KR102010593B1 - Liquid composition for stripping a color resist and an organic insulating layer - Google Patents
Liquid composition for stripping a color resist and an organic insulating layer Download PDFInfo
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- KR102010593B1 KR102010593B1 KR1020130060161A KR20130060161A KR102010593B1 KR 102010593 B1 KR102010593 B1 KR 102010593B1 KR 1020130060161 A KR1020130060161 A KR 1020130060161A KR 20130060161 A KR20130060161 A KR 20130060161A KR 102010593 B1 KR102010593 B1 KR 102010593B1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/325—Non-aqueous compositions
- G03F7/327—Non-aqueous alkaline compositions, e.g. anhydrous quaternary ammonium salts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Optical Filters (AREA)
Abstract
The present invention relates to a color resist and organic insulating film release liquid composition comprising a quaternary ammonium salt compound, a polar solvent, an alkyl amine, an alkoxy alkylamine of [Formula 1], an inorganic base or a salt compound thereof and water. .
[Formula 1]
(In Formula 1, R 1 is a C 1 ~ C 6 chain or cyclic alkoxy group, the alkoxy group is substituted with a C 1 ~ C 6 chain or cyclic alkyl group, or C 1 ~ C 3 alkoxy group R 2 and R 3 are each independently hydrogen or a C 1 to C 6 chain or cyclic alkyl group, and n is an integer of 1 to 4).
Description
The present invention relates to a color resist and organic insulating film release liquid composition for removing a cured color resist and an organic insulating film of a color filter to reuse the color filter.
The color filter is embedded in a color imaging device of an image sensor such as a complementary metal oxide semiconductor (CMOS) or a charge coupled device (CCD), and may be used to actually obtain a color image. In addition, it is widely used in photographing devices, plasma display panels (PDPs), liquid crystal displays (LCDs), field emission displays (FELs), and light emitting displays (LEDs), and its application range is rapidly expanding. In particular, in recent years, the use of LCDs has been further expanded. Accordingly, color filters have been recognized as one of the most important components in reproducing the color tone of LCDs.
The color filter substrate is composed of a red matrix, a green matrix, a blue matrix, and a black matrix, which serves to block leakage light and improve contrast between pixels, and a common electrode for applying a voltage to the liquid crystal cell. It consists of.
The color filter is manufactured by applying a black matrix material selected according to the application to a glass substrate, forming a black mask pattern, and then forming an RGB color resist pattern by a photolithography process.
While a bad color filter may inevitably occur during the manufacturing process of such a color filter, it is necessary to develop a composition for removing the cured color resist for reuse of the bad color filter.
In addition, in the current flat panel display device manufacturing process, an organic insulating film is used for coating the color filter, so if the RGB of the color filter has a coating defect or a coating defect of the organic insulating film occurs, the coating defect is replaced instead of discarding the color filter. Since the process of removing the surface has the effect of improving the yield and cost reduction of the process, there is a need for a peeling liquid composition that can simultaneously remove the RGB color resist and organic insulating film for reuse of the color filter.
Korean Patent Laid-Open Publication No. 10-2009-0019299 discloses a color resist stripper composition comprising an inorganic alkali hydroxide or an alkylammonium hydroxide, an alkylene glycol or an alkylene glycol ether, a hydroxyl amine, an alkoxyalkylamine and a residual amount of water. However, the use of hydroxyl amine has a problem in that the removal of deterioration in long-term use due to volatilization during the high temperature process, and also does not exhibit the effect of removing the color resist and the organic insulating film at a high speed at the same time.
In order to solve the problems of the prior art, the present invention is to remove the cured color resist and the organic insulating film of the color filter at the same time at a high speed, to provide a color resist and organic insulating film release liquid composition to enable reuse of the color filter For the purpose of
In order to achieve the above object, the present invention, based on the total weight of the composition, 1-10% by weight of the quaternary ammonium salt compound, 40-80% by weight polar solvent, 1-20% by weight alkyl amine, alkoxy alkyl of [Formula 1] Provided is a color resist and an organic insulating film release liquid composition comprising 1-10% by weight of an amine, 0.001-1% by weight of an inorganic base or a salt compound thereof, and 1-40% by weight of water.
