KR102009530B1 - Liquid composition for stripping a color resist and an organic insulating layer - Google Patents

Liquid composition for stripping a color resist and an organic insulating layer Download PDF

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KR102009530B1
KR102009530B1 KR1020130060162A KR20130060162A KR102009530B1 KR 102009530 B1 KR102009530 B1 KR 102009530B1 KR 1020130060162 A KR1020130060162 A KR 1020130060162A KR 20130060162 A KR20130060162 A KR 20130060162A KR 102009530 B1 KR102009530 B1 KR 102009530B1
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organic insulating
insulating film
weight
color resist
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KR1020130060162A
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KR20140139745A (en
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방순홍
김우일
홍헌표
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동우 화인켐 주식회사
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Priority to CN201410225582.3A priority patent/CN104216242B/en
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/325—Non-aqueous compositions
    • G03F7/327—Non-aqueous alkaline compositions, e.g. anhydrous quaternary ammonium salts
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Optical Filters (AREA)

Abstract

The present invention is characterized by comprising a cyclic amine compound of Formula 1, a quaternary ammonium salt compound, a polar organic solvent containing sulfur in a molecule, an alkylamine, an inorganic base or a salt compound thereof, and water, and a color resist. An organic insulating film peeling liquid composition is related.
[Formula 1]

Figure 112013047108716-pat00006

(In Formula 1, A is O, S or N, R 1 is independently hydrogen, a C 1 ~ C 20 alkyl group unsubstituted or substituted with a substituent (the substituent is an amino group, cyano group, hydroxy group or vinyl group C 1 -C 10 alkoxy, acetyl, formyl, phenyl or benzyl group unsubstituted or substituted with a C 2 -C 10 alkenyl group, carboxyl group, amino group, or hydroxy group. If, there is no R 2. when a is N, R 2 is independently hydrogen, C 1 ~ C 10 alkyl group, C 1 ~ C 10 hydroxyalkyl group, a hydroxy group, a substituted or unsubstituted C 1 ~ C 10 alkoxy group, phenyl group or benzyl group.)

Description

Color resist and organic insulating film peeling liquid composition {LIQUID COMPOSITION FOR STRIPPING A COLOR RESIST AND AN ORGANIC INSULATING LAYER}

The present invention relates to a color resist and organic insulating film release liquid composition for removing a cured color resist and an organic insulating film of a color filter to reuse the color filter.

The color filter is embedded in a color imaging device of an image sensor such as a complementary metal oxide semiconductor (CMOS) or a charge coupled device (CCD), and may be used to actually obtain a color image. In addition, it is widely used in photographing devices, plasma display panels (PDPs), liquid crystal displays (LCDs), field emission displays (FELs), and light emitting displays (LEDs), and its application range is rapidly expanding. In particular, in recent years, the use of LCDs has been further expanded. Accordingly, color filters have been recognized as one of the most important components in reproducing the color tone of LCDs.

The color filter substrate is composed of a red matrix, a green matrix, a blue matrix, and a black matrix, which serves to block leakage light and improve contrast between pixels, and a common electrode for applying a voltage to the liquid crystal cell. It consists of.

The color filter is manufactured by applying a black matrix material selected according to the application to a glass substrate, forming a black mask pattern, and then forming an RGB color resist pattern by a photolithography process.

A bad color filter may inevitably occur during the manufacturing process of such a color filter, and a composition for removing the cured color resist is required for reuse of the bad color filter.

In addition, in the current flat panel display device manufacturing process, an organic insulating film is used for coating the color filter, so if the RGB of the color filter has a coating defect or a coating defect of the organic insulating film occurs, the coating defect is replaced instead of discarding the color filter. Since the process of removing the surface has the effect of improving the yield and cost reduction of the process, there is a need for a peeling liquid composition that can simultaneously remove the RGB color resist and organic insulating film for reuse of the color filter.

Korean Patent Registration No. 10-1043397 includes inorganic alkali hydroxide or alkylammonium hydroxide, dimethyl sulfoxide, water-soluble amine compound, N-methylpyrrolidone, dialkylene glycol ether, inorganic alkali acetate and residual water Although a peeling liquid composition for removing a color resist is disclosed, the use of hydroxyl amine not only causes a problem of deterioration in long-term use due to volatilization at a high temperature process, and the effect of simultaneously removing a color resist and an organic insulating layer at a high speed. There is a problem that cannot be represented.

