CN105368611B - Cleaning compositions - Google Patents
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- CN105368611B CN105368611B CN201510479447.6A CN201510479447A CN105368611B CN 105368611 B CN105368611 B CN 105368611B CN 201510479447 A CN201510479447 A CN 201510479447A CN 105368611 B CN105368611 B CN 105368611B
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Abstract
The present invention relates to one kind for removing chromatic photoresist, the cleaning compositions of organic insulator and transparent resin, total weight based on the composition, include: (a) quarternary ammonium salt compound of 1~10wt%, (b) polar solvent of 40~80wt%, (c) alkoxyalkyl amine of 1~20wt% indicated by following chemical formula 1, (d) hydroxylamine compound of 0.1~5wt%, (e) amide of 1~20wt% indicated by following chemical formula 2, (f) alkylene glycol dialkylether of 1~20wt%, (g) salt of the inorganic base of 0.01~2wt% or the inorganic base, (h) water of 1~40wt%.
Description
Technical field
The present invention relates to a kind of for removing chromatic photoresist, organic insulator and the cleaning compositions of transparent resin.
Background technique
Colored filter actually can be by being built in such as complementary metal oxide semiconductor (CMOS) or Charged Couple
It is used to obtain color image in the colour phhotograpy device of the imaging sensor of device (CCD).In addition, it is widely used in image
Sensing element, plasma display (PDP), liquid crystal display (LCD), Field Emission Display (FEL) and active display
(LED) etc., and their application range has expanded rapidly.
In particular, the purposes of LCD has been further enlarged recently, thus colored filter has been considered as reappearing
One of most important component part of the tone of LCD.
On the other hand, photoresist can be roughly divided into positivity photoresist and negativity photoresist.It removes and can pass through different from being relatively easy to
The at a temperature of positivity photoresist that removes in one minute based on the remover of organic solvent at 40 DEG C to 50 DEG C, chromatic photoresist have
The feature of negativity photoresist has high solidification degree and is difficult to remove due to being hardened with heat treatment.
Then, the time that chromatic photoresist needs at least 5 minutes is removed under conditions of being higher than 70 DEG C, thus it is expected stronger
Stripping performance.
Currently, organic insulator is used for the coating of colored filter in the manufacturing process of flat-panel monitor.Therefore,
When occurring holiday in the RGB of colored filter or holiday occur in the organic insulator of colored filter, such as
Fruit only removes holiday part rather than discarded colored filter, then can get the effect for improving yield and reducing process costs
Fruit.Then, the recycling of colored filter needs the cleaning group that simultaneously can all remove RGB color photoresist and organic insulator
Close object.
In addition, making in the case where the transparent photoresist of RGBW forms four dot structures and improves the light efficiency of oled panel
It is higher than chromatic photoresist or organic insulator with curing degree and there is the resin of high thermal stability and chemical stability to cause to remove
More difficult problem.
Therefore, it in order to recycle the defective colored filter generated during the preparation process of chromatic photoresist, needs
Develop the cleaning compositions that simultaneously effective can all remove chromatic photoresist, organic insulator and transparent resin.
In order to solve this problem, Korean Patent Publication 10-2003-0026664 discloses one kind and contains hydroxide
Make chromatic photoresist remover combination as main component, and Korean Patent Publication 10-2014-0028962 discloses one
Kind for remove the photic photoresist of negativity comprising diethylenetriamines, alkyl ammonium hydroxide, dimethyl sulfoxide and water remover
Composition.
However, it does not also show even if the prior art realizes desired performance in terms of remove chromatic photoresist
Partly or entirely remove the effect of organic insulator or transparent resin.
In addition, the remover combination based on hydroxide compound has the problem of causing inorganic base to be precipitated, also, by
The water evaporation under high-temperature technology, inorganic base metal acetate is also used as powder to be precipitated, and this may cause defect.
Then, needing to develop one kind effectively can all remove chromatic photoresist, organic insulator and transparent resin substrate
And without the cleaning compositions of isolation problem at high temperature.
