JP2008508698A5 - - Google Patents
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- Publication number
- JP2008508698A5 JP2008508698A5 JP2007522906A JP2007522906A JP2008508698A5 JP 2008508698 A5 JP2008508698 A5 JP 2008508698A5 JP 2007522906 A JP2007522906 A JP 2007522906A JP 2007522906 A JP2007522906 A JP 2007522906A JP 2008508698 A5 JP2008508698 A5 JP 2008508698A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- support
- laser chip
- mirror
- laser module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 description 193
- 230000003287 optical effect Effects 0.000 description 144
- 125000006850 spacer group Chemical group 0.000 description 36
- 238000000576 coating method Methods 0.000 description 21
- 239000011248 coating agent Substances 0.000 description 20
- 238000006243 chemical reaction Methods 0.000 description 17
- 238000000034 method Methods 0.000 description 17
- 239000000463 material Substances 0.000 description 15
- 239000011521 glass Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000005530 etching Methods 0.000 description 8
- 238000007493 shaping process Methods 0.000 description 8
- 238000005476 soldering Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 239000013078 crystal Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 230000010287 polarization Effects 0.000 description 5
- 230000003595 spectral effect Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- 239000004576 sand Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 201000009310 astigmatism Diseases 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- 235000004522 Pentaglottis sempervirens Nutrition 0.000 description 1
- SXBYYSODIPNHAA-UHFFFAOYSA-N [Bi+3].[Bi+3].[Bi+3].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] Chemical compound [Bi+3].[Bi+3].[Bi+3].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] SXBYYSODIPNHAA-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- VCZFPTGOQQOZGI-UHFFFAOYSA-N lithium bis(oxoboranyloxy)borinate Chemical compound [Li+].[O-]B(OB=O)OB=O VCZFPTGOQQOZGI-UHFFFAOYSA-N 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102004037019 | 2004-07-30 | ||
| DE102004037019.2 | 2004-07-30 | ||
| DE102004050118.1 | 2004-10-14 | ||
| DE102004050118A DE102004050118A1 (de) | 2004-07-30 | 2004-10-14 | Halbleiterlaserbauelement, optische Vorrichtung für ein Halbleiterlaserbauelement und Verfahren zur Herstellung einer optischen Vorrichtung |
| PCT/DE2005/001122 WO2006012819A1 (de) | 2004-07-30 | 2005-06-24 | Halbleiterlaserbauelement, optische vorrichtung für ein halbleiterlaserbauelement und verfahren zur herstellung einer optischen vorrichtung |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008508698A JP2008508698A (ja) | 2008-03-21 |
| JP2008508698A5 true JP2008508698A5 (enExample) | 2011-12-01 |
| JP4886686B2 JP4886686B2 (ja) | 2012-02-29 |
Family
ID=34972330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007522906A Expired - Fee Related JP4886686B2 (ja) | 2004-07-30 | 2005-06-24 | 半導体レーザモジュール、半導体レーザモジュールのための光学装置および光学装置の製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7860144B2 (enExample) |
| EP (1) | EP1771926B1 (enExample) |
| JP (1) | JP4886686B2 (enExample) |
| KR (1) | KR101156808B1 (enExample) |
| DE (1) | DE102004050118A1 (enExample) |
| TW (1) | TWI292246B (enExample) |
| WO (1) | WO2006012819A1 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006017293A1 (de) | 2005-12-30 | 2007-07-05 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer optisch pumpbaren Halbleitervorrichtung |
| DE102006017294A1 (de) * | 2005-12-30 | 2007-07-05 | Osram Opto Semiconductors Gmbh | Optisch pumpbare Halbleitervorrichtung |
| AT503027B1 (de) * | 2006-05-08 | 2007-07-15 | Austria Tech & System Tech | Leiterplattenelement mit optoelektronischem bauelement und licht-wellenleiter |
| DE102006040263A1 (de) * | 2006-08-28 | 2008-03-06 | Osram Opto Semiconductors Gmbh | Optisches Element, optoelektronische Halbleitervorrichtung sowie Verfahren zur Herstellung eines optischen Elements |
| DE102006042195A1 (de) * | 2006-09-08 | 2008-03-27 | Osram Opto Semiconductors Gmbh | Etalon und optoelektronische Halbleitervorrichtung |
| DE102007004302A1 (de) * | 2006-09-29 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Halbleiterchip und Verfahren zur Herstellung eines Halbleiterchips |
| JP2008198980A (ja) * | 2007-01-15 | 2008-08-28 | Seiko Epson Corp | レーザ光源装置、照明装置、画像表示装置、及びモニタ装置 |
| DE102007062047A1 (de) | 2007-12-21 | 2009-07-16 | Osram Opto Semiconductors Gmbh | Kompaktgehäuse |
| JP5024088B2 (ja) * | 2008-02-05 | 2012-09-12 | セイコーエプソン株式会社 | レーザ光源装置、照明装置、画像表示装置及びモニタ装置 |
| JP2009192873A (ja) * | 2008-02-15 | 2009-08-27 | Seiko Epson Corp | 光源装置、画像表示装置及びモニタ装置 |