Republic of Korea Patent Registration 10-1043397

In order to solve the problems of the prior art, the present invention is to remove the cured color resist and the organic insulating film of the color filter at the same time at a high speed, to provide a color resist and organic insulating film release liquid composition to enable reuse of the color filter For the purpose of

In order to achieve the above object, the present invention provides a polar organic compound comprising 1-10% by weight of the cyclic amine compound of Formula 1, 1-10% by weight of a quaternary ammonium salt compound, and sulfur in a molecule. A color resist and an organic insulating film release liquid composition comprising 40-80 wt% of a solvent, 1-20 wt% of an alkyl amine, 0.001-1 wt% of an inorganic base or a salt compound thereof, and 1-40 wt% of water. to provide.

[Formula 1]

Figure 112013047108716-pat00001

In Formula 1, A is O, S or N, R 1 is independently hydrogen, a C 1 ~ C 20 alkyl group unsubstituted or substituted with a substituent (the substituent may be an amino group, cyano group, hydroxy group or vinyl group) And C 1 -C 10 alkoxy, acetyl, formyl, phenyl or benzyl groups unsubstituted or substituted with a C 2 -C 10 alkenyl group, carboxyl group, amino group or hydroxy group. When A is O or S, there is no R 2 . When A is N, R 2 is independently hydrogen, C 1 -C 10 alkyl group, C 1 -C 10 hydroxyalkyl group, C 1 -C 10 alkoxy group unsubstituted or substituted with hydroxy group, phenyl group or benzyl Qi.

The stripper composition of the present invention is used to remove the cured RGB and transparent organic insulating film of the LCD color filter and minimizes the filter clogging in the equipment by dissolving the resin, and effectively removes the color filter and the organic insulating film to reuse the glass or the lower deposition film. It can improve productivity of rework.

Hereinafter, the present invention will be described in more detail.

The present invention, 1-10% by weight of the cyclic amine compound of Formula 1, 1-10% by weight of the quaternary ammonium salt compound, 40-80% by weight of a polar organic solvent including sulfur in the molecule, Provided is a color resist and an organic insulating film release liquid composition comprising 1-20% by weight of an alkylamine, 0.001-1% by weight of an inorganic base or a salt compound thereof, and 1-40% by weight of water.

[Formula 1]

Figure 112013047108716-pat00002

In Formula 1, A is O, S or N, R 1 is independently hydrogen, a C 1 ~ C 20 alkyl group unsubstituted or substituted with a substituent (the substituent may be an amino group, cyano group, hydroxy group or vinyl group) And C 1 -C 10 alkoxy, acetyl, formyl, phenyl or benzyl groups unsubstituted or substituted with a C 2 -C 10 alkenyl group, carboxyl group, amino group or hydroxy group. When A is O or S, there is no R 2 . When A is N, R 2 is independently hydrogen, C 1 -C 10 alkyl group, C 1 -C 10 hydroxyalkyl group, C 1 -C 10 alkoxy group unsubstituted or substituted with hydroxy group, phenyl group or benzyl Qi.

The organic insulating layer is not only stacked on the color filter to protect the color filter, but also used as an insulating layer for preventing the connection between metal electrodes stacked on the glass. The organic insulating film is made of an acrylic polymer resin, a polyimide resin, a polyether sulfone resin, or the like. The composition of the present invention can remove not only the cured color resist but also the organic insulating film for reuse of the color filter.

The cyclic amine compound is a compound represented by the following [Formula 1].

[Formula 1]

Figure 112013047108716-pat00003

In Formula 1, A is O, S or N, R 1 is independently hydrogen, a C 1 ~ C 20 alkyl group unsubstituted or substituted with a substituent (the substituent may be an amino group, cyano group, hydroxy group or vinyl group) And C 1 -C 10 alkoxy, acetyl, formyl, phenyl or benzyl groups unsubstituted or substituted with a C 2 -C 10 alkenyl group, carboxyl group, amino group or hydroxy group. When A is O or S, there is no R 2 . When A is N, R 2 is independently hydrogen, C 1 -C 10 alkyl group, C 1 -C 10 hydroxyalkyl group, C 1 -C 10 alkoxy group unsubstituted or substituted with hydroxy group, phenyl group or benzyl Qi.

