TWI418812B - 探針卡、測試設備、探針卡設備及使用探針卡之受測裝置 - Google Patents

探針卡、測試設備、探針卡設備及使用探針卡之受測裝置 Download PDF

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Publication number
TWI418812B
TWI418812B TW094145336A TW94145336A TWI418812B TW I418812 B TWI418812 B TW I418812B TW 094145336 A TW094145336 A TW 094145336A TW 94145336 A TW94145336 A TW 94145336A TW I418812 B TWI418812 B TW I418812B
Authority
TW
Taiwan
Prior art keywords
test
voltage
probe card
follower transistor
dut
Prior art date
Application number
TW094145336A
Other languages
English (en)
Chinese (zh)
Other versions
TW200636259A (en
Inventor
米勒 查理斯
Original Assignee
佛姆費克特股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 佛姆費克特股份有限公司 filed Critical 佛姆費克特股份有限公司
Publication of TW200636259A publication Critical patent/TW200636259A/zh
Application granted granted Critical
Publication of TWI418812B publication Critical patent/TWI418812B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31712—Input or output aspects
    • G01R31/31713—Input or output interfaces for test, e.g. test pins, buffers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
TW094145336A 2004-12-21 2005-12-20 探針卡、測試設備、探針卡設備及使用探針卡之受測裝置 TWI418812B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/018,211 US7262624B2 (en) 2004-12-21 2004-12-21 Bi-directional buffer for interfacing test system channel

Publications (2)

Publication Number Publication Date
TW200636259A TW200636259A (en) 2006-10-16
TWI418812B true TWI418812B (zh) 2013-12-11

Family

ID=36594862

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094145336A TWI418812B (zh) 2004-12-21 2005-12-20 探針卡、測試設備、探針卡設備及使用探針卡之受測裝置

Country Status (7)

Country Link
US (2) US7262624B2 (https=)
EP (1) EP1836502A4 (https=)
JP (1) JP2008524594A (https=)
KR (1) KR101362485B1 (https=)
CN (1) CN101080641A (https=)
TW (1) TWI418812B (https=)
WO (1) WO2006068938A2 (https=)

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US6957352B2 (en) * 2002-03-15 2005-10-18 Intel Corporation Processor temperature control interface
US7262624B2 (en) * 2004-12-21 2007-08-28 Formfactor, Inc. Bi-directional buffer for interfacing test system channel
US8154315B2 (en) * 2008-04-08 2012-04-10 Formfactor, Inc. Self-referencing voltage regulator
EP2180327A1 (en) * 2008-10-21 2010-04-28 Applied Materials, Inc. Apparatus and method for active voltage compensation
US8400173B2 (en) * 2009-06-26 2013-03-19 Formfactor, Inc. Method and apparatus for thermally conditioning probe cards
DE102009027677B4 (de) * 2009-07-14 2019-09-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Tastkopf und Verfahren zu seiner Verwendung
DE202012002391U1 (de) * 2012-03-08 2013-06-10 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Vorrichtung zur Messung elektronischer Bauteile
WO2017153847A1 (en) * 2016-03-11 2017-09-14 Analog Devices Global Configurable hardware platform for measurement or control
TWI636260B (zh) * 2017-01-06 2018-09-21 新特系統股份有限公司 探針卡模組
US11165434B2 (en) 2019-03-15 2021-11-02 Analog Devices International Unlimited Company Leakage reduction for multi-function configurable circuit
US11415623B2 (en) * 2019-03-28 2022-08-16 Teradyne, Inc. Test system supporting reverse compliance
KR102133485B1 (ko) * 2019-03-28 2020-07-13 에스케이하이닉스 주식회사 반도체 테스트 시스템
US12228611B2 (en) * 2019-08-28 2025-02-18 Tektronix, Inc. Signal path calibration of a hardware setting in a test and measurement instrument
US11313903B2 (en) * 2020-09-30 2022-04-26 Analog Devices, Inc. Pin driver and test equipment calibration
CN113514758B (zh) * 2021-09-15 2022-02-22 绅克半导体科技(苏州)有限公司 芯片测试方法、测试机及存储介质

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US5184029A (en) * 1991-10-15 1993-02-02 Hewlett-Packard Company Driver circuit for circuit tester
US5550480A (en) * 1994-07-05 1996-08-27 Motorola, Inc. Method and means for controlling movement of a chuck in a test apparatus
TW526606B (en) * 2000-07-18 2003-04-01 Mitsubishi Electric Corp Internal voltage generating circuit
TW200409923A (en) * 2002-07-12 2004-06-16 Formfactor Inc Compensation for test signal degradation due to DUT fault
US6774653B2 (en) * 2001-08-22 2004-08-10 Sun Microsystems, Inc. Two-pin thermal sensor calibration interface

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US20040085059A1 (en) * 2002-10-31 2004-05-06 Smith Edward E. Method and apparatus to provide accurate high speed wide range current measurement in automated testing equipment
WO2004053507A1 (ja) * 2002-12-11 2004-06-24 Advantest Corporation 電圧印加電流測定装置及びそれに使用されるスイッチ付き電流バッファ
US7154259B2 (en) * 2003-10-23 2006-12-26 Formfactor, Inc. Isolation buffers with controlled equal time delays
DE10355296B3 (de) * 2003-11-27 2005-06-09 Infineon Technologies Ag Testeinrichtung zum Wafertest von digitalen Halbleiterschaltungen
US7453258B2 (en) * 2004-09-09 2008-11-18 Formfactor, Inc. Method and apparatus for remotely buffering test channels
US7262624B2 (en) * 2004-12-21 2007-08-28 Formfactor, Inc. Bi-directional buffer for interfacing test system channel

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5184029A (en) * 1991-10-15 1993-02-02 Hewlett-Packard Company Driver circuit for circuit tester
US5550480A (en) * 1994-07-05 1996-08-27 Motorola, Inc. Method and means for controlling movement of a chuck in a test apparatus
TW526606B (en) * 2000-07-18 2003-04-01 Mitsubishi Electric Corp Internal voltage generating circuit
US6774653B2 (en) * 2001-08-22 2004-08-10 Sun Microsystems, Inc. Two-pin thermal sensor calibration interface
TW200409923A (en) * 2002-07-12 2004-06-16 Formfactor Inc Compensation for test signal degradation due to DUT fault

Also Published As

Publication number Publication date
WO2006068938A3 (en) 2007-04-19
EP1836502A4 (en) 2010-07-21
TW200636259A (en) 2006-10-16
EP1836502A2 (en) 2007-09-26
US20070290676A1 (en) 2007-12-20
KR20070090024A (ko) 2007-09-04
US7262624B2 (en) 2007-08-28
US20060132158A1 (en) 2006-06-22
WO2006068938A2 (en) 2006-06-29
CN101080641A (zh) 2007-11-28
KR101362485B1 (ko) 2014-02-13
JP2008524594A (ja) 2008-07-10
US7977958B2 (en) 2011-07-12

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