JP2008509554A5 - - Google Patents

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Publication number
JP2008509554A5
JP2008509554A5 JP2007524802A JP2007524802A JP2008509554A5 JP 2008509554 A5 JP2008509554 A5 JP 2008509554A5 JP 2007524802 A JP2007524802 A JP 2007524802A JP 2007524802 A JP2007524802 A JP 2007524802A JP 2008509554 A5 JP2008509554 A5 JP 2008509554A5
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JP
Japan
Prior art keywords
composition
alkanolamine
water
diethylene glycol
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007524802A
Other languages
English (en)
Japanese (ja)
Other versions
JP4625842B2 (ja
JP2008509554A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2005/022598 external-priority patent/WO2006023061A1/en
Publication of JP2008509554A publication Critical patent/JP2008509554A/ja
Publication of JP2008509554A5 publication Critical patent/JP2008509554A5/ja
Application granted granted Critical
Publication of JP4625842B2 publication Critical patent/JP4625842B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2007524802A 2004-08-03 2005-06-23 マイクロエレクトロニクスの基板用の洗浄組成物 Expired - Fee Related JP4625842B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59831804P 2004-08-03 2004-08-03
PCT/US2005/022598 WO2006023061A1 (en) 2004-08-03 2005-06-23 Cleaning compositions for microelectronics substrates

Publications (3)

Publication Number Publication Date
JP2008509554A JP2008509554A (ja) 2008-03-27
JP2008509554A5 true JP2008509554A5 (enExample) 2008-08-07
JP4625842B2 JP4625842B2 (ja) 2011-02-02

Family

ID=35355858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007524802A Expired - Fee Related JP4625842B2 (ja) 2004-08-03 2005-06-23 マイクロエレクトロニクスの基板用の洗浄組成物

Country Status (17)

Country Link
EP (1) EP1789527B1 (enExample)
JP (1) JP4625842B2 (enExample)
KR (1) KR101162797B1 (enExample)
CN (1) CN1993457B (enExample)
AT (1) ATE450595T1 (enExample)
BR (1) BRPI0514058A (enExample)
CA (1) CA2575991A1 (enExample)
DE (1) DE602005018075D1 (enExample)
DK (1) DK1789527T3 (enExample)
ES (1) ES2335786T3 (enExample)
IL (1) IL181106A0 (enExample)
MY (1) MY144284A (enExample)
NO (1) NO20071196L (enExample)
PT (1) PT1789527E (enExample)
TW (1) TWI390032B (enExample)
WO (1) WO2006023061A1 (enExample)
ZA (1) ZA200700653B (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101088568B1 (ko) * 2005-04-19 2011-12-05 아반토르 퍼포먼스 머티리얼스, 인크. 갈바닉 부식을 억제하는 비수성 포토레지스트 스트립퍼
CN101356629B (zh) 2005-11-09 2012-06-06 高级技术材料公司 用于将其上具有低k介电材料的半导体晶片再循环的组合物和方法
EP1837182B1 (en) * 2006-03-22 2010-05-12 FUJIFILM Corporation Ink washing liquid and cleaning method
WO2008121952A1 (en) * 2007-03-31 2008-10-09 Advanced Technology Materials, Inc. Methods for stripping material for wafer reclamation
JP4903242B2 (ja) * 2008-10-28 2012-03-28 アバントール パフォーマンス マテリアルズ， インコーポレイテッド 多金属デバイス処理のためのグルコン酸含有フォトレジスト洗浄組成物
CN102289159A (zh) * 2010-06-18 2011-12-21 拉姆科技有限公司 用于除去光致抗蚀剂的组合物及利用其形成半导体图案的方法
JP2012018982A (ja) * 2010-07-06 2012-01-26 Tosoh Corp レジスト剥離剤及びそれを用いた剥離法
KR101827031B1 (ko) 2010-10-06 2018-02-07 엔테그리스, 아이엔씨. 질화 금속을 선택적으로 에칭하기 위한 조성물 및 방법
CN102411269A (zh) * 2011-11-18 2012-04-11 西安东旺精细化学有限公司 光致抗蚀剂膜的剥离液组合物
WO2013091177A1 (en) * 2011-12-20 2013-06-27 Rhodia (China) Co., Ltd. Use of phenol compounds as activator for metal surface corrosion
CN103631101B (zh) * 2012-08-22 2018-01-09 得凯莫斯公司弗罗里达有限公司 包含含氟表面活性剂的光阻剥除剂
KR101668063B1 (ko) * 2013-05-07 2016-10-20 주식회사 엘지화학 포토레지스트 제거용 스트리퍼 조성물 및 이를 사용한 포토레지스트의 박리방법
JPWO2015016113A1 (ja) * 2013-07-31 2017-03-02 旭硝子株式会社 電子デバイスの製造方法
JP6494627B2 (ja) * 2013-12-06 2019-04-03 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド 表面上の残渣を除去するための洗浄用製剤
CN103676505B (zh) * 2013-12-23 2016-04-13 大连奥首科技有限公司 一种用于芯片的光刻胶剥离液、制备方法及去胶工艺
CN103839885B (zh) * 2014-03-17 2016-09-07 上海华虹宏力半导体制造有限公司 去除缺陷的方法
KR101710170B1 (ko) * 2014-08-20 2017-02-27 주식회사 엘지화학 포토레지스트용 스트리퍼 폐액의 재생 방법
CN105087187A (zh) * 2015-08-30 2015-11-25 烟台顺隆化工科技有限公司 一种硒污染建筑废物用洗涤剂
KR102051346B1 (ko) * 2016-06-03 2019-12-03 후지필름 가부시키가이샤 처리액, 기판 세정 방법 및 레지스트의 제거 방법
CN107974687A (zh) * 2017-10-24 2018-05-01 广东富行洗涤剂科技有限公司 一种用于玻璃用真空镀膜模具的褪模剂
KR102242918B1 (ko) * 2018-12-21 2021-04-22 주식회사 이엔에프테크놀로지 식각액 조성물
WO2020194419A1 (ja) * 2019-03-25 2020-10-01 パナソニックＩｐマネジメント株式会社 レジスト剥離液
IT201900021549A1 (it) * 2019-11-19 2021-05-19 Deco Ind S Coop P A Prodotto per il trattamento di un elettrodomestico configurato per il lavaggio
MX2022011056A (es) * 2020-03-11 2022-12-06 Advansix Resins & Chemicals Llc Tensioactivos para productos electronicos.

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6187730B1 (en) * 1990-11-05 2001-02-13 Ekc Technology, Inc. Hydroxylamine-gallic compound composition and process
US7205265B2 (en) * 1990-11-05 2007-04-17 Ekc Technology, Inc. Cleaning compositions and methods of use thereof
US6546939B1 (en) * 1990-11-05 2003-04-15 Ekc Technology, Inc. Post clean treatment
US6825156B2 (en) * 2002-06-06 2004-11-30 Ekc Technology, Inc. Semiconductor process residue removal composition and process
US5308745A (en) 1992-11-06 1994-05-03 J. T. Baker Inc. Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins

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