KR20160017606A - Cleaning composition - Google Patents
Cleaning composition Download PDFInfo
- Publication number
- KR20160017606A KR20160017606A KR1020150099076A KR20150099076A KR20160017606A KR 20160017606 A KR20160017606 A KR 20160017606A KR 1020150099076 A KR1020150099076 A KR 1020150099076A KR 20150099076 A KR20150099076 A KR 20150099076A KR 20160017606 A KR20160017606 A KR 20160017606A
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- insulating film
- organic insulating
- transparent resin
- group
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 62
- 238000004140 cleaning Methods 0.000 title claims description 17
- 239000011347 resin Substances 0.000 claims abstract description 47
- 229920005989 resin Polymers 0.000 claims abstract description 47
- -1 quaternary ammonium salt compound Chemical class 0.000 claims abstract description 46
- 150000001408 amides Chemical class 0.000 claims abstract description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims abstract description 18
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000002798 polar solvent Substances 0.000 claims abstract description 17
- 239000012459 cleaning agent Substances 0.000 claims abstract description 13
- 150000007529 inorganic bases Chemical class 0.000 claims abstract description 13
- 150000003839 salts Chemical class 0.000 claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 11
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 125000006165 cyclic alkyl group Chemical group 0.000 claims abstract description 9
- 150000001875 compounds Chemical class 0.000 claims abstract description 8
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 6
- 239000001257 hydrogen Substances 0.000 claims abstract description 6
- 239000000126 substance Substances 0.000 claims abstract description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 3
- 125000004122 cyclic group Chemical group 0.000 claims abstract description 3
- 150000002431 hydrogen Chemical class 0.000 claims abstract description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 57
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 52
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 29
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 14
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 claims description 14
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 12
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 claims description 10
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 10
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 claims description 8
- 239000004317 sodium nitrate Substances 0.000 claims description 7
- 235000010344 sodium nitrate Nutrition 0.000 claims description 7
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 claims description 7
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 claims description 7
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 6
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 claims description 5
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 claims description 5
- ASUDFOJKTJLAIK-UHFFFAOYSA-N 2-methoxyethanamine Chemical compound COCCN ASUDFOJKTJLAIK-UHFFFAOYSA-N 0.000 claims description 5
- HMWXCSCBUXKXSA-UHFFFAOYSA-N 2-propoxyethanamine Chemical compound CCCOCCN HMWXCSCBUXKXSA-UHFFFAOYSA-N 0.000 claims description 5
- SOYBEXQHNURCGE-UHFFFAOYSA-N 3-ethoxypropan-1-amine Chemical compound CCOCCCN SOYBEXQHNURCGE-UHFFFAOYSA-N 0.000 claims description 5
- FAXDZWQIWUSWJH-UHFFFAOYSA-N 3-methoxypropan-1-amine Chemical compound COCCCN FAXDZWQIWUSWJH-UHFFFAOYSA-N 0.000 claims description 5
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 5
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 claims description 5
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 5
- QJQAMHYHNCADNR-UHFFFAOYSA-N n-methylpropanamide Chemical compound CCC(=O)NC QJQAMHYHNCADNR-UHFFFAOYSA-N 0.000 claims description 5
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 5
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 claims description 4
- KXDAEFPNCMNJSK-UHFFFAOYSA-N Benzamide Chemical compound NC(=O)C1=CC=CC=C1 KXDAEFPNCMNJSK-UHFFFAOYSA-N 0.000 claims description 4
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 claims description 4
- MBHINSULENHCMF-UHFFFAOYSA-N n,n-dimethylpropanamide Chemical compound CCC(=O)N(C)C MBHINSULENHCMF-UHFFFAOYSA-N 0.000 claims description 4
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 claims description 4
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 claims description 4
- OHLUUHNLEMFGTQ-UHFFFAOYSA-N N-methylacetamide Chemical compound CNC(C)=O OHLUUHNLEMFGTQ-UHFFFAOYSA-N 0.000 claims description 3
