KR101362485B1 - 테스트 시스템 채널을 연동하는 양방향 버퍼 - Google Patents

테스트 시스템 채널을 연동하는 양방향 버퍼 Download PDF

Info

Publication number
KR101362485B1
KR101362485B1 KR1020077016252A KR20077016252A KR101362485B1 KR 101362485 B1 KR101362485 B1 KR 101362485B1 KR 1020077016252 A KR1020077016252 A KR 1020077016252A KR 20077016252 A KR20077016252 A KR 20077016252A KR 101362485 B1 KR101362485 B1 KR 101362485B1
Authority
KR
South Korea
Prior art keywords
voltage
follower transistor
dut
terminal
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020077016252A
Other languages
English (en)
Korean (ko)
Other versions
KR20070090024A (ko
Inventor
챨즈 에이 밀러
Original Assignee
폼팩터, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 폼팩터, 인코포레이티드 filed Critical 폼팩터, 인코포레이티드
Publication of KR20070090024A publication Critical patent/KR20070090024A/ko
Application granted granted Critical
Publication of KR101362485B1 publication Critical patent/KR101362485B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31712—Input or output aspects
    • G01R31/31713—Input or output interfaces for test, e.g. test pins, buffers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
KR1020077016252A 2004-12-21 2005-12-15 테스트 시스템 채널을 연동하는 양방향 버퍼 Expired - Fee Related KR101362485B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/018,211 2004-12-21
US11/018,211 US7262624B2 (en) 2004-12-21 2004-12-21 Bi-directional buffer for interfacing test system channel
PCT/US2005/045610 WO2006068938A2 (en) 2004-12-21 2005-12-15 Bi-directional buffer for interfacing test system channel

Publications (2)

Publication Number Publication Date
KR20070090024A KR20070090024A (ko) 2007-09-04
KR101362485B1 true KR101362485B1 (ko) 2014-02-13

Family

ID=36594862

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077016252A Expired - Fee Related KR101362485B1 (ko) 2004-12-21 2005-12-15 테스트 시스템 채널을 연동하는 양방향 버퍼

Country Status (7)

Country Link
US (2) US7262624B2 (https=)
EP (1) EP1836502A4 (https=)
JP (1) JP2008524594A (https=)
KR (1) KR101362485B1 (https=)
CN (1) CN101080641A (https=)
TW (1) TWI418812B (https=)
WO (1) WO2006068938A2 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6957352B2 (en) * 2002-03-15 2005-10-18 Intel Corporation Processor temperature control interface
US7262624B2 (en) * 2004-12-21 2007-08-28 Formfactor, Inc. Bi-directional buffer for interfacing test system channel
US8154315B2 (en) * 2008-04-08 2012-04-10 Formfactor, Inc. Self-referencing voltage regulator
EP2180327A1 (en) * 2008-10-21 2010-04-28 Applied Materials, Inc. Apparatus and method for active voltage compensation
US8400173B2 (en) * 2009-06-26 2013-03-19 Formfactor, Inc. Method and apparatus for thermally conditioning probe cards
DE102009027677B4 (de) * 2009-07-14 2019-09-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Tastkopf und Verfahren zu seiner Verwendung
DE202012002391U1 (de) * 2012-03-08 2013-06-10 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Vorrichtung zur Messung elektronischer Bauteile
WO2017153847A1 (en) * 2016-03-11 2017-09-14 Analog Devices Global Configurable hardware platform for measurement or control
TWI636260B (zh) * 2017-01-06 2018-09-21 新特系統股份有限公司 探針卡模組
US11165434B2 (en) 2019-03-15 2021-11-02 Analog Devices International Unlimited Company Leakage reduction for multi-function configurable circuit
US11415623B2 (en) * 2019-03-28 2022-08-16 Teradyne, Inc. Test system supporting reverse compliance
KR102133485B1 (ko) * 2019-03-28 2020-07-13 에스케이하이닉스 주식회사 반도체 테스트 시스템
US12228611B2 (en) * 2019-08-28 2025-02-18 Tektronix, Inc. Signal path calibration of a hardware setting in a test and measurement instrument
US11313903B2 (en) * 2020-09-30 2022-04-26 Analog Devices, Inc. Pin driver and test equipment calibration
CN113514758B (zh) * 2021-09-15 2022-02-22 绅克半导体科技(苏州)有限公司 芯片测试方法、测试机及存储介质

