JP2008540778A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008540778A5 JP2008540778A5 JP2008511437A JP2008511437A JP2008540778A5 JP 2008540778 A5 JP2008540778 A5 JP 2008540778A5 JP 2008511437 A JP2008511437 A JP 2008511437A JP 2008511437 A JP2008511437 A JP 2008511437A JP 2008540778 A5 JP2008540778 A5 JP 2008540778A5
- Authority
- JP
- Japan
- Prior art keywords
- polymer
- conductive filler
- polymer resin
- light
- syrup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229920000642 polymer Polymers 0.000 claims 7
- 239000002952 polymeric resin Substances 0.000 claims 7
- 229920003002 synthetic resin Polymers 0.000 claims 7
- 239000011231 conductive filler Substances 0.000 claims 6
- 239000000203 mixture Substances 0.000 claims 3
- 239000006188 syrup Substances 0.000 claims 3
- 235000020357 syrup Nutrition 0.000 claims 3
- 230000001678 irradiating effect Effects 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000000178 monomer Substances 0.000 claims 2
- 229920001940 conductive polymer Polymers 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050040155A KR100608533B1 (ko) | 2005-05-13 | 2005-05-13 | 전기 전도성이 우수한 고분자 수지 및 그 제조방법 |
| PCT/US2006/018584 WO2006124694A1 (en) | 2005-05-13 | 2006-05-15 | Electrically conductive polymer resin and method for making same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008540778A JP2008540778A (ja) | 2008-11-20 |
| JP2008540778A5 true JP2008540778A5 (enExample) | 2009-07-02 |
Family
ID=36930677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008511437A Withdrawn JP2008540778A (ja) | 2005-05-13 | 2006-05-15 | 導電性ポリマー樹脂とその製造方法 |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US8975004B2 (enExample) |
| EP (1) | EP1880394A1 (enExample) |
| JP (1) | JP2008540778A (enExample) |
| KR (1) | KR100608533B1 (enExample) |
| CN (1) | CN101176169B (enExample) |
| BR (1) | BRPI0609629A2 (enExample) |
| CA (1) | CA2608223A1 (enExample) |
| MX (1) | MX2007013979A (enExample) |
| TW (1) | TWI386952B (enExample) |
| WO (1) | WO2006124694A1 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112006001022T5 (de) * | 2005-04-26 | 2008-04-17 | Shiloh Industries, Inc., Valley City | Schalldämpfendes Material auf Acrylatbasis und Herstellungsverfahren für dasselbe |
| KR100608533B1 (ko) | 2005-05-13 | 2006-08-08 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 전기 전도성이 우수한 고분자 수지 및 그 제조방법 |
| KR20080004021A (ko) * | 2006-07-04 | 2008-01-09 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 양면의 접착력이 서로 다른 전도성 점착 테이프 및 그제조방법 |
| KR101269741B1 (ko) * | 2006-07-04 | 2013-05-30 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 탄성 및 접착성을 갖는 전자기파 차단용 가스켓 |
| US20090104405A1 (en) * | 2007-10-17 | 2009-04-23 | Honeywell International Inc. | Laminated printed wiring board with controlled spurious rf emission capability/characteristics |
| KR20090054198A (ko) * | 2007-11-26 | 2009-05-29 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 점착 시트의 제조방법 및 이에 의한 점착 시트 |