- HYLLZXPMJRMUHH-UHFFFAOYSA-N 1-[2-(2-methoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOC HYLLZXPMJRMUHH-UHFFFAOYSA-N 0.000 claims description 2
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 claims description 2
- BQCCJWMQESHLIT-UHFFFAOYSA-N 1-propylsulfinylpropane Chemical compound CCCS(=O)CCC BQCCJWMQESHLIT-UHFFFAOYSA-N 0.000 claims description 2
- PWGVOCGNHYMDLS-UHFFFAOYSA-N 3-(2-methoxyethoxy)propan-1-amine Chemical compound COCCOCCCN PWGVOCGNHYMDLS-UHFFFAOYSA-N 0.000 claims description 2
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 claims description 2
- VHYUNSUGCNKWSO-UHFFFAOYSA-N 3-propan-2-yloxypropan-1-amine Chemical compound CC(C)OCCCN VHYUNSUGCNKWSO-UHFFFAOYSA-N 0.000 claims description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 2
- 229920001174 Diethylhydroxylamine Polymers 0.000 claims description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 2
- LKJPYSCBVHEWIU-UHFFFAOYSA-N N-[4-cyano-3-(trifluoromethyl)phenyl]-3-[(4-fluorophenyl)sulfonyl]-2-hydroxy-2-methylpropanamide Chemical compound C=1C=C(C#N)C(C(F)(F)F)=CC=1NC(=O)C(O)(C)CS(=O)(=O)C1=CC=C(F)C=C1 LKJPYSCBVHEWIU-UHFFFAOYSA-N 0.000 claims description 2
- 239000004115 Sodium Silicate Substances 0.000 claims description 2
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 2
- ZVSKZLHKADLHSD-UHFFFAOYSA-N benzanilide Chemical compound C=1C=CC=CC=1C(=O)NC1=CC=CC=C1 ZVSKZLHKADLHSD-UHFFFAOYSA-N 0.000 claims description 2
- DNSISZSEWVHGLH-UHFFFAOYSA-N butanamide Chemical compound CCCC(N)=O DNSISZSEWVHGLH-UHFFFAOYSA-N 0.000 claims description 2
- CCAFPWNGIUBUSD-UHFFFAOYSA-N diethyl sulfoxide Chemical compound CCS(=O)CC CCAFPWNGIUBUSD-UHFFFAOYSA-N 0.000 claims description 2
- FVCOIAYSJZGECG-UHFFFAOYSA-N diethylhydroxylamine Chemical compound CCN(O)CC FVCOIAYSJZGECG-UHFFFAOYSA-N 0.000 claims description 2
- VMESOKCXSYNAKD-UHFFFAOYSA-N n,n-dimethylhydroxylamine Chemical compound CN(C)O VMESOKCXSYNAKD-UHFFFAOYSA-N 0.000 claims description 2
- YPHRECOHXALQKL-UHFFFAOYSA-N n-ethyl-n-methylbenzamide Chemical compound CCN(C)C(=O)C1=CC=CC=C1 YPHRECOHXALQKL-UHFFFAOYSA-N 0.000 claims description 2
- UHANVDZCDNSILX-UHFFFAOYSA-N n-phenylbutanamide Chemical compound CCCC(=O)NC1=CC=CC=C1 UHANVDZCDNSILX-UHFFFAOYSA-N 0.000 claims description 2
- 235000011181 potassium carbonates Nutrition 0.000 claims description 2
- 235000011118 potassium hydroxide Nutrition 0.000 claims description 2
- 239000004323 potassium nitrate Substances 0.000 claims description 2
- 235000010333 potassium nitrate Nutrition 0.000 claims description 2
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 claims description 2
- 229910052939 potassium sulfate Inorganic materials 0.000 claims description 2
- 235000011151 potassium sulphates Nutrition 0.000 claims description 2
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 claims description 2
- 235000017550 sodium carbonate Nutrition 0.000 claims description 2
- 235000011121 sodium hydroxide Nutrition 0.000 claims description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 2
- 235000019794 sodium silicate Nutrition 0.000 claims description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 2
- 235000011152 sodium sulphate Nutrition 0.000 claims description 2
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 claims description 2
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 claims description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 claims 2
- 239000000758 substrate Substances 0.000 description 30
- 230000000052 comparative effect Effects 0.000 description 28
- 239000003599 detergent Substances 0.000 description 15
- 230000000694 effects Effects 0.000 description 15
- 101100269370 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) AGE2 gene Proteins 0.000 description 7
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 6
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 5
- 101100269369 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) AGE1 gene Proteins 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 239000000908 ammonium hydroxide Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 3
- 235000017557 sodium bicarbonate Nutrition 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000003795 desorption Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 230000002522 swelling effect Effects 0.000 description 2
- WRDLTPMUGXTIAM-UHFFFAOYSA-N 1-(oxolan-2-yl)ethanamine Chemical compound CC(N)C1CCCO1 WRDLTPMUGXTIAM-UHFFFAOYSA-N 0.000 description 1
- PNXOJQDKFIWCED-UHFFFAOYSA-N 1-(oxolan-2-yl)pentan-2-amine Chemical compound CCCC(N)CC1CCCO1 PNXOJQDKFIWCED-UHFFFAOYSA-N 0.000 description 1
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical compound CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004111 Potassium silicate Substances 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 125000005210 alkyl ammonium group Chemical group 0.000 description 1