| DE102008010297A1 (de) * | 2008-02-21 | 2009-10-29 | Osram Opto Semiconductors Gmbh | Frequenz-Konversions-Vorrichtung und Verfahren zur Herstellung einer Frequenz-Konversions-Vorrichtung |
| US7669366B2 (en) * | 2008-04-12 | 2010-03-02 | Felknor Ventures Llc | Plant retainer for retaining a plant for growth from the side or bottom of a planter |
| DE102008030818B4 (de) * | 2008-06-30 | 2022-03-03 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Oberflächenemittierender Halbleiterlaser mit mehreren aktiven Zonen |
| DE102008052376A1 (de) * | 2008-10-20 | 2010-04-22 | Osram Opto Semiconductors Gmbh | Laseranordnung |
| KR101978013B1 (ko) * | 2012-01-20 | 2019-05-13 | 엑살로스 아게 | Oct를 위한 그리즘을 갖춘 파장-가변형 외부 캐비티 레이저 다이오드 |
| DE102012205513B4 (de) * | 2012-04-04 | 2021-12-09 | Osram Gmbh | Verfahren zum Herstellen einer Strahlungsanordnung und Strahlungsanordnung |
| US10043615B2 (en) * | 2012-10-08 | 2018-08-07 | Maxwell Technologies, Inc. | Electrode porosity for three-volt ultracapacitor |
| US10270224B2 (en) * | 2015-06-04 | 2019-04-23 | Nlight, Inc. | Angled DBR-grating laser/amplifier with one or more mode-hopping regions |
| EP3130950A1 (de) | 2015-08-10 | 2017-02-15 | Multiphoton Optics Gmbh | Strahlumlenkelement sowie optisches bauelement mit strahlumlenkelement |
| DE102016107499A1 (de) * | 2016-04-22 | 2017-10-26 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Frequenzverdoppler sowie Verfahren zum Erzeugen elektromagnetischer Strahlung |
| DE102016107715A1 (de) * | 2016-04-26 | 2017-10-26 | Osram Opto Semiconductors Gmbh | Lasermodul mit einem optischen Bauteil |
| US10263391B2 (en) * | 2017-09-07 | 2019-04-16 | Apple Inc. | Horizontal external-cavity laser geometry |
| EP4033621B1 (en) | 2019-09-20 | 2023-11-01 | Nichia Corporation | Light source device and method of manufacturing the same |
| DE102019215098A1 (de) * | 2019-10-01 | 2021-04-01 | Robert Bosch Gmbh | Mikromechanisch-optisches Bauteil und Herstellungsverfahren |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU659270B2 (en) * | 1992-02-20 | 1995-05-11 | Sony Corporation | Laser light beam generating apparatus |
| DE19536880B4 (de) * | 1995-09-01 | 2006-08-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Laseranordnung zur Skalierung von frequenzverdoppelten Lasern |
| WO1997009759A1 (de) | 1995-09-01 | 1997-03-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Laseranordnung und verfahren zur skalierung von frequenzverdoppelten lasern |
| DE19548647C2 (de) | 1995-12-14 | 2003-01-23 | Manfred Gabbert | Durchstimmbare, justierstabile Halbleiterlaserlichtquelle sowie ein Verfahren zur optisch stabilen, weitgehend kontinuierlichen Durchstimmung von Halbleiterlasern |
| US6002695A (en) * | 1996-05-31 | 1999-12-14 | Dpss Lasers, Inc. | High efficiency high repetition rate, intra-cavity tripled diode pumped solid state laser |
| GB2325334B (en) | 1998-07-10 | 1999-04-14 | Bookham Technology Ltd | External cavity laser |
| DE19929878A1 (de) | 1999-06-29 | 2001-01-04 | Bosch Gmbh Robert | Träger zur Montage optoelektronischer Bauteile und Verfahren zur Herstellung |
| EP1513006B1 (en) | 1999-10-28 | 2010-12-15 | FUJIFILM Corporation | Light wavelength converting system |
| JP2001230492A (ja) * | 2000-02-21 | 2001-08-24 | Fuji Photo Film Co Ltd | 半導体発光装置 |
| US6711203B1 (en) * | 2000-09-22 | 2004-03-23 | Blueleaf, Inc. | Optical transmitter comprising a stepwise tunable laser |
| US6862301B2 (en) * | 2001-12-31 | 2005-03-01 | Finisar Corporation | Tunable laser assembly |
| DE10214120B4 (de) * | 2002-03-28 | 2007-06-06 | Osram Opto Semiconductors Gmbh | Optisch pumpbare oberflächenemittierende Halbleiterlaservorrichtung |
| DE10241192A1 (de) * | 2002-09-05 | 2004-03-11 | Osram Opto Semiconductors Gmbh | Optisch gepumpte strahlungsemittierende Halbleitervorrichtung und Verfahren zu deren Herstellung |
| DE10253907A1 (de) | 2002-09-20 | 2004-04-01 | Osram Opto Semiconductors Gmbh | Optischer Abtastkopf und Verfahren zur Herstellung desselben |
| JP2004221321A (ja) * | 2003-01-15 | 2004-08-05 | Mitsubishi Electric Corp | 波長可変半導体光装置 |
-
2004
- 2004-10-14 DE DE102004050118A patent/DE102004050118A1/de not_active Withdrawn
-
2005
- 2005-06-24 JP JP2007522906A patent/JP4886686B2/ja not_active Expired - Fee Related
- 2005-06-24 KR KR1020077004813A patent/KR101156808B1/ko not_active Expired - Fee Related
- 2005-06-24 WO PCT/DE2005/001122 patent/WO2006012819A1/de not_active Ceased
- 2005-06-24 US US11/659,065 patent/US7860144B2/en not_active Expired - Fee Related
- 2005-06-24 EP EP05759656.1A patent/EP1771926B1/de not_active Ceased
- 2005-07-27 TW TW094125358A patent/TWI292246B/zh not_active IP Right Cessation
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