| KR100901526B1 (ko) * | 2007-12-20 | 2009-06-08 | 두성산업 주식회사 | 수평 열전도 시트 및 그 제조 방법 |
| KR100987025B1 (ko) * | 2008-04-22 | 2010-10-11 | 두성산업 주식회사 | 자기접착성을 갖는 도전성 시트 및 이의 제조방법 |
| KR100874689B1 (ko) | 2008-09-08 | 2008-12-18 | 두성산업 주식회사 | 방열, 전자파 차폐, 및 전자파와 충격 흡수 특성이 향상된 롤 타입 복합 시트 및 그 제조 방법 |
| EP2633746B1 (en) * | 2010-10-26 | 2023-07-19 | Henkel AG & Co. KGaA | Composite film for board level emi shielding |
| US8569631B2 (en) * | 2011-05-05 | 2013-10-29 | Tangitek, Llc | Noise dampening energy efficient circuit board and method for constructing and using same |
| DE102012202225B4 (de) * | 2012-02-14 | 2015-10-22 | Te Connectivity Germany Gmbh | Steckergehäuse mit Dichtung |
| KR20140099716A (ko) * | 2013-02-04 | 2014-08-13 | 삼성전자주식회사 | 센서플랫폼 및 그의 제조 방법 |
| US10398377B2 (en) * | 2015-09-04 | 2019-09-03 | Japan Science And Technology Agency | Connector substrate, sensor system, and wearable sensor system |
| TWI738735B (zh) * | 2016-05-27 | 2021-09-11 | 德商漢高智慧財產控股公司 | 藉由毛細流動以於電子封裝中進行間隙塗覆及/或於其中或其間充填的組合物及其使用方法 |
| WO2018092798A1 (ja) * | 2016-11-18 | 2018-05-24 | 矢崎総業株式会社 | 回路体形成方法及び回路体 |
| CN114854365B (zh) | 2017-12-14 | 2023-10-24 | 艾利丹尼森公司 | 具有宽的阻尼温度和频率范围的压敏粘合剂 |
| JP2020019876A (ja) * | 2018-07-31 | 2020-02-06 | 株式会社ダイセル | 成形体およびその製造方法 |
| JP7542008B2 (ja) * | 2019-05-13 | 2024-08-29 | スリーエム イノベイティブ プロパティズ カンパニー | 導電性多層フィルム及びガスケット |
| US20220177633A1 (en) * | 2019-05-29 | 2022-06-09 | Kao Corporation | Thermoplastic resin composition |
| JP2023514988A (ja) | 2020-02-26 | 2023-04-12 | ティコナ・エルエルシー | 電子デバイス用ポリマー組成物 |
| EP4110868A4 (en) * | 2020-02-26 | 2024-03-06 | Ticona LLC | ELECTRONIC DEVICE |
| US20230287248A1 (en) * | 2020-07-29 | 2023-09-14 | 3M Innovative Properties Company | Electrically Conductive Adhesive Film |
Family Cites Families (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4078160A (en) * | 1977-07-05 | 1978-03-07 | Motorola, Inc. | Piezoelectric bimorph or monomorph bender structure |
| JPS5826381B2 (ja) | 1979-04-28 | 1983-06-02 | 信越ポリマ−株式会社 | 電磁気シ−ルドガスケットおよびその製造方法 |
| US4448837A (en) * | 1982-07-19 | 1984-05-15 | Oki Densen Kabushiki Kaisha | Pressure-sensitive conductive elastic sheet |
| US4731282A (en) * | 1983-10-14 | 1988-03-15 | Hitachi Chemical Co., Ltd. | Anisotropic-electroconductive adhesive film |
| US4546037A (en) * | 1984-09-04 | 1985-10-08 | Minnesota Mining And Manufacturing Company | Flexible tape having stripes of electrically conductive particles for making multiple connections |
| US4548862A (en) | 1984-09-04 | 1985-10-22 | Minnesota Mining And Manufacturing Company | Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer |
| US5045249A (en) | 1986-12-04 | 1991-09-03 | At&T Bell Laboratories | Electrical interconnection by a composite medium |
| US4923739A (en) | 1987-07-30 | 1990-05-08 | American Telephone And Telegraph Company | Composite electrical interconnection medium comprising a conductive network, and article, assembly, and method |