[Formula 1]
In Formula 1, R 1 is a C 1 ~ C 6 chain or cyclic alkoxy group, the alkoxy group is substituted with a C 1 ~ C 6 chain or cyclic alkyl group, or C 1 ~ C 3 alkoxy group R 2 and R 3 are each independently hydrogen or a C 1 to C 6 chain or cyclic alkyl group, and n is an integer from 1 to 4.
The stripper composition of the present invention is used to remove the cured RGB and transparent organic insulating film of the LCD color filter and minimizes the filter clogging in the equipment by dissolving the resin, and effectively removes the color filter and the organic insulating film to reuse the glass or the lower deposition film. It can improve productivity of rework.
1 is a graph showing the results of volatilization evaluation of the compositions of Example 3 and Comparative Example 6 of the present invention in an open cup at 70 ℃.
2 is a graph showing the results of evaluating the removability of the color resist substrate while volatilizing the compositions of Example 3 and Comparative Example 6 with an open cup at 70 ° C.
Hereinafter, the present invention will be described in more detail.
The present invention, 1-10% by weight of the quaternary ammonium salt compound, 40-80% by weight polar solvent, 1-20% by weight alkyl amine, 1-10% by weight alkoxy alkylamine of [Formula 1], Provided is a color resist and an organic insulating film release liquid composition comprising 0.001-1% by weight of an inorganic base or a salt compound thereof and 1-40% by weight of water.
[Formula 1]
In Formula 1, R 1 is a C 1 ~ C 6 chain or cyclic alkoxy group, the alkoxy group is substituted with a C 1 ~ C 6 chain or cyclic alkyl group, or C 1 ~ C 3 alkoxy group R 2 and R 3 are each independently hydrogen or a C 1 to C 6 chain or cyclic alkyl group, and n is an integer from 1 to 4.
The organic insulating layer is not only stacked on the color filter to protect the color filter, but also used as an insulating layer for preventing the connection between metal electrodes stacked on the glass. The organic insulating film is made of an acrylic polymer resin, a polyimide resin, a polyether sulfone resin, or the like. The composition of the present invention can remove not only the cured color resist but also the organic insulating film for reuse of the color filter.
The hydroxide ions produced by the quaternary ammonium salt compound penetrate into the color polymer resist to promote dissolution of the polymer resist.
The quaternary ammonium salt compound is selected from the group consisting of tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide (TEAH), tetrapropylammonium hydroxide (TPAH) and tetrabutylammonium hydroxide (TBAH) Although it is preferable that it is 1 or more types, it is not necessarily limited to this.
The quaternary ammonium salt compound is preferably included in 1 to 10% by weight based on the total weight of the composition. When included in less than 1% by weight, penetration of the hydroxide ions into the color resist polymer is reduced, and when it exceeds 10% by weight, the water content is increased to decrease the solubility in the polymer resin.
The polar solvent serves to penetrate the swollen polymer resist to dissolve the resist.
The polar solvent is preferably at least one selected from the group consisting of dimethyl sulfoxide, diethyl sulfoxide, dipropyl sulfoxide, sulfolane, n-methylpyrrolidone, pyrrolidone and n-ethylpyrrolidone. However, the present invention is not limited thereto.
The polar solvent is preferably included in 40 to 80% by weight based on the total weight of the composition. If it is included in less than 40% by weight, the solubility of the polymer resin is lowered, and if it exceeds 80% by weight, the activity of the ammonium salt compound is inhibited and the removal is rather deteriorated.
The alkylamine serves to dissolve the dye component of the color resist.