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5087874A (en) * 1989-08-28 1992-02-11 David Robinson Apparatus and method for locating a short
US5184029A (en) * 1991-10-15 1993-02-02 Hewlett-Packard Company Driver circuit for circuit tester
US5550480A (en) * 1994-07-05 1996-08-27 Motorola, Inc. Method and means for controlling movement of a chuck in a test apparatus
US6774653B2 (en) * 2001-08-22 2004-08-10 Sun Microsystems, Inc. Two-pin thermal sensor calibration interface

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH642205A5 (fr) * 1981-06-29 1984-03-30 Asulab Sa Circuit amplificateur pour sonde de mesure.
GB2223901A (en) * 1988-10-07 1990-04-18 Philips Electronic Associated Transistor follower circuit
JPH0419880A (ja) 1990-05-14 1992-01-23 Ricoh Co Ltd 光ディスク装置におけるクリーニングカートリッジ
US5070297A (en) * 1990-06-04 1991-12-03 Texas Instruments Incorporated Full wafer integrated circuit testing device
JPH0495782A (ja) * 1990-08-07 1992-03-27 Nec Corp 半導体試験装置
JP2833858B2 (ja) * 1990-11-29 1998-12-09 日本電子株式会社 Ｎｍｒ装置におけるプローブチューニング回路
US5323115A (en) * 1992-05-05 1994-06-21 Xerox Corporation Electrostatic voltmeter producing a low voltage output
US5270660A (en) * 1992-05-05 1993-12-14 Xerox Corporation Electrostatic voltmeter employing high voltage integrated circuit devices
US6087843A (en) * 1997-07-14 2000-07-11 Credence Systems Corporation Integrated circuit tester with test head including regulating capacitor
JPH1180108A (ja) * 1997-09-12 1999-03-26 Ajinomoto Co Inc 甘味料の精製法
US6181145B1 (en) * 1997-10-13 2001-01-30 Matsushita Electric Industrial Co., Ltd. Probe card
US5956280A (en) * 1998-03-02 1999-09-21 Tanisys Technology, Inc. Contact test method and system for memory testers
US6008664A (en) * 1998-03-02 1999-12-28 Tanisys Technology, Inc. Parametric test system and method
US6380755B1 (en) * 1998-09-14 2002-04-30 Tokyo Electron Limited Testing apparatus for test piece testing method contactor and method of manufacturing the same
US6313657B1 (en) * 1998-12-24 2001-11-06 Advantest Corporation IC testing apparatus and testing method using same
US6157231A (en) 1999-03-19 2000-12-05 Credence System Corporation Delay stabilization system for an integrated circuit
US6339338B1 (en) * 2000-01-18 2002-01-15 Formfactor, Inc. Apparatus for reducing power supply noise in an integrated circuit
US6603323B1 (en) 2000-07-10 2003-08-05 Formfactor, Inc. Closed-grid bus architecture for wafer interconnect structure
JP2002032988A (ja) * 2000-07-18 2002-01-31 Mitsubishi Electric Corp 内部電圧発生回路
JP3584220B2 (ja) * 2001-06-28 2004-11-04 ユーディナデバイス株式会社 半導体増幅回路
JP4177759B2 (ja) * 2001-07-17 2008-11-05 株式会社アドバンテスト 入出力回路、及び試験装置
JP3506243B2 (ja) * 2001-08-01 2004-03-15 住友金属工業株式会社 プロービングシステム及び容量測定方法
US6856129B2 (en) * 2002-07-09 2005-02-15 Intel Corporation Current probe device having an integrated amplifier
US6812691B2 (en) * 2002-07-12 2004-11-02 Formfactor, Inc. Compensation for test signal degradation due to DUT fault
FR2843234B1 (fr) * 2002-07-30 2005-01-28 Etienne Demeocq Connecteur miniature avec electronique embarquee pour thermocouple
US20040085059A1 (en) * 2002-10-31 2004-05-06 Smith Edward E. Method and apparatus to provide accurate high speed wide range current measurement in automated testing equipment
WO2004053507A1 (ja) * 2002-12-11 2004-06-24 Advantest Corporation 電圧印加電流測定装置及びそれに使用されるスイッチ付き電流バッファ
US7154259B2 (en) * 2003-10-23 2006-12-26 Formfactor, Inc. Isolation buffers with controlled equal time delays
DE10355296B3 (de) * 2003-11-27 2005-06-09 Infineon Technologies Ag Testeinrichtung zum Wafertest von digitalen Halbleiterschaltungen
US7453258B2 (en) * 2004-09-09 2008-11-18 Formfactor, Inc. Method and apparatus for remotely buffering test channels
US7262624B2 (en) * 2004-12-21 2007-08-28 Formfactor, Inc. Bi-directional buffer for interfacing test system channel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5087874A (en) * 1989-08-28 1992-02-11 David Robinson Apparatus and method for locating a short
US5184029A (en) * 1991-10-15 1993-02-02 Hewlett-Packard Company Driver circuit for circuit tester
US5550480A (en) * 1994-07-05 1996-08-27 Motorola, Inc. Method and means for controlling movement of a chuck in a test apparatus
US6774653B2 (en) * 2001-08-22 2004-08-10 Sun Microsystems, Inc. Two-pin thermal sensor calibration interface