The cyclic amine compound of [Formula 1] is piperazine, N-methylpiperazine, N-ethylpiperazine, N-vinylpiperazine, N-vinylmethylpiperazine, N-vinylethylpiperazine, N-vinyl- N'-methylpiperazine, N-acryloylpiperazine, N-acryloyl-N'-methylpiperazine, hydroxyethylpiperazine, N- (2-aminoethyl) piperazine, N, N'- Dimethyl piperazine; Morpholine, N-methylmorpholine, N-ethylmorpholine, N-phenylmorpholine, N-vinylmorpholine, N-vinylmethylmorpholine, N-vinylethylmorpholine, N-acryloylmorpholine, N Cocomorpholine, N- (2-aminoethyl) morpholine, N- (2-cyanoethyl) morpholine, N- (2-hydroxyethyl) morpholine, N- (2-hydroxypropyl) morpho It is preferably one or more selected from the group consisting of Pauline, N-acetylmorpholine and N-formylmorpholine, but is not necessarily limited thereto.

The cyclic amine compound of [Formula 1] is preferably included in 1 to 10% by weight based on the total weight of the composition. If it is included in less than 1% by weight, the force to break the bond due to penetration in the cured resin is lowered, if it exceeds 10% by weight of the polymer resist due to the relative decrease of the polar solvent containing the quaternary alkylammonium compound and sulfur in the molecule Solving power is lowered.

The hydroxide ions produced by the quaternary ammonium salt compound penetrate into the color polymer resist to promote dissolution of the polymer resist.

The quaternary ammonium salt compound is selected from the group consisting of tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide (TEAH), tetrapropylammonium hydroxide (TPAH) and tetrabutylammonium hydroxide (TBAH) Although it is preferable that it is 1 or more types, it is not necessarily limited to this.

The quaternary ammonium salt compound is preferably included in 1 to 10% by weight based on the total weight of the composition. When included in less than 1% by weight, penetration of the hydroxide ions into the color resist polymer is reduced, and when it exceeds 10% by weight, the water content is increased to decrease the solubility in the polymer resin.

The polar solvent containing sulfur in the molecule penetrates into the swollen polymer resist and serves to dissolve the resist.

The polar solvent containing sulfur in the molecule is preferably one or more selected from the group consisting of dimethyl sulfoxide, diethyl sulfoxide, dipropyl sulfoxide and sulfolane, but is not necessarily limited thereto.

The polar solvent containing sulfur in the molecule is preferably included in 40 to 80% by weight based on the total weight of the composition. If it is included in less than 40% by weight, the solubility of the polymer resin is lowered, and if it exceeds 80% by weight, the activity of the ammonium salt compound is inhibited and the removal is rather deteriorated.

The alkylamine serves to dissolve the dye component of the color resist.

The alkylamine may be a primary amine including methyl amine, ethylamine, isopropyl amine and monoisopropylamine; Secondary amines including diethyl amine, diisopropyl amine and dibutylamine; Tertiary amines including trimethylamine, triethylamine, triisopropylamine and tributylamine; Diamines including ethylenediamine, propylenediamine, 1,3-propanediamine and 1,2-propylenediamine; And a polyamine including diethylenetriamine, dihexylenetriamine, triethylenetetramine, and tetraethylenepentaamine, but is not necessarily limited thereto.

The alkylamine is preferably included in 1 to 20% by weight based on the total weight of the composition. If it is contained in less than 1% by weight, it is difficult to dissolve the dye component of the color resist, if it exceeds 20% by weight there is no increase in the effect of the increase is not economical and the polar solvent containing a quaternary alkylammonium compound and sulfur in the molecule The relative decrease in the solubility of the polymer resist.

The inorganic base or a salt compound thereof improves the peeling force on the organic insulating film, and may include metal salts composed of lithium, sodium or potassium, and specifically, sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium bicarbonate and bicarbonate. It is preferably one or more selected from the group consisting of potassium, sodium nitrate, potassium nitrate, sodium sulfate, potassium sulfate, sodium silicate, potassium silicate, sodium acetate, and potassium acetate, but is not necessarily limited thereto.

The inorganic base or a salt compound thereof is preferably included in 0.001 to 1.0% by weight based on the total weight of the composition. When the amount is less than 0.001% by weight, the peeling force of the organic insulating layer is lowered. When the amount is more than 1% by weight, the effect of the increase is insignificant and economical.

The water may be included in 1 to 40% by weight based on the total weight of the composition. When water is added, the activation rate of the alkali-based compound is improved to increase the removal rate of the resist, and during the rinsing process, the organic contaminants and the resist stripping solution remaining on the substrate can be quickly and completely removed.

In the above, water is water for a semiconductor process, and it is preferable to use deionized water whose specific resistance value is 18 M (ohm) / cm or more.