Patent document
Patent document 1: Korean Patent Publication 10-2003-0026664
Patent document 2: Korean Patent Publication 10-2014-0028962
Summary of the invention
Then, the problem of present invention in related fields in view of encountering, and it is an object of the present invention to provide one kind
Effectively the chromatic photoresist of colored filter, organic insulator and transparent resin substrate all can be removed in a short time and
Without the cleaning compositions of isolation problem at high temperature.
To achieve the goals above, the present invention provides one kind for removing chromatic photoresist, organic insulator and transparent tree
The cleaning compositions of rouge include based on the total weight of the composition:
(a) quarternary ammonium salt compound of 1~10wt%, (b) polar solvent of 40~80wt%, (c) 1~20wt% by changing
The alkoxyalkyl amine that formula 1 indicates, (d) hydroxylamine compound of 0.1~5wt%, (e) 1~20wt% is indicated by chemical formula 2
Amide, (f) alkylene glycol dialkylether of 1~20wt%, (g) inorganic base of 0.01~2wt% or its salt, and (h) 1~
The water of 40wt%.
Cleaning compositions of the invention can be effectively complete by chromatic photoresist, organic insulator and transparent resin in a short time
Portion removes, thus the productivity for recycling colored filter can be improved in it.
In particular, cleaning compositions of the invention can be by from the colored filter in LCD colored filter or TFT substrate
Substrate in integrated morphology removes cured chromatic photoresist and organic insulator and the transparent resin of high crosslink density carrys out benefit again
With defective substrate.
Further, due to not using the inorganic alkali hydroxide with alkali metal base (alkali base), sheet
The cleaning compositions of invention are under high-temperature technology not due to caused by evaporation remover the problem of precipitation inorganic base.
Specific embodiment
Hereinafter, it detailed description will be given of the present invention.
A kind of cleaning combination for removing chromatic photoresist, organic insulator and transparent resin is provided according to the present invention
Object is, characterized by comprising: (a) quarternary ammonium salt compound, (b) polar solvent, (c) alkoxyalkyl indicated by chemical formula 1
Amine, (d) hydroxylamine compound, (e) amide indicated by chemical formula 2, (f) alkylene glycol dialkylether, (g) inorganic base or its
Salt, and (h) water.
Cleaning compositions of the invention have the advantage that it can in a short time effectively will be colored by above-mentioned composition
Photoresist, organic insulator and transparent resin all remove, thus the productivity for recycling colored filter can be improved in it.
Quarternary ammonium salt compound (a)
Quarternary ammonium salt compound of the invention discharges hydroxide ion, and it penetrates into photoresist and plays promotion polymer light
Hinder the effect of dissolution.
Quarternary ammonium salt compound can be selected from by tetramethylammonium hydroxide (TMAH), tetraethyl ammonium hydroxide (TEAH), four
The group of propyl ammonium hydroxide (TPAH) and tetrabutylammonium hydroxide (TBAH) composition is any one or more of.
In the present invention, based on the total weight of composition, the amount of quaternary ammonium salt is preferably 1~10wt%.If quaternary ammonium salt exists
Amount in cleaning compositions of the invention is less than 1wt%, then hydroxide ion enters the penetrating power of the polymer of chromatic photoresist
It reduces.On the contrary, the amount of water increases, to reduce the dissolubility of fluoropolymer resin if its amount is more than 10wt%.
Polar solvent (b)
Polar solvent of the invention improves the peel force to substrate surface by infiltration photoresist and raising water-swellable
(peel strength).Further, it improves the dissolubility of photoresist stripping composition of the invention in water, and can
It is easy to remove residue after water-washing step.
Polar solvent can be selected from by dimethyl sulfoxide, diethyl sulfoxide, dipropyl sulfoxide, sulfolane
(sulforan), one of group of N-Methyl pyrrolidone, pyrrolidones and N- ethyl pyrrolidone composition or a variety of.
In the present invention, based on the total weight of composition, the amount of polar solvent is preferably 40~80wt%.
