JP2008524594A - テストシステムチャネルとインタフェースをとるための双方向バッファ - Google Patents
テストシステムチャネルとインタフェースをとるための双方向バッファ Download PDFInfo
- Publication number
- JP2008524594A JP2008524594A JP2007546937A JP2007546937A JP2008524594A JP 2008524594 A JP2008524594 A JP 2008524594A JP 2007546937 A JP2007546937 A JP 2007546937A JP 2007546937 A JP2007546937 A JP 2007546937A JP 2008524594 A JP2008524594 A JP 2008524594A
- Authority
- JP
- Japan
- Prior art keywords
- emitter
- voltage
- follower transistor
- transistor
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31712—Input or output aspects
- G01R31/31713—Input or output interfaces for test, e.g. test pins, buffers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/018,211 US7262624B2 (en) | 2004-12-21 | 2004-12-21 | Bi-directional buffer for interfacing test system channel |
| PCT/US2005/045610 WO2006068938A2 (en) | 2004-12-21 | 2005-12-15 | Bi-directional buffer for interfacing test system channel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008524594A true JP2008524594A (ja) | 2008-07-10 |
| JP2008524594A5 JP2008524594A5 (https=) | 2009-03-12 |
Family
ID=36594862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007546937A Pending JP2008524594A (ja) | 2004-12-21 | 2005-12-15 | テストシステムチャネルとインタフェースをとるための双方向バッファ |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7262624B2 (https=) |
| EP (1) | EP1836502A4 (https=) |
| JP (1) | JP2008524594A (https=) |
| KR (1) | KR101362485B1 (https=) |
| CN (1) | CN101080641A (https=) |
| TW (1) | TWI418812B (https=) |
| WO (1) | WO2006068938A2 (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6957352B2 (en) * | 2002-03-15 | 2005-10-18 | Intel Corporation | Processor temperature control interface |
| US7262624B2 (en) * | 2004-12-21 | 2007-08-28 | Formfactor, Inc. | Bi-directional buffer for interfacing test system channel |
| US8154315B2 (en) * | 2008-04-08 | 2012-04-10 | Formfactor, Inc. | Self-referencing voltage regulator |
| EP2180327A1 (en) * | 2008-10-21 | 2010-04-28 | Applied Materials, Inc. | Apparatus and method for active voltage compensation |
| US8400173B2 (en) * | 2009-06-26 | 2013-03-19 | Formfactor, Inc. | Method and apparatus for thermally conditioning probe cards |
| DE102009027677B4 (de) * | 2009-07-14 | 2019-09-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Tastkopf und Verfahren zu seiner Verwendung |
| DE202012002391U1 (de) * | 2012-03-08 | 2013-06-10 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Vorrichtung zur Messung elektronischer Bauteile |
| WO2017153847A1 (en) * | 2016-03-11 | 2017-09-14 | Analog Devices Global | Configurable hardware platform for measurement or control |
| TWI636260B (zh) * | 2017-01-06 | 2018-09-21 | 新特系統股份有限公司 | 探針卡模組 |
| US11165434B2 (en) | 2019-03-15 | 2021-11-02 | Analog Devices International Unlimited Company | Leakage reduction for multi-function configurable circuit |
| US11415623B2 (en) * | 2019-03-28 | 2022-08-16 | Teradyne, Inc. | Test system supporting reverse compliance |
| KR102133485B1 (ko) * | 2019-03-28 | 2020-07-13 | 에스케이하이닉스 주식회사 | 반도체 테스트 시스템 |
| US12228611B2 (en) * | 2019-08-28 | 2025-02-18 | Tektronix, Inc. | Signal path calibration of a hardware setting in a test and measurement instrument |
| US11313903B2 (en) * | 2020-09-30 | 2022-04-26 | Analog Devices, Inc. | Pin driver and test equipment calibration |
| CN113514758B (zh) * | 2021-09-15 | 2022-02-22 | 绅克半导体科技(苏州)有限公司 | 芯片测试方法、测试机及存储介质 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5184029A (en) * | 1991-10-15 | 1993-02-02 | Hewlett-Packard Company | Driver circuit for circuit tester |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH642205A5 (fr) * | 1981-06-29 | 1984-03-30 | Asulab Sa | Circuit amplificateur pour sonde de mesure. |