- 235000019646 color tone Nutrition 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910017053 inorganic salt Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- RWJGITGQDQSWJG-UHFFFAOYSA-N n-(3-methoxypropyl)prop-2-enamide Chemical compound COCCCNC(=O)C=C RWJGITGQDQSWJG-UHFFFAOYSA-N 0.000 description 1
- YNOGYQAEJGADFJ-UHFFFAOYSA-N oxolan-2-ylmethanamine Chemical compound NCC1CCCO1 YNOGYQAEJGADFJ-UHFFFAOYSA-N 0.000 description 1
- 230000007903 penetration ability Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- XIPFMBOWZXULIA-UHFFFAOYSA-N pivalamide Chemical compound CC(C)(C)C(N)=O XIPFMBOWZXULIA-UHFFFAOYSA-N 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 1
- 229910052913 potassium silicate Inorganic materials 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/38—Cationic compounds
- C11D1/40—Monoamines or polyamines; Salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/38—Cationic compounds
- C11D1/42—Amino alcohols or amino ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Detergent Compositions (AREA)
Abstract
(A) 1-10% by weight of a quaternary ammonium salt compound, (b) 40-80% by weight of a polar solvent, (c) 1-20% by weight of an alkoxyalkylamine having a structure represented by the following formula (d) 0.1 to 5% by weight of a hydroxylamine-based compound, (e) 1 to 20% by weight of an amide having a structure represented by the following formula (2), (f) 1-20% by weight of an alkylene glycol dialkyl ether, ) 0.01-2% by weight of an inorganic base or a salt thereof and (h) 1-40% by weight of water. The present invention relates to a cleaning agent composition for removing a color resist, an organic insulating film and a transparent resin.
[Chemical Formula 1]
Wherein R 1 is a C 1 to C 6 chained or cyclic alkoxy group, and the alkoxy group is substituted with a C 1 to C 6 chained or cyclic alkyl group or a C 1 to C 3 alkoxy group And R 2 and R 3 are each independently hydrogen or a C 1 to C 6 chain or cyclic alkyl group, and n is an integer of 1 to 4.
(2)
(Wherein R 4 , R 5 , and R 6 are each independently hydrogen, a C 1 to C 4 chain or cyclic alkyl group, or a phenyl group.)
Description
The present invention relates to a color resist, an organic insulating film, and a cleaning agent composition for removing a transparent resin.
A color filter can be embedded in a color imaging device of an image sensor, such as a complementary metal oxide semiconductor (CMOS) or a charge coupled device (CCD), and can be used to actually obtain a color image (PDP), a liquid crystal display (LCD), a field emission display (FEL), and a light emitting display (LED), and the application range thereof is rapidly expanding. Particularly, in recent years, the use of LCDs has been further expanded, and accordingly, color filters have been recognized as one of the most important components in reproducing color tones of LCDs.
On the other hand, the resist can be largely divided into a positive type resist and a negative type resist. Unlike the positive type resist, which is easily removed and removed within one minute at a temperature condition of 40 to 50 DEG C by an organic solvent- Resists have properties of a negative type resist which has a high degree of curing and is hardened by heat treatment and is difficult to peel off. Accordingly, in order to remove the color resist, a time of not less than 5 minutes is required under a temperature condition of 70 占 폚 or more, so that stronger peeling performance is required. In the current flat panel display manufacturing process, when an organic insulating film is used for the coating of a color filter, if RGB coating of the color filter causes coating failure or coating failure of the organic insulating film, the color filter is discarded There is a need for a cleaning composition capable of simultaneously removing the RGB color resist and the organic insulating film for reuse of the color filter because the process yield is improved and the cost is reduced. In addition, in the case of RGBW transparent resist having a four-pixel structure for increasing the light efficiency of an OLED panel, there is a problem that it is more difficult to remove by using a resin having high thermal stability and chemical stability as well as a higher degree of curing than a color resist or an organic insulating film. Accordingly, in order to reuse the defective color filter generated during the color filter manufacturing process, a cleaning agent composition capable of effectively removing both the color resist, the organic insulating film, and the transparent resin is required.
