radiocommunication module, and corresponding radiocommunication module |
CN01809579A CN1429470A (zh) | 2000-04-21 | 2001-04-19 | 至少对无线通信组件的上部进行屏蔽的方法,及相应的无线通信组件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0005210A FR2808164B1 (fr) | 2000-04-21 | 2000-04-21 | Procede de blindage d'au moins la partie superieure d'un module de radiocommunication, et module de radiocommunication correspondant |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2808164A1 FR2808164A1 (fr) | 2001-10-26 |
FR2808164B1 true FR2808164B1 (fr) | 2002-06-07 |
Family
ID=8849533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0005210A Expired - Fee Related FR2808164B1 (fr) | 2000-04-21 | 2000-04-21 | Procede de blindage d'au moins la partie superieure d'un module de radiocommunication, et module de radiocommunication correspondant |
Country Status (7)
Country | Link |
---|---|
US (1) | US20040053034A1 (fr) |
EP (1) | EP1275281A1 (fr) |
JP (1) | JP2003531556A (fr) |
CN (1) | CN1429470A (fr) |
AU (1) | AU2001254889A1 (fr) |
FR (1) | FR2808164B1 (fr) |
WO (1) | WO2001082671A1 (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2852190B1 (fr) * | 2003-03-03 | 2005-09-23 | Procede de fabrication d'un composant ou d'un module electronique et composant ou module correspondant | |
JP4070689B2 (ja) * | 2003-08-20 | 2008-04-02 | シャープ株式会社 | 無線通信ユニット |
FR2870429B1 (fr) * | 2004-05-11 | 2006-07-28 | Sagem | Dispositif de blindage pour module electronique radioelectrique |
CN1780178B (zh) * | 2004-11-23 | 2011-05-04 | 简呈豪 | 无线通信屏蔽鉴别方法及系统 |
JP6013041B2 (ja) * | 2012-06-27 | 2016-10-25 | ローム株式会社 | 無線モジュール |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5130600A (en) * | 1989-06-02 | 1992-07-14 | Mitsubishi Petrochemical Co., Ltd. | Acceleration sensor |
US5047283A (en) * | 1989-09-20 | 1991-09-10 | Ppg Industries, Inc. | Electrically conductive article |
JPH06125191A (ja) * | 1992-10-12 | 1994-05-06 | Nippon Chemicon Corp | シールド部品 |
US5736070A (en) * | 1992-10-13 | 1998-04-07 | Tatsuta Electric Wire And Cable Co., Ltd. | Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield |
JPH06275927A (ja) * | 1993-03-19 | 1994-09-30 | Cmk Corp | 磁界・電磁波シールド層を有するプリント配線板とそ の製造方法 |
FI117224B (fi) * | 1994-01-20 | 2006-07-31 | Nec Tokin Corp | Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti |
US5827999A (en) * | 1994-05-26 | 1998-10-27 | Amkor Electronics, Inc. | Homogeneous chip carrier package |
JPH0961456A (ja) * | 1995-08-29 | 1997-03-07 | Murata Mfg Co Ltd | 半導体装置 |
US6665192B2 (en) * | 1997-02-18 | 2003-12-16 | Koninklijke Philips Electronics N.V. | Synthetic resin capping layer on a printed circuit |
US6566596B1 (en) * | 1997-12-29 | 2003-05-20 | Intel Corporation | Magnetic and electric shielding of on-board devices |
JP3013831B2 (ja) * | 1998-01-26 | 2000-02-28 | 日本電気株式会社 | Mmicパッケージ |
JPH11330766A (ja) * | 1998-05-11 | 1999-11-30 | Alps Electric Co Ltd | 電子機器 |
DE19835805A1 (de) * | 1998-08-07 | 2000-02-17 | Roehm Gmbh | Kunststofformkörper aus Gießharzen und anorganischen Füllstoffen mit verbesserten mechanischen und thermischen Eigenschaften und verbesserter Flammfestigkeit |
-
2000
- 2000-04-21 FR FR0005210A patent/FR2808164B1/fr not_active Expired - Fee Related
-
2001
- 2001-04-19 US US10/257,895 patent/US20040053034A1/en not_active Abandoned
- 2001-04-19 WO PCT/FR2001/001215 patent/WO2001082671A1/fr not_active Application Discontinuation
- 2001-04-19 CN CN01809579A patent/CN1429470A/zh active Pending
- 2001-04-19 AU AU2001254889A patent/AU2001254889A1/en not_active Abandoned
- 2001-04-19 JP JP2001578170A patent/JP2003531556A/ja active Pending
- 2001-04-19 EP EP01928014A patent/EP1275281A1/fr not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
CN1429470A (zh) | 2003-07-09 |
US20040053034A1 (en) | 2004-03-18 |
WO2001082671A1 (fr) | 2001-11-01 |
EP1275281A1 (fr) | 2003-01-15 |
JP2003531556A (ja) | 2003-10-21 |
FR2808164A1 (fr) | 2001-10-26 |
AU2001254889A1 (en) | 2001-11-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20091231 |