| ATE171560T1 (de) * | 1993-03-09 | 1998-10-15 | Koninkl Philips Electronics Nv | Herstellungsverfahren eines musters von einem elektrisch leitfähigen polymer auf einer substratoberfläche und metallisierung eines solchen musters |
| US5443876A (en) * | 1993-12-30 | 1995-08-22 | Minnesota Mining And Manufacturing Company | Electrically conductive structured sheets |
| JPH09816A (ja) | 1995-06-16 | 1997-01-07 | Toshiba Corp | 沈砂掻揚装置 |
| US5851644A (en) * | 1995-08-01 | 1998-12-22 | Loctite (Ireland) Limited | Films and coatings having anisotropic conductive pathways therein |
| JPH10338841A (ja) | 1997-06-06 | 1998-12-22 | Bridgestone Corp | 異方性導電フィルム |
| JP3226889B2 (ja) | 1998-05-06 | 2001-11-05 | シンワ プロダクト カンパニー・リミテッド | 導電性粘着テープ |
| JP2000077891A (ja) | 1998-09-01 | 2000-03-14 | Ge Toshiba Silicones Co Ltd | 可撓性金属層併設シリコーンゴム材料 |
| TW561266B (en) * | 1999-09-17 | 2003-11-11 | Jsr Corp | Anisotropic conductive sheet, its manufacturing method, and connector |
| US6548175B2 (en) * | 2001-01-11 | 2003-04-15 | International Business Machines Corporation | Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof |
| US6591496B2 (en) * | 2001-08-28 | 2003-07-15 | 3M Innovative Properties Company | Method for making embedded electrical traces |
| US6784363B2 (en) * | 2001-10-02 | 2004-08-31 | Parker-Hannifin Corporation | EMI shielding gasket construction |
| CN1640187A (zh) * | 2002-02-28 | 2005-07-13 | 古河电气工业株式会社 | 平面扬声器 |
| KR100463593B1 (ko) | 2002-11-27 | 2004-12-29 | 주식회사 메틱스 | 전자파 흡수체 및 그 제조방법 |
| JP4266310B2 (ja) * | 2003-01-31 | 2009-05-20 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 感光性樹脂組成物および該組成物を用いた樹脂パターンの形成方法 |
| US7625633B2 (en) | 2003-03-25 | 2009-12-01 | Shin-Etsu Polymer., Ltd. | Electromagnetic noise suppressor, article with electromagnetic noise suppressing function, and their manufacturing methods |
| US7034403B2 (en) * | 2003-04-10 | 2006-04-25 | 3M Innovative Properties Company | Durable electronic assembly with conductive adhesive |
| KR100543967B1 (ko) | 2003-05-30 | 2006-01-23 | 조인셋 주식회사 | 격자형 이방 도전성 필름과 그 제조방법 |
| CN100407339C (zh) * | 2003-09-28 | 2008-07-30 | 聚鼎科技股份有限公司 | 导电性聚合物及过电流保护元件 |
| KR100740175B1 (ko) | 2003-11-03 | 2007-07-16 | 주식회사 이송이엠씨 | 전자파 차폐,흡수용 가스켓과 그 제조방법 |
| KR100626436B1 (ko) * | 2003-11-13 | 2006-09-20 | 주식회사 엘지화학 | 난연성이 개선된 점착제 |
| JP4385794B2 (ja) * | 2004-02-26 | 2009-12-16 | ソニーケミカル&インフォメーションデバイス株式会社 | 異方性導電接続方法 |
| JP2005344068A (ja) | 2004-06-07 | 2005-12-15 | Toyo Bussan Kk | 導電性粘着テープ及びその製造方法 |
| US7404997B2 (en) * | 2004-09-02 | 2008-07-29 | 3M Innovative Properties Company | Substrates with multiple images |
| CN102277096A (zh) | 2005-03-04 | 2011-12-14 | 索尼化学&信息部件株式会社 | 各向异性导电性粘结剂及使用了该粘结剂的电极连接方法 |
| KR100608533B1 (ko) | 2005-05-13 | 2006-08-08 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 전기 전도성이 우수한 고분자 수지 및 그 제조방법 |
| JP4686274B2 (ja) * | 2005-06-30 | 2011-05-25 | ポリマテック株式会社 | 放熱部品及びその製造方法 |
| JP2007299907A (ja) * | 2006-04-28 | 2007-11-15 | Nitto Denko Corp | 電磁波を伝導又は吸収する特性を有する構造体 |