| GB2223901A (en) * | 1988-10-07 | 1990-04-18 | Philips Electronic Associated | Transistor follower circuit |
| US5087874A (en) * | 1989-08-28 | 1992-02-11 | David Robinson | Apparatus and method for locating a short |
| JPH0419880A (ja) | 1990-05-14 | 1992-01-23 | Ricoh Co Ltd | 光ディスク装置におけるクリーニングカートリッジ |
| US5070297A (en) * | 1990-06-04 | 1991-12-03 | Texas Instruments Incorporated | Full wafer integrated circuit testing device |
| JPH0495782A (ja) * | 1990-08-07 | 1992-03-27 | Nec Corp | 半導体試験装置 |
| JP2833858B2 (ja) * | 1990-11-29 | 1998-12-09 | 日本電子株式会社 | Nmr装置におけるプローブチューニング回路 |
| US5323115A (en) * | 1992-05-05 | 1994-06-21 | Xerox Corporation | Electrostatic voltmeter producing a low voltage output |
| US5270660A (en) * | 1992-05-05 | 1993-12-14 | Xerox Corporation | Electrostatic voltmeter employing high voltage integrated circuit devices |
| US5550480A (en) * | 1994-07-05 | 1996-08-27 | Motorola, Inc. | Method and means for controlling movement of a chuck in a test apparatus |
| US6087843A (en) * | 1997-07-14 | 2000-07-11 | Credence Systems Corporation | Integrated circuit tester with test head including regulating capacitor |
| JPH1180108A (ja) * | 1997-09-12 | 1999-03-26 | Ajinomoto Co Inc | 甘味料の精製法 |
| US6181145B1 (en) * | 1997-10-13 | 2001-01-30 | Matsushita Electric Industrial Co., Ltd. | Probe card |
| US5956280A (en) * | 1998-03-02 | 1999-09-21 | Tanisys Technology, Inc. | Contact test method and system for memory testers |
| US6008664A (en) * | 1998-03-02 | 1999-12-28 | Tanisys Technology, Inc. | Parametric test system and method |
| US6380755B1 (en) * | 1998-09-14 | 2002-04-30 | Tokyo Electron Limited | Testing apparatus for test piece testing method contactor and method of manufacturing the same |
| US6313657B1 (en) * | 1998-12-24 | 2001-11-06 | Advantest Corporation | IC testing apparatus and testing method using same |
| US6157231A (en) | 1999-03-19 | 2000-12-05 | Credence System Corporation | Delay stabilization system for an integrated circuit |
| US6339338B1 (en) * | 2000-01-18 | 2002-01-15 | Formfactor, Inc. | Apparatus for reducing power supply noise in an integrated circuit |
| US6603323B1 (en) | 2000-07-10 | 2003-08-05 | Formfactor, Inc. | Closed-grid bus architecture for wafer interconnect structure |
| JP2002032988A (ja) * | 2000-07-18 | 2002-01-31 | Mitsubishi Electric Corp | 内部電圧発生回路 |
| JP3584220B2 (ja) * | 2001-06-28 | 2004-11-04 | ユーディナデバイス株式会社 | 半導体増幅回路 |
| JP4177759B2 (ja) * | 2001-07-17 | 2008-11-05 | 株式会社アドバンテスト | 入出力回路、及び試験装置 |
| JP3506243B2 (ja) * | 2001-08-01 | 2004-03-15 | 住友金属工業株式会社 | プロービングシステム及び容量測定方法 |
| US6774653B2 (en) * | 2001-08-22 | 2004-08-10 | Sun Microsystems, Inc. | Two-pin thermal sensor calibration interface |
| US6856129B2 (en) * | 2002-07-09 | 2005-02-15 | Intel Corporation | Current probe device having an integrated amplifier |
| US6812691B2 (en) * | 2002-07-12 | 2004-11-02 | Formfactor, Inc. | Compensation for test signal degradation due to DUT fault |
| FR2843234B1 (fr) * | 2002-07-30 | 2005-01-28 | Etienne Demeocq | Connecteur miniature avec electronique embarquee pour thermocouple |
| US20040085059A1 (en) * | 2002-10-31 | 2004-05-06 | Smith Edward E. | Method and apparatus to provide accurate high speed wide range current measurement in automated testing equipment |
| WO2004053507A1 (ja) * | 2002-12-11 | 2004-06-24 | Advantest Corporation | 電圧印加電流測定装置及びそれに使用されるスイッチ付き電流バッファ |
| US7154259B2 (en) * | 2003-10-23 | 2006-12-26 | Formfactor, Inc. | Isolation buffers with controlled equal time delays |