The alkylamine may be a primary amine including methyl amine, ethylamine, isopropyl amine and monoisopropylamine; Secondary amines including diethyl amine, diisopropyl amine and dibutylamine; Tertiary amines including trimethylamine, triethylamine, triisopropylamine and tributylamine; Diamines including ethylenediamine, propylenediamine, 1,3-propanediamine and 1,2-propylenediamine; And a polyamine including diethylenetriamine, dihexylenetriamine, triethylenetetramine, and tetraethylenepentaamine, but is not necessarily limited thereto.
The alkylamine is preferably included in 1 to 20% by weight based on the total weight of the composition. If it is included in less than 1% by weight, it is difficult to dissolve the dye component of the color resist, if it exceeds 20% by weight is not economical because there is no increase in the effect of the increase and the polymer resist due to the relative decrease of the quaternary alkylammonium compound and polar solvent The solvent power of falls.
The alkoxy alkylamine is a compound represented by the following formula (1).
[Formula 1]
In Formula 1, R 1 is a C 1 ~ C 6 chain or cyclic alkoxy group, the alkoxy group is substituted with a C 1 ~ C 6 chain or cyclic alkyl group, or C 1 ~ C 3 alkoxy group R 2 and R 3 are each independently hydrogen or a C 1 to C 6 chain or cyclic alkyl group, and n is an integer from 1 to 4.
The alkoxy alkylamines are methoxyethylamine, methoxypropylamine, ethoxypropylamine, propoxyethylamine, isopropoxypropylamine, methoxyethoxypropylamine, oxolan-2-yl-methanamine, (jade It is preferably one or more selected from the group consisting of solan-2-yl-methyl) butan-1-amine and methyloxolane-2-yl-methanamine, but is not necessarily limited thereto.
The alkoxy alkylamine compound of [Formula 1] is preferably included in 1 to 10% by weight based on the total weight of the composition. When included in less than 1% by weight, the force to break the bond due to penetration in the cured resin is reduced, when the content exceeds 10% by weight due to the relative decrease of the quaternary alkylammonium compound and polar solvent decreases the solubility of the polymer resist.
The inorganic base or a salt compound thereof improves the peeling force on the organic insulating film, and may include a metal salt made of lithium, sodium or potassium, and specifically, sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium bicarbonate and bicarbonate. It is preferably one or more selected from the group consisting of potassium, sodium nitrate, potassium nitrate, sodium sulfate, potassium sulfate, sodium silicate, potassium silicate, sodium acetate, and potassium acetate, but is not necessarily limited thereto.
The inorganic base or a salt compound thereof is preferably included in 0.001 to 1.0% by weight based on the total weight of the composition. When the amount is less than 0.001% by weight, the peeling force of the organic insulating layer is lowered. When the amount is more than 1% by weight, the effect of the increase is insignificant and economical.
The water may be included in 1 to 40% by weight based on the total weight of the composition. When water is added, the activation rate of the alkali-based compound is improved to increase the removal rate of the resist, and during the rinsing process, the organic contaminants and the resist stripping solution remaining on the substrate can be quickly and completely removed.
In the above, water is water for a semiconductor process, and it is preferable to use deionized water whose specific resistance value is 18 M (ohm) / cm or more.
Hereinafter, the present invention will be described in more detail with reference to Examples. However, the following examples are intended to illustrate the present invention more specifically, but the scope of the present invention is not limited by the following examples.
(1) Preparation of Stripping Liquid Composition
The components shown in Table 1 were mixed according to a predetermined composition ratio to prepare exfoliating solution compositions of Examples 1 to 13 and Comparative Examples 1 to 6.
(2) Evaluation of Removability of Color Resist
The removal evaluation of the color resist used the color filter substrate in which Red, Green, and Blue (hereafter RGB) were apply | coated, respectively. The color resist was prebaked at 90 ° C. for 120 seconds after coating, followed by exposure and development. Thereafter, the substrate on which the pattern was formed in the oven was hardbaked in a 220 ° C. oven to prepare.
In order to confirm the removal of the color resist, it was immersed in a solution of 70 ° C. for 3 minutes, 5 minutes, and 10 minutes to determine whether the resist remained by optical microscope.