Korean Patent Laid-Open No. 10-2003-0026664 discloses a color resist stripper composition comprising a hydroxide compound as a main component, and Korean Patent Publication No. 10-2014-0028962 discloses a color resist stripper composition comprising diethylenetriamine, There is disclosed a release liquid composition for removing negative photoresist containing alkyl ammonium hydroxide, dimethyl sulfoxide, and water. However, the above-described conventional techniques have achieved desired results in color resist peeling, but do not show any effect of partially or totally removing the organic insulating film or the transparent resin. In addition, there is a problem that precipitation of inorganic alkali occurs due to volatilization of the exfoliation liquid at the time of the high temperature processing of the hydroxide compound base exfoliating liquid composition, and the effect of removing the resin having increased degree of crosslinking only with diethylenetriamine and polar solvent There is an insufficient problem.
Therefore, it is necessary to develop a cleaning agent composition that has excellent cleaning effect for both color resist, organic insulating film, and transparent resin, and has no deposition problem even in a high-temperature process.
In order to solve the problems of the prior art, the present invention can effectively remove both the color resist of the color filter, the organic insulating film and the transparent resin in a short period of time for reuse of the color filter, The purpose is to provide.
(A) 1-10% by weight of a quaternary ammonium salt compound, (b) 40-80% by weight of a polar solvent, (c) alkoxy having a structure of the formula (1) (E) from 1 to 20% by weight of an amide having the structure of formula (2), (f) from 1 to 20 alkylene glycol dialkyl ethers, (G) 0.01-2% by weight of an inorganic base or a salt thereof, and (h) 1-40% by weight of water. The present invention provides a color resist, an organic insulating film and a detergent composition for removing a transparent resin.
The detergent composition of the present invention can effectively remove both the color resist, the organic insulating film and the transparent resin in a short time, thereby improving the productivity of the color filter reuse. In particular, the cleaning composition of the present invention enables the reuse of a defective substrate by removing a cured color resist, an organic insulating film and a transparent resin having increased crosslinking degree from the substrate in a structure in which a color filter is integrated into an LCD color filter or a TFT substrate. Further, since the detergent composition of the present invention does not use an inorganic alkali hydroxide as an alkali base, there is no problem of precipitation of inorganic alkali due to volatilization of the exfoliating liquid even in a high temperature process.
Hereinafter, the present invention will be described in more detail.
(B) a polar solvent; (c) an alkoxyalkylamine having a structure represented by the following formula (1); (d) a quaternary ammonium salt compound; (E) an amide having a structure of the formula (2), (g) an alkylene glycol dialkyl ether, (g) an inorganic base or a salt thereof, and (h) water.
The detergent composition of the present invention can effectively remove both the color resist, the organic insulating film and the transparent resin in a short time by the composition as described above, thereby improving the productivity of the color filter reuse.
(a) a quaternary ammonium salt compound
The quaternary ammonium salt compound (a) of the present invention releases hydroxide ions, which penetrate into the resist and promote the dissolution of the polymer resist.
The quaternary ammonium salt compound is selected from the group consisting of tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide (TEAH), tetrapropylammonium hydroxide (TPAH) and tetrabutylammonium hydroxide (TBAH) Or more.
The quaternary ammonium salt compound of the present invention is preferably contained in an amount of 1-10% by weight based on the total weight of the composition. When the quaternary ammonium salt compound is contained in the detergent composition of the present invention in an amount of less than 1% by weight, penetration ability into the color resist polymer of the hydroxide ion is decreased. When the quaternary ammonium salt compound is contained in an amount of more than 10% by weight, There is a problem of being reduced.
(b) polar solvent
The polar solvent (b) of the present invention penetrates the resist to increase the swelling property, thereby increasing the peeling force from the substrate surface. Further, the dissolution ability of the resist stripper composition of the present invention in water is improved, and the residue can be easily removed in the subsequent water washing step.
The polar solvent may be at least one member selected from the group consisting of dimethyl sulfoxide, diethyl sulfoxide, dipropyl sulfoxide, sulfolane, n-methylpyrrolidone, pyrrolidone and n-ethylpyrrolidone.
The polar solvent of the present invention is preferably contained in an amount of 40 to 80% by weight based on the total weight of the composition. When the polar solvent is contained in an amount of less than 40% by weight, the solubility of the polymer resin is lowered. When the amount of the polar solvent exceeds 80% by weight, the activity of the ammonium salt compound is impaired.
