JP2008537636A - ろう付け可能な接合部及び該接合部の形成のための方法 - Google Patents
ろう付け可能な接合部及び該接合部の形成のための方法 Download PDFInfo
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Abstract
Description
図1は、基板上のろう付け可能な接合部を示しており、
図2は、パターン形成されたパッド金属被覆の平面を示しており、
図3は、ろう付け可能な1つの接合部の形成時の各工程を示しており、
図4は、UBM金属被覆の層構造の1つの実施例の概略断面図であり、
図5は、UBM金属被覆の層構造の別の実施例の概略断面図である。
Claims (12)
- 電気的な構成部材のためのろう付け可能な接合部であって、基板(SU)上に施されたパッド金属被覆(PM)、及び、ろう付けのための領域で前記パッド金属被覆上に施されたUBM金属被覆(UBM)を備えており、前記パッド金属被覆は、前記UBM金属被覆の下側でパターン形成されており、該パターン形成によって基板表面の一部分を露出させてあり、露出させてある前記一部分は前記UBM金属被覆と直接に接触していることを特徴とする電気的な構成部材のためのろう付け可能な接合部。
- パッド金属被覆(PM)はUBM金属被覆(UBM)の下側に、繰り返し模様のパターンを有している請求項1に記載の接合部。
- パッド金属被覆(PM)はUBM金属被覆(UBM)の下側に、互いに平行に並べられた複数のストリップから成るパターンを有している請求項1又は2に記載の接合部。
- UBM金属被覆(UBM)は、濡れ性を有する少なくとも1つの層(BS)及び少なくとも1つの拡散バリア層(DB)から成る多層構造体として形成されている請求項1から3のいずれか1項に記載の接合部。
- 多層構造体はさらに、応力補償層(SK)若しくは接着剤層(HS)から成る少なくとも1つの層を有している請求項4に記載の接合部。
- 多層構造体は少なくとも、チタンを含む接着剤層(HS)、若しくはPtを含む拡散バリア層(DB)、若しくは金を含む濡れ性の層(BS)から形成されている請求項4又は5に記載の接合部。
- パッド金属被覆(PM)のパターン形成された領域は、UBM金属被覆(UBM)の大きさに相応しており、パッドは前記領域の外側の領域では一貫して延びる金属被覆(PM)を有している請求項1から6のいずれか1項に記載の接合部。
- パッド金属被覆(PM)はアルミニウムから成る層、若しくはアルミニウムを含む合金から成る層を有し、若しくは前記層と別の層とから成る多層構造体として形成されている請求項1から7のいずれか1項に記載の接合部。
- チタンを含む別の接着剤層(HS2)を、パッド金属被覆(PM)の下側に配置してある請求項1から8のいずれか1項に記載の接合部。
- ろう付け可能な接合部を形成するための方法において、構成部材の基板の表面上に、第1のレジスト樹脂層(AM)を施し、次いで該レジスト樹脂層に、接続面若しくはパッドを有する金属被覆のためのパターンを形成し、次いで、パッド金属被覆(PM)のために必要な層(PMS)を施し、次いで、パターン形成された前記第1のレジスト樹脂層(AM)及び前記パッド金属被覆のための層(PMS)の、前記パターン形成された第1のレジスト樹脂層上に付着する層部分を除去し、次いで第2のレジスト樹脂層(AM2)を施して、所定のパターンを形成し、次いでUBM金属被覆(UBM)を施し、次いで前記第2のレジスト樹脂層を除去し、前記第1のレジスト樹脂層のパターン形成は、UBM金属被覆の領域でパッド金属被覆が互いに交互に並べられた切欠き部(AN)と隆起部(EH)とを有する模様(SM)で行うことを特徴とする、ろう付け可能な接合部を形成するための方法。
- 第1及び第2のレジスト樹脂層(AM1,AM2)のパターン形成をフォトリソグラフィによって行い、第1のレジスト樹脂層の照射のためにステッパを用い、かつ第2のレジスト樹脂層の照射のために露光マスクを用いることを特徴とする請求項10に記載の方法。
- 請求項1から9のいずれか1項に記載のろう付け可能な接合部の使用法において、フリップチップでSAW用構成要素を支持体に組み付ける際に接合部を用いることを特徴とするろう付け可能な接合部の使用法。
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Application Number | Priority Date | Filing Date | Title |
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DE102005009358.2 | 2005-03-01 | ||
DE102005009358.2A DE102005009358B4 (de) | 2005-03-01 | 2005-03-01 | Lötfähiger Kontakt und ein Verfahren zur Herstellung |
PCT/EP2006/001160 WO2006092200A1 (de) | 2005-03-01 | 2006-02-09 | Lötfähiger kontakt und ein verfahren zur herstellung |
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JP2008537636A true JP2008537636A (ja) | 2008-09-18 |
JP5248868B2 JP5248868B2 (ja) | 2013-07-31 |
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JP2007557354A Expired - Fee Related JP5248868B2 (ja) | 2005-03-01 | 2006-02-09 | ろう付け可能な接合部及び該接合部の形成のための方法 |
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US (1) | US8456022B2 (ja) |
JP (1) | JP5248868B2 (ja) |
DE (1) | DE102005009358B4 (ja) |
WO (1) | WO2006092200A1 (ja) |
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DE102007023590A1 (de) * | 2007-05-21 | 2008-11-27 | Epcos Ag | Bauelement mit mechanisch belastbarer Anschlussfläche |
FR2952314B1 (fr) * | 2009-11-12 | 2012-02-10 | Sagem Defense Securite | Procede de brasage, gyroscope et piece brasee |
US9053943B2 (en) * | 2011-06-24 | 2015-06-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bond pad design for improved routing and reduced package stress |
US9368461B2 (en) * | 2014-05-16 | 2016-06-14 | Intel Corporation | Contact pads for integrated circuit packages |
US9362243B2 (en) * | 2014-05-21 | 2016-06-07 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor package device and forming the same |
DE102014217985A1 (de) * | 2014-09-09 | 2016-03-10 | Robert Bosch Gmbh | Verfahren zum Herstellen eines Bondpads, Bondpad und Bondverfahren |
US10670626B2 (en) | 2017-12-15 | 2020-06-02 | Keysight Technologies, Inc. | Test fixture for observing current flow through a set of resistors |
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WO2014050450A1 (ja) * | 2012-09-28 | 2014-04-03 | 株式会社村田製作所 | 弾性波装置及びその製造方法 |
JP5825444B2 (ja) * | 2012-09-28 | 2015-12-02 | 株式会社村田製作所 | 弾性波装置及びその製造方法 |
US9621127B2 (en) | 2012-09-28 | 2017-04-11 | Murata Manufacturing Co., Ltd. | Elastic wave device with a bump defining a shield and manufacturing method thereof |
Also Published As
Publication number | Publication date |
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DE102005009358A1 (de) | 2006-09-07 |
US20090020325A1 (en) | 2009-01-22 |
JP5248868B2 (ja) | 2013-07-31 |
US8456022B2 (en) | 2013-06-04 |
DE102005009358B4 (de) | 2021-02-04 |
WO2006092200A1 (de) | 2006-09-08 |
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