JP2008504714A5 - - Google Patents

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Publication number
JP2008504714A5
JP2008504714A5 JP2007519288A JP2007519288A JP2008504714A5 JP 2008504714 A5 JP2008504714 A5 JP 2008504714A5 JP 2007519288 A JP2007519288 A JP 2007519288A JP 2007519288 A JP2007519288 A JP 2007519288A JP 2008504714 A5 JP2008504714 A5 JP 2008504714A5
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JP
Japan
Prior art keywords
substrate
solution
energy source
layer
light source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007519288A
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English (en)
Japanese (ja)
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JP2008504714A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2005/022172 external-priority patent/WO2006012174A2/en
Publication of JP2008504714A publication Critical patent/JP2008504714A/ja
Publication of JP2008504714A5 publication Critical patent/JP2008504714A5/ja
Withdrawn legal-status Critical Current

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JP2007519288A 2004-06-28 2005-06-23 基板を洗浄及びエッチングするシステム及び方法 Withdrawn JP2008504714A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US88000704A 2004-06-28 2004-06-28
PCT/US2005/022172 WO2006012174A2 (en) 2004-06-28 2005-06-23 System and method of cleaning and etching a substrate

Publications (2)

Publication Number Publication Date
JP2008504714A JP2008504714A (ja) 2008-02-14
JP2008504714A5 true JP2008504714A5 (enExample) 2008-08-07

Family

ID=35786645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007519288A Withdrawn JP2008504714A (ja) 2004-06-28 2005-06-23 基板を洗浄及びエッチングするシステム及び方法

Country Status (6)

Country Link
EP (1) EP1782461A4 (enExample)
JP (1) JP2008504714A (enExample)
KR (1) KR20070026687A (enExample)
CN (1) CN101006571A (enExample)
TW (1) TWI271793B (enExample)
WO (1) WO2006012174A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010236088A (ja) * 2009-03-09 2010-10-21 Hitachi High-Technologies Corp マスク部材のクリーニング装置及びクリーニング方法並びに有機ｅｌディスプレイ
US20130068264A1 (en) * 2011-09-21 2013-03-21 Nanya Technology Corporation Wafer scrubber apparatus
KR101992422B1 (ko) * 2012-08-14 2019-06-24 주식회사 동진쎄미켐 광분해 고도산화공정을 이용한 금속막의 연마 장치 및 방법
KR102095084B1 (ko) * 2013-11-11 2020-03-30 도쿄엘렉트론가부시키가이샤 자외선 처리를 이용하여 금속 하드마스크의 제거를 강화시키는 시스템 및 방법
KR102166974B1 (ko) * 2013-11-11 2020-10-16 도쿄엘렉트론가부시키가이샤 에칭 후 폴리머의 제거 및 하드마스크 제거의 향상을 위한 방법 및 하드웨어
US10896824B2 (en) * 2018-12-14 2021-01-19 Tokyo Electron Limited Roughness reduction methods for materials using illuminated etch solutions
US10867815B2 (en) * 2018-09-04 2020-12-15 Tokyo Electron Limited Photonically tuned etchant reactivity for wet etching
US12112959B2 (en) 2018-09-04 2024-10-08 Tokyo Electron Limited Processing systems and platforms for roughness reduction of materials using illuminated etch solutions
CN113302730B (zh) * 2018-12-14 2024-11-22 东京毅力科创株式会社 使用照射刻蚀溶液来降低材料粗糙度的加工系统和平台

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5512123A (en) * 1992-05-19 1996-04-30 Maxwell Laboratories Method for using pulsed optical energy to increase the bondability of a surface
US5782986A (en) * 1996-01-11 1998-07-21 Fsi International Process for metals removal using beta-diketone or beta-ketoimine ligand forming compounds
US6631726B1 (en) * 1999-08-05 2003-10-14 Hitachi Electronics Engineering Co., Ltd. Apparatus and method for processing a substrate
US6503464B1 (en) * 1999-08-12 2003-01-07 Sipec Corporation Ultraviolet processing apparatus and ultraviolet processing method
JP3961240B2 (ja) * 2001-06-28 2007-08-22 株式会社半導体エネルギー研究所 半導体装置の作製方法

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