JP2008518477A - 可変位置冷却装置 - Google Patents

可変位置冷却装置 Download PDF

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Publication number
JP2008518477A
JP2008518477A JP2007538971A JP2007538971A JP2008518477A JP 2008518477 A JP2008518477 A JP 2008518477A JP 2007538971 A JP2007538971 A JP 2007538971A JP 2007538971 A JP2007538971 A JP 2007538971A JP 2008518477 A JP2008518477 A JP 2008518477A
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JP
Japan
Prior art keywords
article
volume
substrate
expansion chamber
distal end
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Pending
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JP2007538971A
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English (en)
Japanese (ja)
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JP2008518477A5 (enExample
Inventor
イー． トゥーマ，フィリップ
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2008518477A publication Critical patent/JP2008518477A/ja
Publication of JP2008518477A5 publication Critical patent/JP2008518477A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2007538971A 2004-10-29 2005-10-12 可変位置冷却装置 Pending JP2008518477A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/977,448 US7581585B2 (en) 2004-10-29 2004-10-29 Variable position cooling apparatus
PCT/US2005/037078 WO2006049847A1 (en) 2004-10-29 2005-10-12 Variable position cooling apparatus

Publications (2)

Publication Number Publication Date
JP2008518477A true JP2008518477A (ja) 2008-05-29
JP2008518477A5 JP2008518477A5 (enExample) 2008-11-13

Family

ID=35849529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007538971A Pending JP2008518477A (ja) 2004-10-29 2005-10-12 可変位置冷却装置

Country Status (6)

Country Link
US (1) US7581585B2 (enExample)
EP (1) EP1806042A1 (enExample)
JP (1) JP2008518477A (enExample)
KR (1) KR20070070192A (enExample)
CN (1) CN100515166C (enExample)
WO (1) WO2006049847A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006261457A (ja) * 2005-03-17 2006-09-28 Fujitsu Ltd 受熱体、受熱装置及び電子機器
GB0509747D0 (en) * 2005-05-13 2005-06-22 Ashe Morris Ltd Variable volume heat exchangers
CN101908513B (zh) * 2009-06-05 2012-05-30 鸿富锦精密工业（深圳）有限公司 散热器
TW201209552A (en) * 2010-08-19 2012-03-01 Hon Hai Prec Ind Co Ltd Heat dissipation device
TWI446376B (zh) * 2011-07-15 2014-07-21 Wistron Corp 兼具滑鼠墊功能的變壓器裝置及其組合
CN107505995A (zh) * 2017-08-24 2017-12-22 太仓市众翔精密五金有限公司 一种利于散热的一体化笔记本电脑底部面板
US10582645B1 (en) 2018-09-28 2020-03-03 Hewlett Packard Enterprise Development Lp Cooling apparatus for electronic components
US11989067B2 (en) 2019-12-06 2024-05-21 Nvidia Corporation Laptop computer with display-side cooling system
CN113342134B (zh) * 2021-04-19 2022-07-22 上海济邦投资咨询有限公司 一种半接触式高稳定型大数据服务器
DE102022207570A1 (de) * 2022-07-25 2024-01-25 Robert Bosch Gesellschaft mit beschränkter Haftung Kühlvorrichtung für eine zu kühlende Baugruppe in einem Fahrzeug

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JPS5948058U (ja) * 1982-09-22 1984-03-30 富士通株式会社 半導体パツケ−ジの冷却構造
JPS6418794U (enExample) * 1987-07-23 1989-01-30
JPH0267792A (ja) * 1988-09-01 1990-03-07 Fujitsu Ltd 浸漬冷却モジュール
JPH02244662A (ja) * 1989-03-16 1990-09-28 Ando Electric Co Ltd ベローズと冷却板による冷却機構
JPH02305000A (ja) * 1989-05-19 1990-12-18 Fujitsu Ltd 集積回路素子の浸漬冷却装置
JPH0391948A (ja) * 1989-09-05 1991-04-17 Hitachi Ltd 沸騰冷却式集積回路装置
JPH1013069A (ja) * 1996-06-26 1998-01-16 Fujitsu Ltd 冷却構造