If amount of the polar solvent in cleaning compositions of the invention is less than 40wt%, the dissolving power of fluoropolymer resin
It may decline.On the contrary, the activity of ammonium salt compound is suppressed if its amount is more than 80wt%, and removability deteriorates.
The alkoxyalkyl amine (c) indicated by chemical formula 1
Alkoxyalkyl amine of the invention penetrates into cured resin, and for being broken the key of polymer and dissolving poly-
Close object.
In the present invention, alkoxyalkyl amine is the compound indicated by following chemical formula 1,
[chemical formula 1]
In chemical formula 1, R1It is C1~C6The alkoxy of acyclic or cyclic, the alkoxy can be by C1~C6Acyclic or cyclic
Alkyl or C1~C3Alkoxy replaces；R2And R3It is hydrogen or C each independently1~C6The alkyl of acyclic or cyclic；And n is 1 to 4
Integer.
In particular, can be by the alkoxyalkyl amine that chemical formula 1 above indicates selected from by methoxyethyl amine, first
Oxygroup propylamine, ethoxy propylamine, propoxyl group ethamine, isopropoxy propylamine, methoxy ethoxy propylamine, butyl oxide link -2- base-first
Amine, (butyl oxide link -2- base-methyl) butane -1- amine and methyl butyl oxide link -2- base-methylamine composition group are any one or more of.
In the present invention, based on the total weight of composition, the amount of alkoxyalkyl amine is preferably 1~20wt%.If alkane
Amount of the oxygroup alkylamine in cleaning compositions of the invention is less than 1wt%, then penetrates into the ability that cured resin is broken key
It reduces.On the contrary, the dissolving power of polymer photoresist is due to alkyl quaternary ammonium compound and polar solvent if its amount is more than 20wt%
Deteriorated with respect to reduction.
Hydroxylamine compound (d)
Hydroxylamine compound of the invention generates hydroxide ion due to low molecular weight structure in a short time, and permeable
Cured resin, is broken key, and the dye component for dissolving photoresist.
Hydroxylamine compound can be selected from any one of group for being made of azanol, dimethyl hydroxylamine and diethyl hydroxylamine or
It is a variety of.
In the present invention, based on the total weight of composition, the amount of hydroxylamine compound is preferably 0.1~5wt%.If azanol
Amount of the compound in cleaning compositions of the invention is less than 0.1wt%, then is difficult to be completely dissolved the dye component of photoresist.Phase
Instead, if its amount is more than 5wt%, effect does not enhance as amount increases, thus, it is not economically preferred, and
The dissolving power of polymer photoresist is reduced due to organic quaternary ammonium hydroxide and polar solvent with respect to reduction.
The amide (e) indicated by chemical formula 2
The amide (e) indicated by chemical formula 2 of the invention promotes the swelling of bright resin layer, thus what raising was dissolved from substrate
Rate.
In the present invention, amide is the compound indicated by following chemical formula 2,
[chemical formula 2]
In chemical formula 2, R4、R5And R6It is hydrogen or C each independently1~C4The alkyl or phenyl of acyclic or cyclic.
It in detail, is selected from by formamide, acetamide, benzamide, N- methyl-prop by the amide that chemical formula 2 indicates
Amide, propionamide, butyramide, DMAC N,N' dimethyl acetamide, N- methylacetamide, N, N- dimethylpropionamide, N- ethyl-N- first
The group of base benzamide, N- phenylbutanamides and phenylbenzamide composition is any one or more of.
The present inventor experiments prove that: by the way that the amide indicated by chemical formula 2 above is introduced into this
The cleaning compositions of invention astoundingly improve cleaning effect.
In the present invention, based on the total weight of composition, the amount of amide is preferably 1~20wt%.If amide is in this hair
Amount in bright cleaning compositions is less than 1wt%, then cannot remove effectively transparent resin.On the contrary, if its amount is more than
20wt%, the then effect removed no longer enhance as amount increases.
Alkylene glycol dialkylether (f)
Alkylene glycol dialkylether of the invention penetrates into organic insulator and makes its swelling, thus play promotion from
The effect being dissolved out in substrate.
