CN101080641A - 用于与测试系统通道接口的双向缓冲器 - Google Patents

用于与测试系统通道接口的双向缓冲器 Download PDF

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Publication number
CN101080641A
CN101080641A CNA2005800435642A CN200580043564A CN101080641A CN 101080641 A CN101080641 A CN 101080641A CN A2005800435642 A CNA2005800435642 A CN A2005800435642A CN 200580043564 A CN200580043564 A CN 200580043564A CN 101080641 A CN101080641 A CN 101080641A
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CN
China
Prior art keywords
emitter
voltage
follower transistor
transistor
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005800435642A
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English (en)
Chinese (zh)
Inventor
C·A·米勒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of CN101080641A publication Critical patent/CN101080641A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31712—Input or output aspects
    • G01R31/31713—Input or output interfaces for test, e.g. test pins, buffers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
CNA2005800435642A 2004-12-21 2005-12-15 用于与测试系统通道接口的双向缓冲器 Pending CN101080641A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/018,211 2004-12-21
US11/018,211 US7262624B2 (en) 2004-12-21 2004-12-21 Bi-directional buffer for interfacing test system channel

Publications (1)

Publication Number Publication Date
CN101080641A true CN101080641A (zh) 2007-11-28

Family

ID=36594862

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005800435642A Pending CN101080641A (zh) 2004-12-21 2005-12-15 用于与测试系统通道接口的双向缓冲器

Country Status (7)

Country Link
US (2) US7262624B2 (https=)
EP (1) EP1836502A4 (https=)
JP (1) JP2008524594A (https=)
KR (1) KR101362485B1 (https=)
CN (1) CN101080641A (https=)
TW (1) TWI418812B (https=)
WO (1) WO2006068938A2 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108279325A (zh) * 2017-01-06 2018-07-13 新特系统股份有限公司 用以测试电路芯片的探针卡模块
CN112445637A (zh) * 2019-08-28 2021-03-05 特克特朗尼克公司 测试和测量仪器中硬件设置的信号路径校准
CN113514758A (zh) * 2021-09-15 2021-10-19 绅克半导体科技(苏州)有限公司 芯片测试方法、测试机及存储介质
CN114325532A (zh) * 2020-09-30 2022-04-12 美国亚德诺半导体公司 引脚驱动器和测试设备校准

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6957352B2 (en) * 2002-03-15 2005-10-18 Intel Corporation Processor temperature control interface
US7262624B2 (en) * 2004-12-21 2007-08-28 Formfactor, Inc. Bi-directional buffer for interfacing test system channel
US8154315B2 (en) * 2008-04-08 2012-04-10 Formfactor, Inc. Self-referencing voltage regulator
EP2180327A1 (en) * 2008-10-21 2010-04-28 Applied Materials, Inc. Apparatus and method for active voltage compensation
US8400173B2 (en) * 2009-06-26 2013-03-19 Formfactor, Inc. Method and apparatus for thermally conditioning probe cards
DE102009027677B4 (de) * 2009-07-14 2019-09-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Tastkopf und Verfahren zu seiner Verwendung
DE202012002391U1 (de) * 2012-03-08 2013-06-10 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Vorrichtung zur Messung elektronischer Bauteile
WO2017153847A1 (en) * 2016-03-11 2017-09-14 Analog Devices Global Configurable hardware platform for measurement or control
US11165434B2 (en) 2019-03-15 2021-11-02 Analog Devices International Unlimited Company Leakage reduction for multi-function configurable circuit
US11415623B2 (en) * 2019-03-28 2022-08-16 Teradyne, Inc. Test system supporting reverse compliance
KR102133485B1 (ko) * 2019-03-28 2020-07-13 에스케이하이닉스 주식회사 반도체 테스트 시스템

