AU2001254889A1 - Method for shielding at least the upper part of a radiocommunication module, andcorresponding radiocommunication module - Google Patents

Method for shielding at least the upper part of a radiocommunication module, andcorresponding radiocommunication module

Info

Publication number
AU2001254889A1
AU2001254889A1 AU2001254889A AU5488901A AU2001254889A1 AU 2001254889 A1 AU2001254889 A1 AU 2001254889A1 AU 2001254889 A AU2001254889 A AU 2001254889A AU 5488901 A AU5488901 A AU 5488901A AU 2001254889 A1 AU2001254889 A1 AU 2001254889A1
Authority
AU
Australia
Prior art keywords
radiocommunication module
andcorresponding
shielding
radiocommunication
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001254889A
Inventor
Jacky Jouan
Bachir Kordjani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sierra Wireless SA
Original Assignee
Wavecom SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wavecom SA filed Critical Wavecom SA
Publication of AU2001254889A1 publication Critical patent/AU2001254889A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249962—Void-containing component has a continuous matrix of fibers only [e.g., porous paper, etc.]
AU2001254889A 2000-04-21 2001-04-19 Method for shielding at least the upper part of a radiocommunication module, andcorresponding radiocommunication module Abandoned AU2001254889A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0005210A FR2808164B1 (en) 2000-04-21 2000-04-21 METHOD OF SHIELDING AT LEAST THE TOP OF A RADIOCOMMUNICATION MODULE, AND CORRESPONDING RADIOCOMMUNICATION MODULE
FR0005210 2000-04-21
PCT/FR2001/001215 WO2001082671A1 (en) 2000-04-21 2001-04-19 Method for shielding at least the upper part of a radiocommunication module, and corresponding radiocommunication module

Publications (1)

Publication Number Publication Date
AU2001254889A1 true AU2001254889A1 (en) 2001-11-07

Family

ID=8849533

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001254889A Abandoned AU2001254889A1 (en) 2000-04-21 2001-04-19 Method for shielding at least the upper part of a radiocommunication module, andcorresponding radiocommunication module

Country Status (7)

Country Link
US (1) US20040053034A1 (en)
EP (1) EP1275281A1 (en)
JP (1) JP2003531556A (en)
CN (1) CN1429470A (en)
AU (1) AU2001254889A1 (en)
FR (1) FR2808164B1 (en)
WO (1) WO2001082671A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2852190B1 (en) * 2003-03-03 2005-09-23 METHOD FOR MANUFACTURING AN ELECTRONIC COMPONENT OR MODULE AND CORRESPONDING COMPONENT OR MODULE
JP4070689B2 (en) * 2003-08-20 2008-04-02 シャープ株式会社 Wireless communication unit
FR2870429B1 (en) * 2004-05-11 2006-07-28 Sagem SHIELDING DEVICE FOR RADIO ELECTRONIC MODULE
CN1780178B (en) * 2004-11-23 2011-05-04 简呈豪 Wireless telecommunication shielding authentication and authenticating system
JP6013041B2 (en) * 2012-06-27 2016-10-25 ローム株式会社 Wireless module

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130600A (en) * 1989-06-02 1992-07-14 Mitsubishi Petrochemical Co., Ltd. Acceleration sensor
US5047283A (en) * 1989-09-20 1991-09-10 Ppg Industries, Inc. Electrically conductive article
JPH06125191A (en) * 1992-10-12 1994-05-06 Nippon Chemicon Corp Shield part
US5736070A (en) * 1992-10-13 1998-04-07 Tatsuta Electric Wire And Cable Co., Ltd. Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield
JPH06275927A (en) * 1993-03-19 1994-09-30 Cmk Corp Printed wiring board having magnetic field-electromagnetic wave shield layer and manufacture thereof
FI117224B (en) * 1994-01-20 2006-07-31 Nec Tokin Corp Electromagnetic interference suppression piece, applied by electronic device and hybrid integrated circuit element
US5827999A (en) * 1994-05-26 1998-10-27 Amkor Electronics, Inc. Homogeneous chip carrier package
JPH0961456A (en) * 1995-08-29 1997-03-07 Murata Mfg Co Ltd Semiconductor device
US6665192B2 (en) * 1997-02-18 2003-12-16 Koninklijke Philips Electronics N.V. Synthetic resin capping layer on a printed circuit
US6566596B1 (en) * 1997-12-29 2003-05-20 Intel Corporation Magnetic and electric shielding of on-board devices
JP3013831B2 (en) * 1998-01-26 2000-02-28 日本電気株式会社 MMIC package
JPH11330766A (en) * 1998-05-11 1999-11-30 Alps Electric Co Ltd Electronic equipment
DE19835805A1 (en) * 1998-08-07 2000-02-17 Roehm Gmbh Plastic moldings made of casting resins and inorganic fillers with improved mechanical and thermal properties and improved flame resistance

Also Published As

Publication number Publication date
EP1275281A1 (en) 2003-01-15
FR2808164A1 (en) 2001-10-26
JP2003531556A (en) 2003-10-21
WO2001082671A1 (en) 2001-11-01
CN1429470A (en) 2003-07-09
US20040053034A1 (en) 2004-03-18
FR2808164B1 (en) 2002-06-07

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