Alkylene glycol dialkylether can be selected from by glycol dimethyl ether, diethylene glycol dimethyl ether, triethylene glycol two
Methyl ether, diethylene glycol diethyl ether, diethylene glycol ethylmethyl ether, diethylene glycol methyl-n-butyl ether, Propylene Glycol Dimethyl Ether and dipropylene glycol diformazan
The group of ether composition is any one or more of.
In the present invention, based on the total weight of composition, the amount of alkylene glycol dialkylether is preferably 1~20wt%.
If amount of the alkylene glycol dialkylether in cleaning compositions of the invention is less than 1wt%, the swelling of photoresistive polymer
The penetrating power for the polymer that effect reduces and hydroxide ion enters chromatic photoresist also reduces.On the contrary, if its amount is more than
20wt%, then effect no longer enhances as amount increases, and also reduces to the dissolubility of inorganic salts.
Inorganic base or its salt (g)
Inorganic base of the invention or its salt are used to improve the peel force to organic insulator.
Inorganic base of the invention or its salt can be selected from by sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, carbonic acid
The group that hydrogen sodium, sodium nitrate, potassium nitrate, sodium sulphate, potassium sulfate, sodium metasilicate and potassium silicate form is any one or more of.
In the present invention, based on the total weight of composition, amount preferably 0.01~2wt% of inorganic base or its salt.If nothing
The amount of machine alkali or its salt in cleaning compositions of the invention is less than 0.01wt%, then peel force of the invention reduces.On the contrary,
If its amount is more than 2wt%, effect no longer enhances as amount increases, to economically be not preferred.
Water (h)
Water of the invention is suitably contained in composition, and adjusts the total composition of composition, and it is used to improve
The activity of hydroxide ion.
Water can be comprised in composition with the surplus of other group components relative to composition.In particular, the amount of water
Preferably 1~40wt%.
Cleaning compositions of the invention are characterized in that the composition does not include alkylene glycol monoalkyl ethers.Pass through experiment
Confirm: the alkylene glycol monoalkyl ethers in cleaning compositions of the invention be it is undesirable because organic film coating base
The wetability of plate reduces, so that the rate of dissolution of resin also declines, and to chromatic photoresist substrate, organic insulation structure base board and thoroughly
The cleaning effect of bright resin substrate also highly reduces.
Cleaning compositions of the invention most possibly include: tetramethylammonium hydroxide (TMAH), as the quaternization
It closes object (a)；Dimethyl sulfoxide (DMSO), as the polar solvent (b)；Methoxyethyl amine, methoxy propanamine, ethoxy propylamine
With one of propoxyl group ethamine or a variety of, as the alkoxyalkyl amine (c)；DMAC N,N' dimethyl acetamide, N- methyl-prop
One of amide, N- methylacetamide and N, N- dimethylpropionamide are a variety of, as the amide (e)；Glycol dinitrate
One of ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether and Propylene Glycol Dimethyl Ether are a variety of, as the alkylidene two
Alcohol dialkyl ether (f)；With one of sodium nitrate, sodium hydroxide, potassium hydroxide, sodium bicarbonate, potassium carbonate and sodium carbonate or more
Kind, as the inorganic base or its salt (g).
Cleaning compositions of the invention are in terms of the ability for all removing chromatic photoresist, organic insulator and transparent resin
With excellent effect.
Chromatic photoresist can be negative-type photosensitive, but not limited to this；Organic insulator can be acrylic resin, but not
It is limited to this；And transparent resin can be the high crosslink density as obtained from epoxy-functional is added to polyacrylate
Resin, but not limited to this.
By for being proposed and explanation without being interpreted that the embodiment below the limitation present invention can be more preferable geographical
The solution present invention.Although the preferred embodiment of the present invention has been disclosed for the purpose of explanation, those skilled in the art will be managed
Solution various modifications, increase and replacement in the case where not departing from scope and spirit of the present invention disclosed in appended claims are all possible
's.