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH642205A5 (fr) * 1981-06-29 1984-03-30 Asulab Sa Circuit amplificateur pour sonde de mesure.
GB2223901A (en) * 1988-10-07 1990-04-18 Philips Electronic Associated Transistor follower circuit
US5087874A (en) * 1989-08-28 1992-02-11 David Robinson Apparatus and method for locating a short
JPH0419880A (ja) 1990-05-14 1992-01-23 Ricoh Co Ltd 光ディスク装置におけるクリーニングカートリッジ
US5070297A (en) * 1990-06-04 1991-12-03 Texas Instruments Incorporated Full wafer integrated circuit testing device
JPH0495782A (ja) * 1990-08-07 1992-03-27 Nec Corp 半導体試験装置
JP2833858B2 (ja) * 1990-11-29 1998-12-09 日本電子株式会社 Ｎｍｒ装置におけるプローブチューニング回路
US5184029A (en) * 1991-10-15 1993-02-02 Hewlett-Packard Company Driver circuit for circuit tester
US5323115A (en) * 1992-05-05 1994-06-21 Xerox Corporation Electrostatic voltmeter producing a low voltage output
US5270660A (en) * 1992-05-05 1993-12-14 Xerox Corporation Electrostatic voltmeter employing high voltage integrated circuit devices
US5550480A (en) * 1994-07-05 1996-08-27 Motorola, Inc. Method and means for controlling movement of a chuck in a test apparatus
US6087843A (en) * 1997-07-14 2000-07-11 Credence Systems Corporation Integrated circuit tester with test head including regulating capacitor
JPH1180108A (ja) * 1997-09-12 1999-03-26 Ajinomoto Co Inc 甘味料の精製法
US6181145B1 (en) * 1997-10-13 2001-01-30 Matsushita Electric Industrial Co., Ltd. Probe card
US5956280A (en) * 1998-03-02 1999-09-21 Tanisys Technology, Inc. Contact test method and system for memory testers
US6008664A (en) * 1998-03-02 1999-12-28 Tanisys Technology, Inc. Parametric test system and method
US6380755B1 (en) * 1998-09-14 2002-04-30 Tokyo Electron Limited Testing apparatus for test piece testing method contactor and method of manufacturing the same
US6313657B1 (en) * 1998-12-24 2001-11-06 Advantest Corporation IC testing apparatus and testing method using same
US6157231A (en) 1999-03-19 2000-12-05 Credence System Corporation Delay stabilization system for an integrated circuit
US6339338B1 (en) * 2000-01-18 2002-01-15 Formfactor, Inc. Apparatus for reducing power supply noise in an integrated circuit
US6603323B1 (en) 2000-07-10 2003-08-05 Formfactor, Inc. Closed-grid bus architecture for wafer interconnect structure
JP2002032988A (ja) * 2000-07-18 2002-01-31 Mitsubishi Electric Corp 内部電圧発生回路
JP3584220B2 (ja) * 2001-06-28 2004-11-04 ユーディナデバイス株式会社 半導体増幅回路
JP4177759B2 (ja) * 2001-07-17 2008-11-05 株式会社アドバンテスト 入出力回路、及び試験装置
JP3506243B2 (ja) * 2001-08-01 2004-03-15 住友金属工業株式会社 プロービングシステム及び容量測定方法
US6774653B2 (en) * 2001-08-22 2004-08-10 Sun Microsystems, Inc. Two-pin thermal sensor calibration interface
US6856129B2 (en) * 2002-07-09 2005-02-15 Intel Corporation Current probe device having an integrated amplifier
US6812691B2 (en) * 2002-07-12 2004-11-02 Formfactor, Inc. Compensation for test signal degradation due to DUT fault
FR2843234B1 (fr) * 2002-07-30 2005-01-28 Etienne Demeocq Connecteur miniature avec electronique embarquee pour thermocouple
US20040085059A1 (en) * 2002-10-31 2004-05-06 Smith Edward E. Method and apparatus to provide accurate high speed wide range current measurement in automated testing equipment
WO2004053507A1 (ja) * 2002-12-11 2004-06-24 Advantest Corporation 電圧印加電流測定装置及びそれに使用されるスイッチ付き電流バッファ
US7154259B2 (en) * 2003-10-23 2006-12-26 Formfactor, Inc. Isolation buffers with controlled equal time delays
DE10355296B3 (de) * 2003-11-27 2005-06-09 Infineon Technologies Ag Testeinrichtung zum Wafertest von digitalen Halbleiterschaltungen
US7453258B2 (en) * 2004-09-09 2008-11-18 Formfactor, Inc. Method and apparatus for remotely buffering test channels
US7262624B2 (en) * 2004-12-21 2007-08-28 Formfactor, Inc. Bi-directional buffer for interfacing test system channel

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108279325A (zh) * 2017-01-06 2018-07-13 新特系统股份有限公司 用以测试电路芯片的探针卡模块
CN112445637A (zh) * 2019-08-28 2021-03-05 特克特朗尼克公司 测试和测量仪器中硬件设置的信号路径校准
CN114325532A (zh) * 2020-09-30 2022-04-12 美国亚德诺半导体公司 引脚驱动器和测试设备校准
CN114325532B (zh) * 2020-09-30 2024-03-22 美国亚德诺半导体公司 引脚驱动器和测试设备校准
CN113514758A (zh) * 2021-09-15 2021-10-19 绅克半导体科技(苏州)有限公司 芯片测试方法、测试机及存储介质

Also Published As

Publication number Publication date
WO2006068938A3 (en) 2007-04-19
EP1836502A4 (en) 2010-07-21
TW200636259A (en) 2006-10-16
TWI418812B (zh) 2013-12-11
EP1836502A2 (en) 2007-09-26
US20070290676A1 (en) 2007-12-20
KR20070090024A (ko) 2007-09-04
US7262624B2 (en) 2007-08-28
US20060132158A1 (en) 2006-06-22
WO2006068938A2 (en) 2006-06-29
KR101362485B1 (ko) 2014-02-13
JP2008524594A (ja) 2008-07-10
US7977958B2 (en) 2011-07-12

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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Open date: 20071128