Hereinafter, the present invention will be described in more detail with reference to Examples. However, the following examples are intended to illustrate the present invention more specifically, but the scope of the present invention is not limited by the following examples.

(1) Preparation of Stripping Liquid Composition

The components shown in Table 1 were mixed according to a predetermined composition ratio to prepare exfoliating solution compositions of Examples 1 to 12 and Comparative Examples 1 to 5.

(2) Evaluation of Removability of Color Resist

The removal evaluation of the color resist used the color filter substrate in which Red, Green, and Blue (hereafter RGB) were apply | coated, respectively. The color resist was prebaked at 90 ° C. for 120 seconds after coating, followed by exposure and development. Thereafter, the substrate on which the pattern was formed in the oven was hardbaked in a 220 ° C. oven to prepare.

In order to confirm the removal of the color resist, it was immersed in a solution of 70 ° C. for 3 minutes, 5 minutes, and 10 minutes to determine whether the resist remained by an optical microscope.

◎: 100% removal of resist

○: Remove 80% or more of resist

△: remove less than 80% of resist

X: No resist removed

(3) Evaluation of Removability of Organic Insulating Film

In order to confirm the removability of the organic insulating film, an organic insulating film was coated on the glass substrate, and then, the hard-baked substrate was used for 5 minutes and 10 minutes in a solution at 70 ° C. to confirm whether the organic insulating film remained by an optical microscope. The results are shown in Table 2 below.

◎: 100% removal of organic insulating film

○: Remove 80% or more of organic insulating film

△: less than 80% of organic insulating film

X: organic insulating film not removed

Figure 112013047108716-pat00004

A1: isopropylamine

A2: diethylamine

A3: ethylenediamine

A4: Propylenediamine

A5: diethylenetriamine

B1: N- (2-aminoethyl) piperazine

B2: N- (2-aminoethyl) morpholine

B3: piperazine

HAD: water soluble hydroxylamine

NMP: N-methylpyrrolidone

RGB substrate Organic insulating film substrate Rework time 3 minutes 5 minutes 10 minutes Removal time 5 minutes 10 minutes Removal time Example 1 ○ ◎ ◎ 5 minutes ○ ◎ 9 minutes Example 2 ○ ◎ ◎ 5 minutes ○ ◎ 9 minutes Example 3 ○ ◎ ◎ 3 minutes 30 seconds ○ ◎ 7 minute, 40 seconds Example 4 ○ ◎ ◎ 5 minutes ○ ◎ 9 minutes Example 5 ○ ◎ ◎ 5 minutes ○ ◎ 9 minutes Example 6 ○ ◎ ◎ 4 minutes 30 seconds ○ ◎ 8 minutes 30 seconds Example 7 ○ ◎ ◎ 4 minutes ○ ◎ 8 minutes Example 8 ○ ◎ ◎ 5 minutes ○ ◎ 9 minutes Example 9 ○ ◎ ◎ 5 minutes ○ ◎ 10 minutes Example 10 ○ ◎ ◎ 5 minutes ○ ◎ 9 minutes Example 11 ○ ◎ ◎ 3 minutes 30 seconds ○ ◎ 7 minute, 30 seconds Example 12 ○ ◎ ◎ 3 minutes 30 seconds ○ ◎ 7 minute, 30 seconds Comparative Example 1 X X △ 15 minutes X △ 20 minutes Comparative Example 2 X X X 25 minutes X X 30 minutes Comparative Example 3 X X X 30 minutes X X 25 minutes Comparative Example 4 X △ △ 11 minutes X △ 13 minutes Comparative Example 5 X △ ○ 11 minutes X △ 18 minutes

As shown in Table 2, the peeling liquid composition of Examples 1 to 12 of the present invention removed 80% or more of the color filter resist within 3 minutes, 100% of the resist is removed within 5 minutes is very excellent peeling force Could see. In addition, it was found that 100% of the organic insulating film resists were also removed within 10 minutes, thereby exhibiting excellent removal effect not only of RGB but also of the organic insulating film.

On the other hand, the compositions of Comparative Examples 1 to 5 required a long time to remove not only the RGB but also the organic insulating film, and it was found that the removal effect was also insufficient.

According to the results of the examples and the comparative examples, it was found that when the alkyl amine and the cyclic amine compound were mixed and used, the removal ability of the resist was improved when using the alkyl amine or the cyclic amine compound alone. This suggests that the resist removal rate is improved by the interaction effect between the alkyl amine and the cyclic amine compound when the alkyl amine having the effect of breaking the ring and the cyclic amine compound with easy wet penetration are used together. there was.

