JP2008540778A5 - - Google Patents

Download PDF

Info

Publication number
JP2008540778A5
JP2008540778A5 JP2008511437A JP2008511437A JP2008540778A5 JP 2008540778 A5 JP2008540778 A5 JP 2008540778A5 JP 2008511437 A JP2008511437 A JP 2008511437A JP 2008511437 A JP2008511437 A JP 2008511437A JP 2008540778 A5 JP2008540778 A5 JP 2008540778A5
Authority
JP
Japan
Prior art keywords
polymer
conductive filler
polymer resin
light
syrup
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008511437A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008540778A (ja
Filing date
Publication date
Priority claimed from KR1020050040155A external-priority patent/KR100608533B1/ko
Application filed filed Critical
Publication of JP2008540778A publication Critical patent/JP2008540778A/ja
Publication of JP2008540778A5 publication Critical patent/JP2008540778A5/ja
Withdrawn legal-status Critical Current

Links

JP2008511437A 2005-05-13 2006-05-15 導電性ポリマー樹脂とその製造方法 Withdrawn JP2008540778A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050040155A KR100608533B1 (ko) 2005-05-13 2005-05-13 전기 전도성이 우수한 고분자 수지 및 그 제조방법
PCT/US2006/018584 WO2006124694A1 (en) 2005-05-13 2006-05-15 Electrically conductive polymer resin and method for making same

Publications (2)

Publication Number Publication Date
JP2008540778A JP2008540778A (ja) 2008-11-20
JP2008540778A5 true JP2008540778A5 (enExample) 2009-07-02

Family

ID=36930677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008511437A Withdrawn JP2008540778A (ja) 2005-05-13 2006-05-15 導電性ポリマー樹脂とその製造方法

Country Status (10)

Country Link
US (2) US8975004B2 (enExample)
EP (1) EP1880394A1 (enExample)
JP (1) JP2008540778A (enExample)
KR (1) KR100608533B1 (enExample)
CN (1) CN101176169B (enExample)
BR (1) BRPI0609629A2 (enExample)
CA (1) CA2608223A1 (enExample)
MX (1) MX2007013979A (enExample)
TW (1) TWI386952B (enExample)
WO (1) WO2006124694A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112006001022T5 (de) * 2005-04-26 2008-04-17 Shiloh Industries, Inc., Valley City Schalldämpfendes Material auf Acrylatbasis und Herstellungsverfahren für dasselbe
KR100608533B1 (ko) 2005-05-13 2006-08-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 전기 전도성이 우수한 고분자 수지 및 그 제조방법
KR20080004021A (ko) * 2006-07-04 2008-01-09 쓰리엠 이노베이티브 프로퍼티즈 캄파니 양면의 접착력이 서로 다른 전도성 점착 테이프 및 그제조방법
KR101269741B1 (ko) * 2006-07-04 2013-05-30 쓰리엠 이노베이티브 프로퍼티즈 캄파니 탄성 및 접착성을 갖는 전자기파 차단용 가스켓
US20090104405A1 (en) * 2007-10-17 2009-04-23 Honeywell International Inc. Laminated printed wiring board with controlled spurious rf emission capability/characteristics
KR20090054198A (ko) * 2007-11-26 2009-05-29 쓰리엠 이노베이티브 프로퍼티즈 캄파니 점착 시트의 제조방법 및 이에 의한 점착 시트
KR100901526B1 (ko) * 2007-12-20 2009-06-08 두성산업 주식회사 수평 열전도 시트 및 그 제조 방법
KR100987025B1 (ko) * 2008-04-22 2010-10-11 두성산업 주식회사 자기접착성을 갖는 도전성 시트 및 이의 제조방법
KR100874689B1 (ko) 2008-09-08 2008-12-18 두성산업 주식회사 방열, 전자파 차폐, 및 전자파와 충격 흡수 특성이 향상된 롤 타입 복합 시트 및 그 제조 방법
EP2633746B1 (en) * 2010-10-26 2023-07-19 Henkel AG & Co. KGaA Composite film for board level emi shielding
US8569631B2 (en) * 2011-05-05 2013-10-29 Tangitek, Llc Noise dampening energy efficient circuit board and method for constructing and using same
DE102012202225B4 (de) * 2012-02-14 2015-10-22 Te Connectivity Germany Gmbh Steckergehäuse mit Dichtung
KR20140099716A (ko) * 2013-02-04 2014-08-13 삼성전자주식회사 센서플랫폼 및 그의 제조 방법
US10398377B2 (en) * 2015-09-04 2019-09-03 Japan Science And Technology Agency Connector substrate, sensor system, and wearable sensor system
TWI738735B (zh) * 2016-05-27 2021-09-11 德商漢高智慧財產控股公司 藉由毛細流動以於電子封裝中進行間隙塗覆及/或於其中或其間充填的組合物及其使用方法
WO2018092798A1 (ja) * 2016-11-18 2018-05-24 矢崎総業株式会社 回路体形成方法及び回路体
CN114854365B (zh) 2017-12-14 2023-10-24 艾利丹尼森公司 具有宽的阻尼温度和频率范围的压敏粘合剂
JP2020019876A (ja) * 2018-07-31 2020-02-06 株式会社ダイセル 成形体およびその製造方法
JP7542008B2 (ja) * 2019-05-13 2024-08-29 スリーエム イノベイティブ プロパティズ カンパニー 導電性多層フィルム及びガスケット
US20220177633A1 (en) * 2019-05-29 2022-06-09 Kao Corporation Thermoplastic resin composition
JP2023514988A (ja) 2020-02-26 2023-04-12 ティコナ・エルエルシー 電子デバイス用ポリマー組成物
EP4110868A4 (en) * 2020-02-26 2024-03-06 Ticona LLC ELECTRONIC DEVICE
US20230287248A1 (en) * 2020-07-29 2023-09-14 3M Innovative Properties Company Electrically Conductive Adhesive Film

