JPS49112570A - - Google Patents
Info
- Publication number
- JPS49112570A JPS49112570A JP48021284A JP2128473A JPS49112570A JP S49112570 A JPS49112570 A JP S49112570A JP 48021284 A JP48021284 A JP 48021284A JP 2128473 A JP2128473 A JP 2128473A JP S49112570 A JPS49112570 A JP S49112570A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48021284A JPS49112570A (enExample) | 1973-02-23 | 1973-02-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48021284A JPS49112570A (enExample) | 1973-02-23 | 1973-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS49112570A true JPS49112570A (enExample) | 1974-10-26 |
Family
ID=12050821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48021284A Pending JPS49112570A (enExample) | 1973-02-23 | 1973-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS49112570A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008532292A (ja) * | 2005-02-24 | 2008-08-14 | アギア システムズ インコーポレーテッド | フリップ・チップ・デバイスを形成するための構造および方法 |
| JP2009524922A (ja) * | 2006-01-24 | 2009-07-02 | エヌエックスピー ビー ヴィ | 半導体部品のための応力緩衝パッケージ |
-
1973
- 1973-02-23 JP JP48021284A patent/JPS49112570A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008532292A (ja) * | 2005-02-24 | 2008-08-14 | アギア システムズ インコーポレーテッド | フリップ・チップ・デバイスを形成するための構造および方法 |
| JP2009524922A (ja) * | 2006-01-24 | 2009-07-02 | エヌエックスピー ビー ヴィ | 半導体部品のための応力緩衝パッケージ |
| US8338967B2 (en) | 2006-01-24 | 2012-12-25 | Nxp B.V. | Stress buffering package for a semiconductor component |