| DE10355296B3 (de) * | 2003-11-27 | 2005-06-09 | Infineon Technologies Ag | Testeinrichtung zum Wafertest von digitalen Halbleiterschaltungen |
| US7453258B2 (en) * | 2004-09-09 | 2008-11-18 | Formfactor, Inc. | Method and apparatus for remotely buffering test channels |
| US7262624B2 (en) * | 2004-12-21 | 2007-08-28 | Formfactor, Inc. | Bi-directional buffer for interfacing test system channel |
-
2004
- 2004-12-21 US US11/018,211 patent/US7262624B2/en not_active Expired - Fee Related
-
2005
- 2005-12-15 WO PCT/US2005/045610 patent/WO2006068938A2/en not_active Ceased
- 2005-12-15 KR KR1020077016252A patent/KR101362485B1/ko not_active Expired - Fee Related
- 2005-12-15 EP EP05854352A patent/EP1836502A4/en not_active Withdrawn
- 2005-12-15 JP JP2007546937A patent/JP2008524594A/ja active Pending
- 2005-12-15 CN CNA2005800435642A patent/CN101080641A/zh active Pending
- 2005-12-20 TW TW094145336A patent/TWI418812B/zh not_active IP Right Cessation
-
2007
- 2007-08-28 US US11/846,446 patent/US7977958B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5184029A (en) * | 1991-10-15 | 1993-02-02 | Hewlett-Packard Company | Driver circuit for circuit tester |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006068938A3 (en) | 2007-04-19 |
| EP1836502A4 (en) | 2010-07-21 |
| TW200636259A (en) | 2006-10-16 |
| TWI418812B (zh) | 2013-12-11 |
| EP1836502A2 (en) | 2007-09-26 |
| US20070290676A1 (en) | 2007-12-20 |
| KR20070090024A (ko) | 2007-09-04 |
| US7262624B2 (en) | 2007-08-28 |
| US20060132158A1 (en) | 2006-06-22 |
| WO2006068938A2 (en) | 2006-06-29 |
| CN101080641A (zh) | 2007-11-28 |
| KR101362485B1 (ko) | 2014-02-13 |
| US7977958B2 (en) | 2011-07-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7977958B2 (en) | Bi-directional buffer for interfacing test system channel | |
| US6768328B2 (en) | Single point probe structure and method | |
| US8014968B2 (en) | Self-test circuit for high-definition multimedia interface integrated circuits | |
| US7825652B2 (en) | Method and apparatus for remotely buffering test channels | |
| US6762614B2 (en) | Systems and methods for facilitating driver strength testing of integrated circuits | |
| CN101084446A (zh) | 用于生成测试半导体器件的信号的方法和系统 | |
| JP4689125B2 (ja) | 自動試験装置における改良試験及び較正回路及び方法 | |
| TWI416138B (zh) | 使用靜電放電保護電路的校準測試器 | |
| CN101084445A (zh) | 用于测试半导体器件的方法和系统 | |
| JP2004003985A (ja) | 集積回路のパッド・ドライバのテストを容易にするためのシステムおよび方法 | |
| US5256964A (en) | Tester calibration verification device | |
| CN101099085A (zh) | 用于提高电子器件测试系统的工作频率的方法和装置 | |
| CN101278204B (zh) | 管脚电路驱动器 | |
| US20110148454A1 (en) | Semiconductor wafer, semiconductor circuit, substrate for testing and test system | |
| JP2008524594A5 (https=) | ||
| JP2004028983A (ja) | 測定機器及び測定方法 | |
| US7332924B2 (en) | Embedded test circuitry and a method for testing a semiconductor device for breakdown, wearout or failure | |
| US7532013B2 (en) | Semiconductor integrated circuit and measuring method of terminator resistor in the semiconductor integrated circuit | |
| KR101063441B1 (ko) | Odt 저항 테스트 시스템 | |
| US6462528B1 (en) | Method and apparatus for probing a conductor of an array of closely-spaced conductors | |
| CN117706144A (zh) | 测试电路、探针卡、测试系统及测试方法 | |
| JP2007155444A (ja) | 断線検出装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20081215 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20081224 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20100527 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20110201 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110720 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20111212 |