CN101176169B - 导电聚合物树脂及其制备方法 - Google Patents

导电聚合物树脂及其制备方法 Download PDF

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Publication number
CN101176169B
CN101176169B CN2006800165313A CN200680016531A CN101176169B CN 101176169 B CN101176169 B CN 101176169B CN 2006800165313 A CN2006800165313 A CN 2006800165313A CN 200680016531 A CN200680016531 A CN 200680016531A CN 101176169 B CN101176169 B CN 101176169B
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polymer
sheet
conductive
polymer resin
filler
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Expired - Fee Related
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English (en)
Chinese (zh)
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CN101176169A (zh
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崔汀完
史彦宁
金元植
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/04—Acids, Metal salts or ammonium salts thereof
    • C08F20/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/40—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
CN2006800165313A 2005-05-13 2006-05-15 导电聚合物树脂及其制备方法 Expired - Fee Related CN101176169B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2005-0040155 2005-05-13
KR1020050040155A KR100608533B1 (ko) 2005-05-13 2005-05-13 전기 전도성이 우수한 고분자 수지 및 그 제조방법
KR1020050040155 2005-05-13
PCT/US2006/018584 WO2006124694A1 (en) 2005-05-13 2006-05-15 Electrically conductive polymer resin and method for making same

Publications (2)

Publication Number Publication Date
CN101176169A CN101176169A (zh) 2008-05-07
CN101176169B true CN101176169B (zh) 2012-07-04

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ID=36930677

Family Applications (1)

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CN2006800165313A Expired - Fee Related CN101176169B (zh) 2005-05-13 2006-05-15 导电聚合物树脂及其制备方法

Country Status (10)

Country Link
US (2) US8975004B2 (enExample)
EP (1) EP1880394A1 (enExample)
JP (1) JP2008540778A (enExample)
KR (1) KR100608533B1 (enExample)
CN (1) CN101176169B (enExample)
BR (1) BRPI0609629A2 (enExample)
CA (1) CA2608223A1 (enExample)
MX (1) MX2007013979A (enExample)
TW (1) TWI386952B (enExample)
WO (1) WO2006124694A1 (enExample)

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WO2006116440A2 (en) * 2005-04-26 2006-11-02 Shiloh Industries, Inc. Acrylate-based sound damping material and method of preparing same
KR100608533B1 (ko) 2005-05-13 2006-08-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 전기 전도성이 우수한 고분자 수지 및 그 제조방법
KR20080004021A (ko) * 2006-07-04 2008-01-09 쓰리엠 이노베이티브 프로퍼티즈 캄파니 양면의 접착력이 서로 다른 전도성 점착 테이프 및 그제조방법
KR101269741B1 (ko) * 2006-07-04 2013-05-30 쓰리엠 이노베이티브 프로퍼티즈 캄파니 탄성 및 접착성을 갖는 전자기파 차단용 가스켓
US20090104405A1 (en) * 2007-10-17 2009-04-23 Honeywell International Inc. Laminated printed wiring board with controlled spurious rf emission capability/characteristics
KR20090054198A (ko) * 2007-11-26 2009-05-29 쓰리엠 이노베이티브 프로퍼티즈 캄파니 점착 시트의 제조방법 및 이에 의한 점착 시트
KR100901526B1 (ko) * 2007-12-20 2009-06-08 두성산업 주식회사 수평 열전도 시트 및 그 제조 방법
KR100987025B1 (ko) * 2008-04-22 2010-10-11 두성산업 주식회사 자기접착성을 갖는 도전성 시트 및 이의 제조방법
KR100874689B1 (ko) 2008-09-08 2008-12-18 두성산업 주식회사 방열, 전자파 차폐, 및 전자파와 충격 흡수 특성이 향상된 롤 타입 복합 시트 및 그 제조 방법
FI2633746T3 (fi) * 2010-10-26 2023-07-24 Henkel Ag & Co Kgaa Piirilevytasoiseen EMI-suojaukseen tarkoitettu komposiittikalvo
US8569631B2 (en) * 2011-05-05 2013-10-29 Tangitek, Llc Noise dampening energy efficient circuit board and method for constructing and using same
DE102012202225B4 (de) * 2012-02-14 2015-10-22 Te Connectivity Germany Gmbh Steckergehäuse mit Dichtung
KR20140099716A (ko) * 2013-02-04 2014-08-13 삼성전자주식회사 센서플랫폼 및 그의 제조 방법
JP6749698B2 (ja) * 2015-09-04 2020-09-02 国立研究開発法人科学技術振興機構 コネクタ基板、センサーシステム及びウェアラブルなセンサーシステム
TWI738735B (zh) * 2016-05-27 2021-09-11 德商漢高智慧財產控股公司 藉由毛細流動以於電子封裝中進行間隙塗覆及／或於其中或其間充填的組合物及其使用方法
WO2018092798A1 (ja) * 2016-11-18 2018-05-24 矢崎総業株式会社 回路体形成方法及び回路体
DK3724292T3 (da) 2017-12-14 2024-09-30 Avery Dennison Corp Trykfølsom klæber med bredt dæmpningstemperatur- og frekvensområde
JP2020019876A (ja) * 2018-07-31 2020-02-06 株式会社ダイセル 成形体およびその製造方法
CN113812220B (zh) * 2019-05-13 2024-04-19 3M创新有限公司 导电多层膜和垫圈
JP2020196877A (ja) * 2019-05-29 2020-12-10 花王株式会社 熱可塑性樹脂組成物
KR20220146567A (ko) * 2020-02-26 2022-11-01 티코나 엘엘씨 전자 디바이스
US11702539B2 (en) 2020-02-26 2023-07-18 Ticona Llc Polymer composition for an electronic device
US20230287248A1 (en) * 2020-07-29 2023-09-14 3M Innovative Properties Company Electrically Conductive Adhesive Film

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US4548862A (en) * 1984-09-04 1985-10-22 Minnesota Mining And Manufacturing Company Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
US6149857A (en) * 1995-08-01 2000-11-21 Loctite (R&D) Limited Method of making films and coatings having anisotropic conductive pathways therein
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KR20090054198A (ko) * 2007-11-26 2009-05-29 쓰리엠 이노베이티브 프로퍼티즈 캄파니 점착 시트의 제조방법 및 이에 의한 점착 시트
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Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
US4448837A (en) * 1982-07-19 1984-05-15 Oki Densen Kabushiki Kaisha Pressure-sensitive conductive elastic sheet
US4548862A (en) * 1984-09-04 1985-10-22 Minnesota Mining And Manufacturing Company Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
US6149857A (en) * 1995-08-01 2000-11-21 Loctite (R&D) Limited Method of making films and coatings having anisotropic conductive pathways therein
CN1601657A (zh) * 2003-09-28 2005-03-30 聚鼎科技股份有限公司 导电性聚合物及过电流保护元件

Also Published As

Publication number Publication date
US20150137046A1 (en) 2015-05-21
CA2608223A1 (en) 2006-11-23
JP2008540778A (ja) 2008-11-20
EP1880394A1 (en) 2008-01-23
MX2007013979A (es) 2008-01-28
TW200705463A (en) 2007-02-01
WO2006124694A1 (en) 2006-11-23
KR100608533B1 (ko) 2006-08-08
TWI386952B (zh) 2013-02-21
US20080149901A1 (en) 2008-06-26
US9336923B2 (en) 2016-05-10
US8975004B2 (en) 2015-03-10
BRPI0609629A2 (pt) 2010-04-20
CN101176169A (zh) 2008-05-07

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