Also Published As

Publication number Publication date
WO2006068938A3 (en) 2007-04-19
EP1836502A4 (en) 2010-07-21
TW200636259A (en) 2006-10-16
TWI418812B (zh) 2013-12-11
EP1836502A2 (en) 2007-09-26
US20070290676A1 (en) 2007-12-20
KR20070090024A (ko) 2007-09-04
US7262624B2 (en) 2007-08-28
US20060132158A1 (en) 2006-06-22
WO2006068938A2 (en) 2006-06-29
CN101080641A (zh) 2007-11-28
JP2008524594A (ja) 2008-07-10
US7977958B2 (en) 2011-07-12

Similar Documents

Publication Publication Date Title
US7977958B2 (en) Bi-directional buffer for interfacing test system channel
US7880486B2 (en) Method and apparatus for increasing operating frequency of a system for testing electronic devices
US7825652B2 (en) Method and apparatus for remotely buffering test channels
US5467024A (en) Integrated circuit test with programmable source for both AC and DC modes of operation
US7486095B2 (en) System for measuring signal path resistance for an integrated circuit tester interconnect structure
JP4689125B2 (ja) 自動試験装置における改良試験及び較正回路及び方法
CN101084446A (zh) 用于生成测试半导体器件的信号的方法和系统
CN101084445A (zh) 用于测试半导体器件的方法和系统
US20110148454A1 (en) Semiconductor wafer, semiconductor circuit, substrate for testing and test system
CN101278204B (zh) 管脚电路驱动器
US7332924B2 (en) Embedded test circuitry and a method for testing a semiconductor device for breakdown, wearout or failure
US7532013B2 (en) Semiconductor integrated circuit and measuring method of terminator resistor in the semiconductor integrated circuit
CN101084444A (zh) 具有高压功能的管脚电子器件
KR101063441B1 (ko) Ｏｄｔ 저항 테스트 시스템
JP2008107216A (ja) 測定方法、スイッチ装置、および、該スイッチ装置を備える測定システム
CN117706144A (zh) 测试电路、探针卡、测试系统及测试方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

J201 Request for trial against refusal decision
PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PB0901 Examination by re-examination before a trial

St.27 status event code: A-6-3-E10-E12-rex-PB0901

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

B701 Decision to grant
PB0701 Decision of registration after re-examination before a trial

St.27 status event code: A-3-4-F10-F13-rex-PB0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20180213

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20190207

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20190207

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000