| KR20080004021A (ko) * | 2006-07-04 | 2008-01-09 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 양면의 접착력이 서로 다른 전도성 점착 테이프 및 그제조방법 |
| KR101269741B1 (ko) * | 2006-07-04 | 2013-05-30 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 탄성 및 접착성을 갖는 전자기파 차단용 가스켓 |
| KR20090054198A (ko) * | 2007-11-26 | 2009-05-29 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 점착 시트의 제조방법 및 이에 의한 점착 시트 |
| KR20090067964A (ko) | 2007-12-21 | 2009-06-25 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 점착 테이프 및 그 제조방법 |
-
2005
- 2005-05-13 KR KR1020050040155A patent/KR100608533B1/ko not_active Expired - Fee Related
-
2006
- 2006-05-12 TW TW095116908A patent/TWI386952B/zh not_active IP Right Cessation
- 2006-05-15 CN CN2006800165313A patent/CN101176169B/zh not_active Expired - Fee Related
- 2006-05-15 MX MX2007013979A patent/MX2007013979A/es unknown
- 2006-05-15 EP EP06752534A patent/EP1880394A1/en not_active Withdrawn
- 2006-05-15 CA CA002608223A patent/CA2608223A1/en not_active Abandoned
- 2006-05-15 BR BRPI0609629-8A patent/BRPI0609629A2/pt not_active IP Right Cessation
- 2006-05-15 US US11/913,690 patent/US8975004B2/en not_active Expired - Fee Related
- 2006-05-15 WO PCT/US2006/018584 patent/WO2006124694A1/en not_active Ceased
- 2006-05-15 JP JP2008511437A patent/JP2008540778A/ja not_active Withdrawn
-
2015
- 2015-01-29 US US14/608,963 patent/US9336923B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2008540778A5 (enExample) | ||
| JP2011504961A5 (enExample) | ||
| JP2006002061A5 (enExample) | ||
| JP2009132038A5 (enExample) | ||
| JP2018528107A5 (enExample) | ||
| JP2011505436A5 (enExample) | ||
| JP2011503660A5 (enExample) | ||
| TW201041737A (en) | Laminate extruded resin sheet for touch panel and surface-coated plate for touch panel | |
| GB201300311D0 (en) | Composition for photocurable imprint, and method for formation of pattern using the composition | |
| DE602008002357D1 (de) | Tintenzusammensetzung, Tintenstrahlaufzeichnungsverfahren, Drucksachen, Verfahren zur Herstellung einer Flachdruckplatte und Flachdruckplatte | |
| JP2015070212A5 (enExample) | ||
| JP2008298962A5 (enExample) | ||
| WO2008103776A3 (en) | Thermally cured underlayer for lithographic application | |
| WO2011074871A3 (ko) | 편광판, 그 제조방법 및 이를 포함하는 화상 표시 장치 | |
| ATE526156T1 (de) | Bildaufzeichnungsmaterial, flachdruckplattenvorläufer und flachdruckverfahren damit | |
| TW200745749A (en) | Photosensitive resin composition, method for forming resist pattern, method for manufacturing printed wiring board, and method for producing substrate for plasma display panel | |
| EP2050780A3 (en) | Barrier laminate, barrier film substrate, device, and method for producing barrier laminate | |
| JP2010530077A5 (enExample) | ||
| JP2008308762A5 (enExample) | ||
| JP2009262370A5 (enExample) | ||
| JP2007121346A5 (enExample) | ||
| JP2011148906A5 (enExample) | ||
| TW201208861A (en) | Light guide plate and manufacturing method thereof | |
| CN102501668A (zh) | Uv涂层与热固性油墨结合凹版印制热转移膜 | |
| JP2010126816A5 (ja) | 繊維系ボードの製造方法 |