Embodiment and comparative example: the preparation of cleaning compositions
By preparing each of embodiment 1 to 10 and comparative example 1 to 10 with amount mixing each component shown in following table 1
Cleaning compositions.
[table 1]
(a) organic hydroxide quaternary ammonium
TMAH: tetramethylammonium hydroxide,
TEAH: tetraethyl ammonium hydroxide
(b) polar solvent
DMSO: dimethyl sulfoxide
(c) alkoxyalkyl amine
AA1: methoxyethyl amine
AA2: methoxy propanamine
AA3: ethoxy propylamine
AA4: propoxyl group ethamine
DETA: diethylenetriamines
(e) amide
AM1:N, N- dimethyl acetamide
AM2:N- methyl propanamide
AM3:N- methylacetamide
AM4:N, N- dimethylpropionamide
AM5:3- methoxy-propyl acrylamide
(f) alkylene glycol dialkylether
AGE1: glycol dimethyl ether
AGE2: diethylene glycol dimethyl ether
AGE3: diethylene glycol diethyl ether
AGE4: Propylene Glycol Dimethyl Ether
MDG: diethylene glycol monomethyl ether
Test example 1: the evaluation of chromatic photoresist is removed
In order to evaluate the ability for removing chromatic photoresist by the cleaning compositions of embodiment and comparative example preparation, use is red, it is green,
Blue (hereinafter referred to as " RGB ") is coated with colored filter substrate on it.
By making experience coating, at 90 DEG C prebake conditions 120 seconds, exposure, development and the then hard baking in 220 DEG C of baking oven
The substrate of pattern is formed to prepare colored filter substrate.
In order to confirm the ability of the cleaning compositions removing chromatic photoresist by embodiment and comparative example preparation, make at 70 DEG C
The colored filter substrate that RGB is coated on immerses above-mentioned composition 5 minutes and 10 minutes, then by using optical microphotograph
Mirror is confirmed whether to remain photoresist.According to following standard evaluation result, and it is shown in following table 2.
◎: 100% photoresist is removed
Zero: 80% or more photoresist is removed
△: the photoresist lower than 80% is removed
X: photoresist is not removed
Test example 2: the evaluation of organic insulator is removed
In order to evaluate the ability for removing organic insulator, polyacrylate resin (PAC resin) is coated in glass substrate
On, and carried out prebake 120 seconds at 90 DEG C.Hereafter, by forming pattern via exposure and imaging, then by 220
DEG C baking oven in the hard baking substrate prepare organic insulator photoresist.In addition, being crossed after coating organic insulator using hard baking
Substrate.
In order to confirm the ability of the cleaning compositions removing organic insulator by embodiment and comparative example preparation, at 70 DEG C
It immerses organic insulation structure base board above-mentioned composition 5 minutes and 10 minutes, is then confirmed whether by using optical microscopy residual
Stay organic insulator photoresist.These are evaluated as a result, and being shown in following table 2 according to following standard.
◎: 100% photoresist is removed
Zero: 80% or more photoresist is removed
△: the photoresist lower than 80% is removed
X: photoresist is not removed
Test example 3: the evaluation of transparent resin layer is removed
It, will be by will have the compound of epoxy group to be added to acrylic acid in order to evaluate the ability for removing transparent resin layer
The transparent resin coating that ester monomer is copolymerized on the glass substrate, and carries out prebake 120 seconds at 90 DEG C.This
Afterwards, by forming pattern via exposure and imaging, then by 220 DEG C of baking oven hard baking substrate prepare transparent resin
Layer.In addition, after coating transparent resin layer, the substrate crossed using hard baking.
In order to confirm the ability of the cleaning compositions removing transparent resin layer by embodiment and comparative example preparation, at 70 DEG C
It immerses transparent resin laminar substrate above-mentioned composition 5 minutes and 10 minutes, is then confirmed whether by using optical microscopy residual
Stay transparent resin layer photoresist.These are evaluated as a result, and being shown in following table 2 according to following standard.