(c) an alkoxyalkylamine having the structure of formula
The alkoxyalkylamine (c) of the present invention penetrates into the cured resin and breaks bonds to dissolve the polymer.
In the present invention, the alkoxyalkylamine is a compound represented by the following formula (1).
[Chemical Formula 1]
Wherein R 1 is a C 1 to C 6 chained or cyclic alkoxy group, and the alkoxy group is a C 1 to C 6 chained or cyclic alkyl group or a C 1 to C 3 alkoxy group And R 2 and R 3 are each independently hydrogen or a C 1 -C 6 chain or cyclic alkyl group, and n is an integer of 1 to 4.
Specifically, the alkoxyalkylamine represented by the above-mentioned general formula (1) is preferably selected from the group consisting of methoxyethylamine, methoxypropylamine, ethoxypropylamine, propoxyethylamine, isopropoxypropylamine, methoxyethoxypropylamine, oxolane- -Methanamine, (oxolan-2-yl-methyl) butan-l-amine and methyloxolan-2-yl-methanamine.
The alkoxyalkylamine of the present invention is preferably contained in an amount of 1-20% by weight based on the total weight of the composition. When the alkoxyalkylamine is contained in the detergent composition of the present invention in an amount of less than 1% by weight, the strength of breaking the bond by penetration into the cured resin is lowered. When the alkoxyalkylamine is more than 20% by weight, The solubility of the polymer resist is lowered.
(d) Hydroxylamine compound
The hydroxylamine-based compound (d) of the present invention has a low-molecular structure to generate hydroxide ions in a short time, permeates the cured resin to break the bond and dissolve the dye component of the resist.
The hydroxylamine-based compound may be at least one selected from the group consisting of hydroxylamine, dimethylhydroxylamine, and diethylhydroxylamine.
The hydroxylamine-based compound of the present invention is preferably contained in an amount of 0.1-5% by weight based on the total weight of the composition. When the content of the hydroxylamine compound is less than 0.1% by weight, the dye component of the resist is difficult to dissolve sufficiently. When the amount of the hydroxylamine compound exceeds 5% by weight, the effect of increasing the amount of the hydroxylamine compound is not increased. , The content of the quaternary organic ammonium hydroxide and the polar solvent is relatively lowered, so that the solubility of the resist can be reduced.
(e) Amide having the structure of formula (2)
The (e) amide of the present invention promotes the swelling of the transparent resin film to increase the desorption rate in the substrate
In the present invention, the amide is a compound represented by the following formula (2).
(2)
In Formula 2, R 4 , R 5 , and R 6 are each independently hydrogen, a C 1 to C 4 chained or cyclic alkyl group, or a phenyl group.
Specifically, the amide represented by the general formula (2) may be selected from the group consisting of formaldehyde, acetamide, benzamide, N-methylpropanamide, propanamide, butanamide, N, N-dimethylacetamide, Dimethylformamide, dimethylpropanamide, N-ethyl-N-methylbenzeneamide, N-phenylbutanamide and N-phenylbenzamide.
The present inventors have experimentally confirmed that when the amide having the structure of Formula 2 is introduced into the cleaning composition of the present invention, the cleaning effect is greatly improved.
The amide of the present invention is preferably contained in an amount of 1-20% by weight based on the total weight of the composition. If the amount of the amide contained in the detergent composition of the present invention is less than 1 wt%, the removal power of the transparent resin is not effective. If the amount of the amide is more than 20 wt%, the removal power is not increased any more.
(f) an alkylene glycol dialkyl ether
The alkylene glycol dialkyl ether (f) of the present invention penetrates into the organic insulating film and swells to facilitate desorption at the substrate.
Examples of the alkylene glycol dialkyl ether include ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol methyl butyl ether, propylene glycol dimethyl ether And dipropylene glycol dimethyl ether.
The alkylene glycol dialkyl ether of the present invention is preferably contained in an amount of 1-20% by weight based on the total weight of the composition. If the content of the alkylene glycol dialkyl ether is less than 1% by weight in the detergent composition of the present invention, the swelling effect of the resist polymer is reduced to decrease penetration into the resist of the hydroxide ion, and if it exceeds 20% by weight, There is no further effect and the solubility of the inorganic salt is reduced.
(g) an inorganic base or salt thereof
The inorganic base or its salt (g) of the present invention has a role of improving the peeling force against the organic insulating film.