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4078160A (en) * 1977-07-05 1978-03-07 Motorola, Inc. Piezoelectric bimorph or monomorph bender structure
JPS5826381B2 (ja) 1979-04-28 1983-06-02 信越ポリマ−株式会社 電磁気シ−ルドガスケットおよびその製造方法
US4448837A (en) * 1982-07-19 1984-05-15 Oki Densen Kabushiki Kaisha Pressure-sensitive conductive elastic sheet
US4731282A (en) * 1983-10-14 1988-03-15 Hitachi Chemical Co., Ltd. Anisotropic-electroconductive adhesive film
US4546037A (en) * 1984-09-04 1985-10-08 Minnesota Mining And Manufacturing Company Flexible tape having stripes of electrically conductive particles for making multiple connections
US4548862A (en) 1984-09-04 1985-10-22 Minnesota Mining And Manufacturing Company Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
US5045249A (en) 1986-12-04 1991-09-03 At&T Bell Laboratories Electrical interconnection by a composite medium
US4923739A (en) 1987-07-30 1990-05-08 American Telephone And Telegraph Company Composite electrical interconnection medium comprising a conductive network, and article, assembly, and method
ATE171560T1 (de) * 1993-03-09 1998-10-15 Koninkl Philips Electronics Nv Herstellungsverfahren eines musters von einem elektrisch leitfähigen polymer auf einer substratoberfläche und metallisierung eines solchen musters
US5443876A (en) * 1993-12-30 1995-08-22 Minnesota Mining And Manufacturing Company Electrically conductive structured sheets
JPH09816A (ja) 1995-06-16 1997-01-07 Toshiba Corp 沈砂掻揚装置
US5851644A (en) * 1995-08-01 1998-12-22 Loctite (Ireland) Limited Films and coatings having anisotropic conductive pathways therein
JPH10338841A (ja) 1997-06-06 1998-12-22 Bridgestone Corp 異方性導電フィルム
JP3226889B2 (ja) 1998-05-06 2001-11-05 シンワ プロダクト カンパニー・リミテッド 導電性粘着テープ
JP2000077891A (ja) 1998-09-01 2000-03-14 Ge Toshiba Silicones Co Ltd 可撓性金属層併設シリコーンゴム材料
TW561266B (en) * 1999-09-17 2003-11-11 Jsr Corp Anisotropic conductive sheet, its manufacturing method, and connector
US6548175B2 (en) * 2001-01-11 2003-04-15 International Business Machines Corporation Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
US6591496B2 (en) * 2001-08-28 2003-07-15 3M Innovative Properties Company Method for making embedded electrical traces
US6784363B2 (en) * 2001-10-02 2004-08-31 Parker-Hannifin Corporation EMI shielding gasket construction
CN1640187A (zh) * 2002-02-28 2005-07-13 古河电气工业株式会社 平面扬声器
KR100463593B1 (ko) 2002-11-27 2004-12-29 주식회사 메틱스 전자파 흡수체 및 그 제조방법
JP4266310B2 (ja) * 2003-01-31 2009-05-20 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. 感光性樹脂組成物および該組成物を用いた樹脂パターンの形成方法
US7625633B2 (en) 2003-03-25 2009-12-01 Shin-Etsu Polymer., Ltd. Electromagnetic noise suppressor, article with electromagnetic noise suppressing function, and their manufacturing methods
US7034403B2 (en) * 2003-04-10 2006-04-25 3M Innovative Properties Company Durable electronic assembly with conductive adhesive
KR100543967B1 (ko) 2003-05-30 2006-01-23 조인셋 주식회사 격자형 이방 도전성 필름과 그 제조방법
CN100407339C (zh) * 2003-09-28 2008-07-30 聚鼎科技股份有限公司 导电性聚合物及过电流保护元件
KR100740175B1 (ko) 2003-11-03 2007-07-16 주식회사 이송이엠씨 전자파 차폐,흡수용 가스켓과 그 제조방법
KR100626436B1 (ko) * 2003-11-13 2006-09-20 주식회사 엘지화학 난연성이 개선된 점착제
JP4385794B2 (ja) * 2004-02-26 2009-12-16 ソニーケミカル&インフォメーションデバイス株式会社 異方性導電接続方法
JP2005344068A (ja) 2004-06-07 2005-12-15 Toyo Bussan Kk 導電性粘着テープ及びその製造方法
US7404997B2 (en) * 2004-09-02 2008-07-29 3M Innovative Properties Company Substrates with multiple images
CN102277096A (zh) 2005-03-04 2011-12-14 索尼化学&信息部件株式会社 各向异性导电性粘结剂及使用了该粘结剂的电极连接方法
KR100608533B1 (ko) 2005-05-13 2006-08-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 전기 전도성이 우수한 고분자 수지 및 그 제조방법
JP4686274B2 (ja) * 2005-06-30 2011-05-25 ポリマテック株式会社 放熱部品及びその製造方法
JP2007299907A (ja) * 2006-04-28 2007-11-15 Nitto Denko Corp 電磁波を伝導又は吸収する特性を有する構造体
KR20080004021A (ko) * 2006-07-04 2008-01-09 쓰리엠 이노베이티브 프로퍼티즈 캄파니 양면의 접착력이 서로 다른 전도성 점착 테이프 및 그제조방법
KR101269741B1 (ko) * 2006-07-04 2013-05-30 쓰리엠 이노베이티브 프로퍼티즈 캄파니 탄성 및 접착성을 갖는 전자기파 차단용 가스켓
KR20090054198A (ko) * 2007-11-26 2009-05-29 쓰리엠 이노베이티브 프로퍼티즈 캄파니 점착 시트의 제조방법 및 이에 의한 점착 시트
KR20090067964A (ko) 2007-12-21 2009-06-25 쓰리엠 이노베이티브 프로퍼티즈 캄파니 점착 테이프 및 그 제조방법