◎: 100% photoresist is removed
Zero: 80% or more photoresist is removed
△: the photoresist lower than 80% is removed
X: photoresist is not removed
[table 2]
By table 2 above it is found that the cleaning compositions of embodiment 1 to 10 are by chromatic photoresist substrate, organic insulation structure base board
The ability all removed with transparent resin substrate is excellent.
Otherwise, the cleaning compositions of comparative example 1 to 8, not comprising any of composition of the invention or in the amount of each composition
Range except, show to remove chromatic photoresist substrate, the ability of organic insulation structure base board and transparent resin substrate poor.Into one
Step ground, confirm also by experiment: the cleaning compositions comprising alkylene glycol monoalkyl ethers of comparative example 9 to 10 show to remove
Go the ability of chromatic photoresist substrate, organic insulation structure base board and transparent resin substrate poor.
Therefore, the productivity for recycling colored filter can be improved in cleaning compositions according to the present invention, because it can be
Time short interior abundant chromatic photoresist, organic insulator and the transparent resin substrate for removing colored filter.
Claims (9)
1. it is a kind of for removing chromatic photoresist, organic insulator and the cleaning compositions of transparent resin, based on the composition
Total weight includes:
(a) quarternary ammonium salt compound of 1~10wt%,
(b) polar solvent of 40~80wt%,
(c) alkoxyalkyl amine of 1~20wt% indicated by following chemical formula 1,
(d) hydroxylamine compound of 0.1~5wt%,
(e) amide of 1~20wt% indicated by following chemical formula 2,
(f) alkylene glycol dialkylether of 4~20wt%,
(g) salt of the inorganic base of 0.01~2wt% or the inorganic base, and
(h) water of 1~40wt%,
It is characterized in that, the composition does not include alkylene glycol monoalkyl ethers,
[chemical formula 1]
Wherein, in chemical formula 1, R1It is C1~C6The alkoxy of acyclic or cyclic, or by C1~C6The alkane of acyclic or cyclic
Base or C1~C3The C that alkoxy replaces1~C6The alkoxy of acyclic or cyclic；R2And R3It is hydrogen or C each independently1~C6It is acyclic
Or cricoid alkyl；And n is 1 to 4 integer；
[chemical formula 2]
Wherein, in chemical formula 2, R4、R5And R6It is hydrogen or C each independently1~C4The alkyl or phenyl of acyclic or cyclic.
2. it is according to claim 1 for removing the cleaning compositions of chromatic photoresist, organic insulator and transparent resin,
In, the quarternary ammonium salt compound (a) be selected from by tetramethylammonium hydroxide, tetraethyl ammonium hydroxide, tetrapropylammonium hydroxide and
The group of tetrabutylammonium hydroxide composition is any one or more of.
3. it is according to claim 1 for removing the cleaning compositions of chromatic photoresist, organic insulator and transparent resin,
In, the polar solvent (b) is selected from by dimethyl sulfoxide, diethyl sulfoxide, dipropyl sulfoxide, sulfolane, N- methylpyrrole
The group of alkanone, pyrrolidones and N- ethyl pyrrolidone composition is any one or more of.
4. it is according to claim 1 for removing the cleaning compositions of chromatic photoresist, organic insulator and transparent resin,
In, it is selected from by methoxyethyl amine, methoxy propanamine, ethoxy-c by the alkoxyalkyl amine (c) that chemical formula 1 indicates
Amine, propoxyl group ethamine, isopropoxy propylamine, methoxy ethoxy propylamine, butyl oxide link -2- base-methylamine, (butyl oxide link -2- base-first
Base) butane -1- amine and methyl butyl oxide link -2- base-methylamine composition group is any one or more of.
5. it is according to claim 1 for removing the cleaning compositions of chromatic photoresist, organic insulator and transparent resin,
In, the hydroxylamine compound (d) is to be selected from any one of group being made of azanol, dimethyl hydroxylamine and diethyl hydroxylamine or more
Kind.