The inorganic base or its salt may be at least one selected from the group consisting of sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium bicarbonate, sodium nitrate, potassium nitrate, sodium sulfate, potassium sulfate, sodium silicate and potassium silicate.
The inorganic base or salt thereof of the present invention is preferably contained in an amount of 0.01 to 2% by weight based on the total weight of the composition. If the content of the inorganic base or its salt in the detergent composition of the present invention is less than 0.01% by weight, the peeling force against the organic insulating film is poor. If the amount is more than 2% by weight, the effect of increasing the amount is insignificant and not economical.
(h) Water
The water (h) of the present invention is appropriately added to control the overall composition and increase the activity of the hydroxy ion
The water of the present invention may be contained in the remaining amount relative to the other components contained in the composition of the present invention, and specifically may be contained in an amount of 1-40% by weight.
The detergent composition of the present invention is characterized in that it does not contain an alkylene glycol monoalkyl ether. When the alkylene glycol monoalkyl ether is contained in the detergent composition of the present invention, the wettability with the organic film-coated substrate is lowered and the dissolution rate of the resin is lowered, which is undesirable. The cleaning effect on the color resist substrate, Which is very low.
In the most preferred composition, the detergent composition of the present invention,
(A) quaternary organic ammonium hydroxydotetramethylammonium hydroxide (TMAH); (B) dimethyl sulfoxide (DMSO) as the polar solvent, and (c) alkoxyalkylamines as the at least one of methoxyethylamine, methoxypropylamine, ethoxypropylamine and propoxyethylamine; (E) at least one of amide, N, N-dimethylacetamide, N-methylpropanamide, N-methylethanamide and N, N-dimethylpropanamide; (F) an alkylene glycol dialkyl ether, at least one of ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether and propylene glycol dimethyl ether; And a cleaning agent composition for removing a color resist, an organic insulating film and a transparent resin, which comprises at least one of sodium nitrate, sodium hydroxide, potassium hydroxide, sodium bicarbonate, potassium carbonate and sodium carbonate as the inorganic base or salt thereof (g).
The cleaner composition of the present invention exhibits a very excellent cleaning effect for both the color resist, the organic insulating film and the transparent resin, and the color resist may be a negative photosensitive resin, but the present invention is not limited thereto, and the organic insulating film may be a polyacrylate resin But it is not limited thereto. The transparent resin may be a resin having an increased cross-linking property by adding an epoxy functional group to polyacrylate, but is not limited thereto.
Hereinafter, the present invention will be described in more detail by way of examples. However, the following examples are intended to further illustrate the present invention, and the scope of the present invention is not limited by the following examples. The following examples can be appropriately modified and changed by those skilled in the art within the scope of the present invention.
Examples and Comparative Examples: Preparation of detergent composition
The cleaning agent compositions of Examples 1 to 10 and Comparative Examples 1 to 8 were prepared by mixing the components shown in the following Table 1 according to the specified composition ratios.
MDG
7.5
(a) a quaternary organic ammonium hydroxide
TMAH: tetramethylammonium hydroxide,
TEAH: tetraethylammonium hydroxide
(b) polar solvent
DMSO: dimethylsulfoxide
(c) an alkoxyalkylamine
AA1: Methoxyethylamine
AA2: Methoxypropylamine
AA3: Ethoxypropylamine
AA4: Propoxyethylamine
DETA: Diethylene triamine
(e) Amide
AM1: N, N-dimethylacetamide
AM2: N-methylpropanamide
AM3: N-methylethanamide
AM4: N, N-dimethylpropanamide
AM5: 3-methoxypropyl acrylamide
(f) an alkylene glycol dialkyl ether
AGE1: Ethylene glycol dimethyl ether
AGE2: Diethylene glycol dimethyl ether
AGE3: Diethylene glycol diethyl ether
AGE4: Propylene glycol dimethyl ether
MDG: diethylene glycol monomethyl ether
Experimental Example One: Color resist Removal evaluation
In order to evaluate the color resist removal effect of the cleaning composition prepared in Examples and Comparative Examples, a color filter substrate coated with red, green, and blue (hereinafter RGB) was used. The color resist was applied after being prebaked at 90 ° C for 120 seconds after exposure, developed, and then hard baked in an oven at 220 ° C in an oven.
To confirm the removability of the color resist of the cleaning composition prepared in Examples and Comparative Examples, the color filter substrate coated with the RGB was immersed in a solution at 70 캜 for 5 minutes and 10 minutes, and the resist remained Respectively. The results are shown in Table 2 below.