Similar Documents

Publication Publication Date Title
JP2008540778A5 (enExample)
JP2011504961A5 (enExample)
JP2006002061A5 (enExample)
JP2009132038A5 (enExample)
JP2018528107A5 (enExample)
JP2011505436A5 (enExample)
JP2011503660A5 (enExample)
TW201041737A (en) Laminate extruded resin sheet for touch panel and surface-coated plate for touch panel
GB201300311D0 (en) Composition for photocurable imprint, and method for formation of pattern using the composition
DE602008002357D1 (de) Tintenzusammensetzung, Tintenstrahlaufzeichnungsverfahren, Drucksachen, Verfahren zur Herstellung einer Flachdruckplatte und Flachdruckplatte
JP2015070212A5 (enExample)
JP2008298962A5 (enExample)
WO2008103776A3 (en) Thermally cured underlayer for lithographic application
WO2011074871A3 (ko) 편광판, 그 제조방법 및 이를 포함하는 화상 표시 장치
ATE526156T1 (de) Bildaufzeichnungsmaterial, flachdruckplattenvorläufer und flachdruckverfahren damit
TW200745749A (en) Photosensitive resin composition, method for forming resist pattern, method for manufacturing printed wiring board, and method for producing substrate for plasma display panel
EP2050780A3 (en) Barrier laminate, barrier film substrate, device, and method for producing barrier laminate
JP2010530077A5 (enExample)
JP2008308762A5 (enExample)
JP2009262370A5 (enExample)
JP2007121346A5 (enExample)
JP2011148906A5 (enExample)
TW201208861A (en) Light guide plate and manufacturing method thereof
CN102501668A (zh) Uv涂层与热固性油墨结合凹版印制热转移膜
JP2010126816A5 (ja) 繊維系ボードの製造方法