JP2008532292A - フリップ・チップ・デバイスを形成するための構造および方法 - Google Patents

フリップ・チップ・デバイスを形成するための構造および方法 Download PDF

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Publication number
JP2008532292A
JP2008532292A JP2007557202A JP2007557202A JP2008532292A JP 2008532292 A JP2008532292 A JP 2008532292A JP 2007557202 A JP2007557202 A JP 2007557202A JP 2007557202 A JP2007557202 A JP 2007557202A JP 2008532292 A JP2008532292 A JP 2008532292A
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conductive
forming
pad
bump
base metal
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JP2008532292A5 (enExample
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バッチマン，マーク，アダム
ビッティング，ドナルド，ステーブン
チェイサー，ダニエル，パトリック
クック，タエホー
マーチャント，サイレッシュ，マンシン
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Agere Systems LLC
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Agere Systems LLC
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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
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US20090072393A1 (en) 2009-03-19
KR20070104919A (ko) 2007-10-29
US7777333B2 (en) 2010-08-17
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