◎: 100% resist removal
○: Resist 80% or more removed
?: Less than 80% resist removal
X: No resist removal
Experimental Example 2: Organic Evaluation of removal of insulating film
In order to confirm the removability of the organic insulating film, polyacylate resin (PAC resin) was applied on a glass substrate and prebaked at 90 ° C for 120 seconds. After patterning through exposure and development processes, the substrate was hard baked in an oven at 220 ° C to prepare an organic insulating film resist. A hard-baked substrate was used after application of the organic insulating film.
In order to confirm the removability of the organic insulating film of the detergent composition prepared in Examples and Comparative Examples, the organic insulating film substrate was immersed in a solution at 70 캜 for 5 minutes and 10 minutes, and the organic insulating film remained by optical microscope. The results are shown in Table 2 below.
◎: 100% resist removal
○: Resist 80% or more removed
?: Less than 80% resist removal
X: No resist removal
Experimental Example 3: Transparent resin film Removal evaluation
In order to confirm the removability of the transparent resin film, a copolymerized transparent resin was coated on the substrate by adding a compound having an epoxy group to the acrylate monomer and then pre-baked at 90 ° C for 120 seconds. After patterning through exposure and development processes, the substrate was hard baked in an oven at 220 ° C to prepare a transparent resin film. A hard-baked substrate was used after applying the transparent resin film.
In order to confirm the removability of the transparent resin film of the cleaner composition prepared in Examples and Comparative Examples, the organic insulating film substrate was immersed in a solution at 70 캜 for 5 minutes and 10 minutes, and the organic insulating film remained by optical microscope. The results are shown in Table 2 below.
◎: 100% resist removal
○: Resist 80% or more removed
?: Less than 80% resist removal
X: No resist removal
As shown in Table 2, the cleaning compositions of Examples 1 to 10 exhibited excellent cleaning effects on both the color resist substrate, the organic insulating film substrate, and the transparent resin substrate.
On the contrary, the compositions of Comparative Examples 1 to 8, which do not include any of the constitution of the present invention or are out of the content range, have a very poor cleaning effect on the color resist substrate, the organic insulating film substrate and the transparent resin substrate. Also, it was experimentally confirmed that the compositions of Comparative Examples 9 to 10 in which the alkylene glycol monoalkyl ether was contained in the detergent composition were also extremely poor in the cleaning effect on the color resist substrate, the organic insulating film substrate, and the transparent resin substrate.
Therefore, the cleaning liquid composition having the composition of the present invention can sufficiently remove the color resist, the organic insulating film, and the transparent resin key plate of the color filter in a short time, thereby improving the productivity of color filter reuse.
Claims (10)
(a) 1-10% by weight of a quaternary ammonium salt compound,
(b) 40 to 80% by weight of a polar solvent,
(c) from 1 to 20% by weight of an alkoxyalkylamine having the structure of the formula (1)
(d) 0.1-5% by weight of a hydroxylamine compound,
(e) 1-20% by weight of an amide having the structure of the formula (2)
(f) 1-20% by weight of an alkylene glycol dialkyl ether,
(g) 0.01-2% by weight of an inorganic base or salt thereof and
(h) 1 to 40% by weight of water, and a cleaning agent composition for removing a color resist, an organic insulating film and a transparent resin.
[Chemical Formula 1]
(In the formula 1,
R 1 is a C 1 to C 6 chain or cyclic alkoxy group, and the alkoxy group may be substituted with a C 1 to C 6 chain or cyclic alkyl group or a C 1 to C 3 alkoxy group,
R 2 and R 3 are each independently hydrogen or a C 1 to C 6 chained or cyclic alkyl group, and n is an integer of 1 to 4.)
(2)
(In the formula (2)
R 4 , R 5 and R 6 are each independently hydrogen, a C 1 to C 4 chained or cyclic alkyl group, or a phenyl group.)
The quaternary ammonium salt compound (a) is composed of tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide (TEAH), tetrapropylammonium hydroxide (TPAH) and tetrabutylammonium hydroxide (TBAH) And a cleaning agent composition for removing a color resist, an organic insulating film, and a transparent resin.
The polar solvent (b) may be at least one selected from the group consisting of dimethylsulfoxide, diethylsulfoxide, dipropylsulfoxide, sulfolane, n-methylpyrrolidone, pyrrolidone and n- , A color resist, an organic insulating film, and a cleaning agent composition for removing a transparent resin.
