TW200613543A - Aqueous resist stripper composition - Google Patents

Aqueous resist stripper composition

Info

Publication number
TW200613543A
TW200613543A TW094125443A TW94125443A TW200613543A TW 200613543 A TW200613543 A TW 200613543A TW 094125443 A TW094125443 A TW 094125443A TW 94125443 A TW94125443 A TW 94125443A TW 200613543 A TW200613543 A TW 200613543A
Authority
TW
Taiwan
Prior art keywords
weight
substrate
stripper composition
resist stripper
aqueous resist
Prior art date
Application number
TW094125443A
Other languages
Chinese (zh)
Other versions
TWI311585B (en
Inventor
Kwang-Yong Lee
Woong Kim
Hyuk-Jin Cha
Won-Su Byeon
Yong-Man Jeong
Choul-Kyu Lim
Nak-Chil Jung
Original Assignee
Adms Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adms Technology Co Ltd filed Critical Adms Technology Co Ltd
Publication of TW200613543A publication Critical patent/TW200613543A/en
Application granted granted Critical
Publication of TWI311585B publication Critical patent/TWI311585B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00—Chemical paint or ink removers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
    • C11D2111/22—

Abstract

Aqueous resist stripper composition capable of stripping a resist from a resist-coated substrate such as a color filter substrate or a TFT substrate is disclosed. The aqueous resist stripper composition according to the present invention includes 0.3 to 15 % by weight of an inorganic alkaline compound; 0.1 to 12 % by weight of a tetraalkylammonium hydroxide compound; 0.1 to 40 % by weight of a water-soluble organic solvent; and 33 to 99.5 % by weight of water, based on a total weight of the composition. The aqueous resist stripper composition according to the present invention may be useful to easily and simply remove a variety of resists which are generated during the process of manufacturing TFT-LCD but not easily removed by the conventional methods, as well as to minimize corrosions of a lower metal layer and a glass substrate during the stripping process, maximize a replacement cycle of the stripper due to its low loss by evaporation and its low aging, and regenerate the color substrate and the TFT substrate at a large scale.
TW094125443A 2004-07-28 2005-07-27 Aqueous resist stripper composition TWI311585B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040059033A KR100629416B1 (en) 2004-07-28 2004-07-28 Aqueous resist stripper formulation

Publications (2)

Publication Number Publication Date
TW200613543A true TW200613543A (en) 2006-05-01
TWI311585B TWI311585B (en) 2009-07-01

Family

ID=35786454

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094125443A TWI311585B (en) 2004-07-28 2005-07-27 Aqueous resist stripper composition

Country Status (3)

Country Link
KR (1) KR100629416B1 (en)
TW (1) TWI311585B (en)
WO (1) WO2006011747A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI424286B (en) * 2009-08-05 2014-01-21 Air Prod & Chem Semi-aqueous stripping and cleaning formulation for metal substrate and methods for using same
TWI554849B (en) * 2013-12-10 2016-10-21 Screen Holdings Co Ltd Substrate processing method and substrate processing device
CN110161812A (en) * 2019-06-06 2019-08-23 成都中电熊猫显示科技有限公司 Heavy industry medical fluid and preparation method thereof, reworking apparatus
TWI798068B (en) * 2021-04-30 2023-04-01 美商慧盛材料美國責任有限公司 Compositions for removing a photoresist from a substrate and uses thereof

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2138557A1 (en) * 2008-06-18 2009-12-30 Paul Hughett An upper internal combustion engine cleaning composition
JP5299428B2 (en) * 2008-08-04 2013-09-25 凸版印刷株式会社 Glass substrate recycling equipment
JP5830323B2 (en) 2010-09-21 2015-12-09 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ Improved method for stripping hot melt etching resist from semiconductors.
CN102626699A (en) * 2012-04-25 2012-08-08 华灿光电股份有限公司 Method for raising chip brightness
CN102854761A (en) * 2012-08-08 2013-01-02 华灿光电股份有限公司 Solution and method for removing photoresist after etching
KR101375100B1 (en) * 2012-08-31 2014-03-17 주식회사 이엔에프테크놀로지 Stripper composition for thick negative photoresist
KR102010593B1 (en) * 2013-05-28 2019-08-13 동우 화인켐 주식회사 Liquid composition for stripping a color resist and an organic insulating layer
KR102347618B1 (en) * 2015-04-02 2022-01-05 동우 화인켐 주식회사 Resist stripper composition
JP6862027B2 (en) * 2018-01-08 2021-04-21 エムティーアイ カンパニー，リミテッドＭｔｉ Ｃｏ．，Ｌｔｄ． Protective coating agent composition for wafer processing, and protective coating agent containing it
JP6858209B2 (en) * 2019-02-20 2021-04-14 東京応化工業株式会社 Cleaning liquid for lithography and cleaning method of substrate
CN109896742A (en) * 2019-04-23 2019-06-18 蚌埠中光电科技有限公司 A kind of film plating process of TFT-LCD base plate glass
KR102040066B1 (en) * 2019-08-02 2019-11-04 동우 화인켐 주식회사 Liquid composition for stripping a color resist and an organic insulating layer
CN116770308B (en) * 2023-08-24 2023-11-14 昆山市板明电子科技有限公司 Film stripping liquid suitable for ultra-fine circuit manufacturing and application thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2553872B2 (en) * 1987-07-21 1996-11-13 東京応化工業株式会社 Stripping solution for photoresist
US5780406A (en) * 1996-09-06 1998-07-14 Honda; Kenji Non-corrosive cleaning composition for removing plasma etching residues
US6030932A (en) * 1996-09-06 2000-02-29 Olin Microelectronic Chemicals Cleaning composition and method for removing residues
US5798323A (en) * 1997-05-05 1998-08-25 Olin Microelectronic Chemicals, Inc. Non-corrosive stripping and cleaning composition
US6413923B2 (en) * 1999-11-15 2002-07-02 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US6455479B1 (en) * 2000-08-03 2002-09-24 Shipley Company, L.L.C. Stripping composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI424286B (en) * 2009-08-05 2014-01-21 Air Prod & Chem Semi-aqueous stripping and cleaning formulation for metal substrate and methods for using same
TWI554849B (en) * 2013-12-10 2016-10-21 Screen Holdings Co Ltd Substrate processing method and substrate processing device
CN110161812A (en) * 2019-06-06 2019-08-23 成都中电熊猫显示科技有限公司 Heavy industry medical fluid and preparation method thereof, reworking apparatus
TWI798068B (en) * 2021-04-30 2023-04-01 美商慧盛材料美國責任有限公司 Compositions for removing a photoresist from a substrate and uses thereof

Also Published As

Publication number Publication date
WO2006011747A1 (en) 2006-02-02
TWI311585B (en) 2009-07-01
KR20060010366A (en) 2006-02-02
KR100629416B1 (en) 2006-09-28

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