◎: 100% removal of resist
○: Remove 80% or more of resist
△: remove less than 80% of resist
X: No resist removed
(3) Evaluation of Removability of Organic Insulating Film
In order to confirm the removability of the organic insulating film, an organic insulating film was coated on the glass substrate, and then, the hard-baked substrate was used for 5 minutes and 10 minutes in a solution at 70 ° C. to confirm whether the organic insulating film remained by an optical microscope. The results are shown in Table 2 below.
◎: 100% removal of organic insulating film
○: Remove 80% or more of organic insulating film
△: less than 80% of organic insulating film
X: organic insulating film not removed
A1: isopropylamine
A2: diethylamine
A3: ethylenediamine
A4: Propylenediamine
A5: diethylenetriamine
B1: methoxypropylamine
B2: propoxyethylamine
B3: oxolan-2-yl-methanamine
B4: ethoxypropylamine
HA: hydroxylamine
MDG: Diethylene Glycol Monomethyl Ether
As shown in Table 2, the peeling liquid composition of Examples 1 to 13 of the present invention removed 80% or more of the color filter resist within 3 minutes, 100% of the resist is removed within 5 minutes is very excellent peeling force Could see. In addition, it was found that 100% of the organic insulating film resists were also removed within 10 minutes, thereby exhibiting excellent removal effect not only of RGB but also of the organic insulating film.
On the other hand, the compositions of Comparative Examples 1 to 5 required a long time to remove not only the RGB but also the organic insulating layer, and it was understood that the removal effect was also insufficient.
According to the results of the above Examples and Comparative Examples, when the alkyl amine and the alkoxy alkylamine are included at the same time than when the alkyl amine or alkoxy alkylamine is used alone, the removal effect of the RGB substrate and the organic insulating film is better. It was found that the wet penetration of the resist was facilitated by the synergistic effect of the alkyl amine having good RGB removal effect and the alkoxy alkylamine having good organic insulating film removal effect, thereby improving the resist removal rate.
When the hydroxyl amine and the alkoxy alkylamine in the composition are included at the same time as in Comparative Example 6, it is difficult to remove the RGB or organic insulating film in a short time, and the consumption of the chemical liquid is increased due to excessive volatilization at high temperature, resulting in deterioration of performance. It was difficult to use for a long time.
Figure 1 shows the results of the volatilization evaluation of the compositions of Example 3 and Comparative Example 6 of the present invention in an open cup at 70 ℃. In spite of the same temperature, in the case of Comparative Example 6, since more than twice the chemical liquid volatilized, the consumption of the chemical liquid required to remove the RGB and the organic insulating film increased. 2 shows the results of evaluating the removability of the color resist substrate while volatilizing the compositions of Example 3 and Comparative Example 6 with an open cup at 70 ° C. As the volatilization speed is high, the performance deterioration over time also appears to be rapid.
As described above, the color resist and the organic insulating film release liquid composition of the present invention could not only sufficiently remove the color resist of the color filter but also sufficiently remove the organic insulating film, thereby improving the productivity of color filter reuse. .
Claims (6)
[Formula 1]
In Formula 1, R 1 is a C 1 ~ C 6 chain or cyclic alkoxy group, the alkoxy group is substituted with a C 1 ~ C 6 chain or cyclic alkyl group, or C 1 ~ C 3 alkoxy group R 2 and R 3 are each independently hydrogen or a C 1 to C 6 chain or cyclic alkyl group, and n is an integer from 1 to 4.
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KR1020130060161A KR102010593B1 (en) | 2013-05-28 | 2013-05-28 | Liquid composition for stripping a color resist and an organic insulating layer |
CN201410225582.3A CN104216242B (en) | 2013-05-28 | 2014-05-26 | Stripping composition for chromatic photoresist and organic insulating film |
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KR100629416B1 (en) * | 2004-07-28 | 2006-09-28 | 주식회사 삼양이엠에스 | Aqueous resist stripper formulation |
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