CN101908513B - 散热器 - Google Patents
散热器 Download PDFInfo
- Publication number
- CN101908513B CN101908513B CN2009103029689A CN200910302968A CN101908513B CN 101908513 B CN101908513 B CN 101908513B CN 2009103029689 A CN2009103029689 A CN 2009103029689A CN 200910302968 A CN200910302968 A CN 200910302968A CN 101908513 B CN101908513 B CN 101908513B
- Authority
- CN
- China
- Prior art keywords
- fins
- fins group
- radiator
- group
- bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2280/00—Mounting arrangements; Arrangements for facilitating assembling or disassembling of heat exchanger parts
- F28F2280/10—Movable elements, e.g. being pivotable
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (7)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009103029689A CN101908513B (zh) | 2009-06-05 | 2009-06-05 | 散热器 |
US12/507,094 US20100307718A1 (en) | 2009-06-05 | 2009-07-22 | Heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009103029689A CN101908513B (zh) | 2009-06-05 | 2009-06-05 | 散热器 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101908513A CN101908513A (zh) | 2010-12-08 |
CN101908513B true CN101908513B (zh) | 2012-05-30 |
Family
ID=43263928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009103029689A Expired - Fee Related CN101908513B (zh) | 2009-06-05 | 2009-06-05 | 散热器 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100307718A1 (zh) |
CN (1) | CN101908513B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM380512U (en) * | 2009-10-29 | 2010-05-11 | Wistron Corp | Heat sink and heat-dissipation fins thereof |
CN103874394B (zh) * | 2012-12-18 | 2017-01-04 | 国网山东省电力公司德州供电公司 | 电子装置及其散热器模组 |
EP3220090B1 (en) * | 2014-11-10 | 2019-10-16 | Furukawa Electric Co., Ltd. | Heat sink |
CN107087377B (zh) * | 2017-04-28 | 2019-04-26 | 华为技术有限公司 | 散热装置、散热器、电子设备及散热控制的方法 |
CN107368165A (zh) * | 2017-07-18 | 2017-11-21 | 浦江县顺光科技有限公司 | 一种简易散热器 |
CN107247498A (zh) * | 2017-07-18 | 2017-10-13 | 宁波力泰电子科技有限公司 | 一种复合散热装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US399493A (en) * | 1889-03-12 | I-eat-absorbing plate for cooling-coils | ||
US1521880A (en) * | 1921-07-16 | 1925-01-06 | Guarino Tommaso | Radiator for motor vehicles |
US1902350A (en) * | 1931-01-31 | 1933-03-21 | S R Dresser Mfg Co | Heat exchanger |
US4815525A (en) * | 1985-12-23 | 1989-03-28 | Sundstrand Corporation | Deployable space radiator with condenser |
US20010023756A1 (en) * | 1996-12-03 | 2001-09-27 | Naoto Tanaka | Assembled structure having an enlarged heat transfer area for heat radiation therefrom |
JPH11121667A (ja) * | 1997-10-20 | 1999-04-30 | Fujitsu Ltd | ヒートパイプ式冷却装置 |
US6006827A (en) * | 1998-12-28 | 1999-12-28 | Hon Hai Precision Ind. Co., Ltd. | Cooling device for computer component |
US6749011B2 (en) * | 2002-08-09 | 2004-06-15 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat sink |
US20050072562A1 (en) * | 2003-10-02 | 2005-04-07 | Hall Peter David | Heat exchanger tube assembly |
US7581585B2 (en) * | 2004-10-29 | 2009-09-01 | 3M Innovative Properties Company | Variable position cooling apparatus |
TWI274985B (en) * | 2005-07-08 | 2007-03-01 | Asustek Comp Inc | Extendable cooling apparatus |
-
2009
- 2009-06-05 CN CN2009103029689A patent/CN101908513B/zh not_active Expired - Fee Related
- 2009-07-22 US US12/507,094 patent/US20100307718A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20100307718A1 (en) | 2010-12-09 |
CN101908513A (zh) | 2010-12-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: RUGAO YONGXING CASING CO., LTD. Free format text: FORMER OWNER: HONGFUJIN PRECISE INDUSTRY (SHENZHEN) CO., LTD. Effective date: 20141105 Free format text: FORMER OWNER: HONGFUJIN PRECISE INDUSTRY CO., LTD. Effective date: 20141105 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518109 SHENZHEN, GUANGDONG PROVINCE TO: 226500 NANTONG, JIANGSU PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20141105 Address after: 226500, Jiangsu City, Rugao Province, such as town Huimin Road No. 666 Patentee after: Rugao Yongxing Casing Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Patentee before: Hon Hai Precision Industry Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20190605 |