As described above, the color resist and the organic insulating film release liquid composition of the present invention could not only sufficiently remove the color resist of the color filter but also sufficiently remove the organic insulating film, thereby improving the productivity of color filter reuse. .

Claims (6)

To the total weight of the composition, 1-10% by weight of the cyclic amine compound of Formula 1, 1-10% by weight of the quaternary ammonium salt compound, 40-80% by weight of the polar organic solvent including sulfur in the molecule, and alkylamine 1- A color resist and an organic insulating film release liquid composition, characterized in that it comprises 20% by weight, inorganic base or 0.001-1% by weight of its salt compound and 1-40% by weight of water.
[Formula 1]
Figure 112019021795031-pat00005

In Formula 1, A is O, S or N, R 1 is a C 1 ~ C 20 alkyl group unsubstituted or substituted with a substituent (the substituent may be an amino group, cyano group, hydroxy group or vinyl group), C Or a C 1 to C 10 alkoxy group, an acetyl group, a formyl group, a phenyl group or a benzyl group unsubstituted or substituted with a 2 to C 10 alkenyl group, a carboxyl group, an amino group, or a hydroxy group. When A is O or S, there is no R 2 . When A is N, R 2 is hydrogen, a C 1 -C 10 alkyl group, a C 1 -C 10 hydroxyalkyl group, a C 1 -C 10 alkoxy group, a phenyl group or a benzyl group unsubstituted or substituted with a hydroxy group. . The cyclic amine compound represented by Chemical Formula 1 is N-methylpiperazine, N-ethylpiperazine, N-vinylpiperazine, N-vinylmethylpiperazine, N-vinylethylpiperazine, N- Vinyl-N'-methylpiperazine, N-acryloylpiperazine, N-acryloyl-N'-methylpiperazine, hydroxyethylpiperazine, N- (2-aminoethyl) piperazine, N, N '-Dimethylpiperazine; N-methylmorpholine, N-ethylmorpholine, N-phenylmorpholine, N-vinylmorpholine, N-vinylmethylmorpholine, N-vinylethylmorpholine, N-acryloylmorpholine, N-cocoomorph Pauline, N- (2-aminoethyl) morpholine, N- (2-cyanoethyl) morpholine, N- (2-hydroxyethyl) morpholine, N- (2-hydroxypropyl) morpholine, N -At least one selected from the group consisting of acetyl morpholine and N-formyl morpholine, a color resist and organic insulating film release liquid composition. The method of claim 1, wherein the quaternary ammonium salt compound is tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide (TEAH), tetrapropylammonium hydroxide (TPAH) and tetrabutylammonium hydroxide (TBAH) It is at least 1 type selected from the group which consists of a color resist and organic type insulating film peeling liquid composition. The method of claim 1, wherein the polar solvent containing sulfur in the molecule is at least one selected from the group consisting of dimethyl sulfoxide, diethyl sulfoxide, dipropyl sulfoxide and sulfolane, color resist and organic insulating film Stripper composition. The method of claim 1, wherein the alkylamine is selected from the group consisting of primary amines including methyl amine, ethylamine, isopropyl amine and monoisopropylamine; Secondary amines including diethyl amine, diisopropyl amine and dibutylamine; Tertiary amines including trimethylamine, triethylamine, triisopropylamine and tributylamine; Diamines including ethylenediamine, propylenediamine, 1,3-propanediamine and 1,2-propylenediamine; And at least one member selected from the group consisting of diethylenetriamine, dihexylenetriamine, triethylenetetramine and tetraethylenepentaamine. The method of claim 1, wherein the inorganic base or a salt compound thereof is sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium bicarbonate, potassium bicarbonate, sodium nitrate, potassium nitrate, sodium sulfate, potassium sulfate, sodium silicate, potassium silicate, sodium acetate, And at least one selected from the group consisting of potassium acetate, the color resist and the organic insulating film release liquid composition.
KR1020130060162A 2013-05-28 2013-05-28 Liquid composition for stripping a color resist and an organic insulating layer KR102009530B1 (en)

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JP2002062668A (en) 2000-08-14 2002-02-28 Mitsubishi Gas Chem Co Inc Method for removing photoresist

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KR101333779B1 (en) * 2007-08-20 2013-11-29 주식회사 동진쎄미켐 A color resist remover composition for tft-lcd preparation
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