The alkoxyalkylamine having the structure (c) represented by the general formula (1) is preferably a methoxyethylamine, a methoxypropylamine, an ethoxypropylamine, a propoxyethylamine, an isopropoxypropylamine, a methoxyethoxypropylamine, An organic insulating film and a transparent resin film, which are at least one selected from the group consisting of 2-yl-methane amine, (oxolan-2-yl-methyl) butan- A cleaner composition for removing a resin.
Wherein the hydroxylamine-based compound (d) is at least one selected from the group consisting of hydroxylamine, dimethylhydroxylamine, and diethylhydroxylamine, and a cleaning agent composition for removing a color resist, an organic insulating film, and a transparent resin.
The amide having the structure of (e) (2) can be prepared by reacting an amide having the structure of the formula (2) with formamide, acetamide, benzamide, N -methylpropanamide, propanamide, butanamide, N, N-dimethylacetamide, A cleaning agent composition for removing a color resist, an organic insulating film and a transparent resin, which is at least one selected from the group consisting of dimethyl propanamide, N-ethyl-N-methylbenzeneamide, N-phenylbutanamide and N-phenylbenzamide.
The alkylene glycol dialkyl ether (f) is selected from the group consisting of ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol methyl butyl ether, propylene Glycol dimethyl ether, and dipropylene glycol dimethyl ether. The cleaning composition for removing a color resist, an organic insulating film, and a transparent resin.
Wherein the inorganic base or salt thereof is at least one selected from the group consisting of sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium bicarbonate, sodium nitrate, potassium nitrate, sodium sulfate, potassium sulfate, sodium silicate, A color resist, an organic insulating film, and a cleaning agent composition for removing a transparent resin.
An organic insulating film and a transparent resin, which is free from an alkylene glycol monoalkyl ether.
(A) quaternary organic ammonium hydroxydotetramethylammonium hydroxide (TMAH);
(B) dimethyl sulfoxide (DMSO) as the polar solvent, and (c) alkoxyalkylamines as the at least one of methoxyethylamine, methoxypropylamine, ethoxypropylamine and propoxyethylamine;
(E) at least one of amide, N, N-dimethylacetamide, N-methylpropanamide, N-methylethanamide and N, N-dimethylpropanamide;
(F) an alkylene glycol dialkyl ether, at least one of ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether and propylene glycol dimethyl ether; And
The cleaning agent composition for removing a color resist, an organic insulating film, and a transparent resin, wherein (g) the inorganic base or salt thereof comprises at least one of sodium nitrate, sodium hydroxide, potassium hydroxide, sodium bicarbonate, potassium carbonate and sodium carbonate.
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| KR20140101060 | 2014-08-06 | ||
| KR1020140101060 | 2014-08-06 |
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| KR20160017606A true KR20160017606A (en) | 2016-02-16 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180035590A (en) * | 2016-09-29 | 2018-04-06 | 주식회사 엘지화학 | Composition for cleaning substrate of display device and preparing method of display device using the same |
| KR20220104767A (en) | 2019-11-20 | 2022-07-26 | 닛산 가가쿠 가부시키가이샤 | Detergent Compositions and Cleaning Methods |
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| KR20030026664A (en) | 2001-09-26 | 2003-04-03 | 주식회사 동진쎄미켐 | A color resist remover composition for tft-lcd preparation |
| KR20140028962A (en) | 2012-08-31 | 2014-03-10 | 주식회사 이엔에프테크놀로지 | Stripper composition for thick negative photoresist |
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2015
- 2015-07-13 KR KR1020150099076A patent/KR20160017606A/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030026664A (en) | 2001-09-26 | 2003-04-03 | 주식회사 동진쎄미켐 | A color resist remover composition for tft-lcd preparation |
| KR20140028962A (en) | 2012-08-31 | 2014-03-10 | 주식회사 이엔에프테크놀로지 | Stripper composition for thick negative photoresist |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180035590A (en) * | 2016-09-29 | 2018-04-06 | 주식회사 엘지화학 | Composition for cleaning substrate of display device and preparing method of display device using the same |
| KR20220104767A (en) | 2019-11-20 | 2022-07-26 | 닛산 가가쿠 가부시키가이샤 | Detergent Compositions and Cleaning Methods |
| US11732214B2 (en) | 2019-11-20 | 2023-08-22 | Nissan Chemical Corporation | Cleaning agent composition comprising an alkylamide solvent and a fluorine-containing quaternary ammonium salt |
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