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JPS60117760A (ja) 1983-11-30 1985-06-25 Fujitsu Ltd 浸漬液冷装置
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JPH0590456A (ja) 1991-09-26 1993-04-09 Nec Corp 集積回路の冷却構造
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JPH0855701A (ja) 1994-08-11 1996-02-27 Yazaki Corp 発熱体の昇温防止構造
CA2186488C (en) 1995-01-25 2000-01-18 Henry F. Villaume Thermal management system
US5621613A (en) 1995-05-16 1997-04-15 Intel Corporation Apparatus for dissipating heat in a hinged computing device
US5646822A (en) 1995-08-30 1997-07-08 Intel Corporation Heat pipe exchanger system for cooling a hinged computing device
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CA2181828C (en) 1996-07-22 2002-01-15 Richard Lamoureux One-piece cap for liquid dispenser container
US5982616A (en) 1997-08-20 1999-11-09 Compaq Computer Corporation Electronic apparatus with plug-in heat pipe module cooling system
US6786330B2 (en) 1997-10-14 2004-09-07 Biogaia Ab Two-compartment container
JP2000031360A (ja) 1998-07-08 2000-01-28 Hitachi Ltd マルチチップモジュール
US5940270A (en) 1998-07-08 1999-08-17 Puckett; John Christopher Two-phase constant-pressure closed-loop water cooling system for a heat producing device
US6175493B1 (en) 1998-10-16 2001-01-16 Dell Usa, Lp Heat transfer from base to display portion of a portable computer
SE518446C2 (sv) 1999-06-14 2002-10-08 Ericsson Telefon Ab L M Anordning vid kylning av elektroniska komponenter
US6690578B2 (en) 2000-02-02 2004-02-10 Rittal Gmbh & Co. Kg Cooling device
US6466438B1 (en) 2000-04-17 2002-10-15 Sui-Lin Lim Generic external portable cooling device for computers
JP2002020737A (ja) 2000-07-12 2002-01-23 Asahi Glass Co Ltd 冷却用媒体および冷却方法
US6724078B1 (en) 2000-08-31 2004-04-20 Intel Corporation Electronic assembly comprising solderable thermal interface
DE10051338A1 (de) 2000-10-17 2002-04-18 Daimlerchrysler Rail Systems Flüssigkeitskühlvorrichtung für ein Hochleistungs-Halbleitermodul und Verfahren für deren Herstellung
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ITMI20011340A1 (it) 2001-06-26 2002-12-26 Ausimont Spa Pfpe aventi almeno un terminale alchiletereo e relativo processo dipreparazione
US6587336B2 (en) 2001-06-27 2003-07-01 International Business Machines Corporation Cooling system for portable electronic and computer devices
FR2827424B1 (fr) 2001-07-13 2005-02-18 Thales Sa Composant electronique encapsule comportant un dispositif electronique de puissance et procede de fabrication
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GB2383321B (en) 2001-12-21 2005-07-27 Ebac Ltd Feed tube for use in a liquid delivery system
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US20030168730A1 (en) 2002-03-08 2003-09-11 Howard Davidson Carbon foam heat exchanger for integrated circuit
JP4104909B2 (ja) 2002-06-04 2008-06-18 東京エレクトロン株式会社 基板冷却装置および処理装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948058U (ja) * 1982-09-22 1984-03-30 富士通株式会社 半導体パツケ−ジの冷却構造
JPS6418794U (enExample) * 1987-07-23 1989-01-30
JPH0267792A (ja) * 1988-09-01 1990-03-07 Fujitsu Ltd 浸漬冷却モジュール
JPH02244662A (ja) * 1989-03-16 1990-09-28 Ando Electric Co Ltd ベローズと冷却板による冷却機構
JPH02305000A (ja) * 1989-05-19 1990-12-18 Fujitsu Ltd 集積回路素子の浸漬冷却装置
JPH0391948A (ja) * 1989-09-05 1991-04-17 Hitachi Ltd 沸騰冷却式集積回路装置
JPH1013069A (ja) * 1996-06-26 1998-01-16 Fujitsu Ltd 冷却構造

Also Published As

Publication number Publication date
US20060102334A1 (en) 2006-05-18
US7581585B2 (en) 2009-09-01
CN100515166C (zh) 2009-07-15
KR20070070192A (ko) 2007-07-03
CN101053289A (zh) 2007-10-10
WO2006049847A1 (en) 2006-05-11
EP1806042A1 (en) 2007-07-11

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