6. it is according to claim 1 for removing the cleaning compositions of chromatic photoresist, organic insulator and transparent resin,
In, it is selected from by formamide, acetamide, benzamide, N- methyl propanamide, propionyl by the amide (e) that chemical formula 2 indicates
Amine, butyramide, DMAC N,N' dimethyl acetamide, N- methylacetamide, N, N- dimethylpropionamide, N- ethyl-N-methyl benzamide,
The group of N- phenylbutanamides and phenylbenzamide composition is any one or more of.
7. it is according to claim 1 for removing the cleaning compositions of chromatic photoresist, organic insulator and transparent resin,
In, the alkylene glycol dialkylether (f) is selected from by glycol dimethyl ether, diethylene glycol dimethyl ether, triethylene glycol diformazan
Ether, diethylene glycol diethyl ether, diethylene glycol ethylmethyl ether, diethylene glycol methyl-n-butyl ether, Propylene Glycol Dimethyl Ether and dimethyl ether
The group of composition is any one or more of.
8. it is according to claim 1 for removing the cleaning compositions of chromatic photoresist, organic insulator and transparent resin,
In, the salt (g) of the inorganic base or the inorganic base is selected from by sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, carbonic acid
The group that hydrogen sodium, sodium nitrate, potassium nitrate, sodium sulphate, potassium sulfate, sodium metasilicate and potassium silicate form is any one or more of.
9. according to claim 1 for removing the cleaning compositions of chromatic photoresist, organic insulator and transparent resin, packet
Contain:
Tetramethylammonium hydroxide, as the quarternary ammonium salt compound (a)；
Dimethyl sulfoxide, as the polar solvent (b)；
One of methoxyethyl amine, methoxy propanamine, ethoxy propylamine and propoxyl group ethamine are a variety of, as the alkoxy
Alkylamine (c)；
One of DMAC N,N' dimethyl acetamide, N- methyl propanamide, N- methylacetamide and N, N- dimethylpropionamide are more
Kind, as the amide (e)；
One of glycol dimethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether and Propylene Glycol Dimethyl Ether are a variety of, make
For the alkylene glycol dialkylether (f)；With
One of sodium nitrate, sodium hydroxide, potassium hydroxide, sodium bicarbonate, potassium carbonate and sodium carbonate are a variety of, as the nothing
The salt (g) of machine alkali or the inorganic base.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20140101060 | 2014-08-06 | ||
| KR10-2014-0101060 | 2014-08-06 | ||
| KR10-2015-0099076 | 2015-07-13 | ||
| KR1020150099076A KR20160017606A (en) | 2014-08-06 | 2015-07-13 | Cleaning composition |
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|---|---|
| CN105368611A CN105368611A (en) | 2016-03-02 |
| CN105368611B true CN105368611B (en) | 2018-12-07 |
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| CN111356759A (en) * | 2017-09-29 | 2020-06-30 | 弗萨姆材料美国有限责任公司 | Stripper solution and method of using stripper solution |
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| CN107526255A (en) * | 2016-06-15 | 2017-12-29 | 东友精细化工有限公司 | Anticorrosive additive stripping liquid controlling composition |
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| KR20090075516A (en) * | 2008-01-04 | 2009-07-08 | 주식회사 켐트로닉스 | Color resist remover composition for tft-lcd preparation |
| CN102834500A (en) * | 2010-05-19 | 2012-12-19 | 东友Fine-Chem股份有限公司 | Cleaning solution composition for electronic material |
| CN102533474A (en) * | 2010-12-30 | 2012-07-04 | 安集微电子（上海）有限公司 | Cleaning solution and cleaning method thereof |
| KR20140028962A (en) * | 2012-08-31 | 2014-03-10 | 주식회사 이엔에프테크놀로지 | Stripper composition for thick negative photoresist |
| CN103676502A (en) * | 2012-08-31 | 2014-03-26 | 易安爱富科技有限公司 | Constituents of thick film negative photoresist stripping agent |
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| CN111356759A (en) * | 2017-09-29 | 2020-06-30 | 弗萨姆材料美国有限责任公司 | Stripper solution and method of using stripper solution |
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