JP2008502815A - 高い熱伝導性被覆を有する織物 - Google Patents
高い熱伝導性被覆を有する織物 Download PDFInfo
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- JP2008502815A JP2008502815A JP2007516577A JP2007516577A JP2008502815A JP 2008502815 A JP2008502815 A JP 2008502815A JP 2007516577 A JP2007516577 A JP 2007516577A JP 2007516577 A JP2007516577 A JP 2007516577A JP 2008502815 A JP2008502815 A JP 2008502815A
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Abstract
Description
本願は、2004年6月15日、Smith等により出願した米国出願60/580023により優先権を主張し、この内容は引用により本発明に含まれる。本願は更にSmith等による、米国特許明細書、Insulation Paper with High Thermal Conductivity Materialsに関し、この内容は引用により本発明に含まれる。
本発明は高い熱伝導性表面被覆を塗装することによる織物の熱伝導性の増加に関する。
任意の形の電気機器の使用とともに、電気的絶縁導体が必要である。大きさを連続的に減少し、すべての電気的および電子装置を効率よくする動きとともに、よりよい、より緻密な絶縁体および絶縁装置を見出すことが必要である。
前記のことを考慮して、本発明による方法および装置は、高い熱伝導性材料で織物を表面被覆することにより特に織物の熱伝導性を促進する。織物が個々の繊維、またはストランド、ストランドの束、成形された織物またはその組合せである場合に、織物を表面被覆することができる。
本発明を以下の図面に示された実施例により詳細に説明する。
本発明は繊維マトリックス上のダイアモンド類似被覆(DLC)のような高い熱伝導性被覆(HTC)を提供する。繊維マトリックスの語は一般に繊維からなる織物に関する。議論されたように、本発明は、繊維マトリックスが最初の織物以前の繊維、完成した織物、中間段階の織物、およびその組合せである場合に、繊維マトリックスに塗装できる。繊維マトリックスはプリント回路板の裏材料、または絶縁テープの高い引張り強さの層のような多くの産業に使用される。
Claims (20)
- 高い熱伝導性を有する織物であり、前記織物が、前記織物に織り込まれた繊維マトリックス、前記繊維マトリックス上に配置された高い熱伝導性被覆を有する、高い熱伝導性を有する織物において、前記高い熱伝導性被覆がダイアモンド類似被覆、金属酸化物、金属窒化物、金属炭化物の少なくとも1種を有し、または前記高い熱伝導性被覆が混合した化学量および非化学量の組合せを有し、前記織物が50〜500W/mKの熱伝導率を有することを特徴とする、高い熱伝導性を有する織物。
- 前記繊維マトリックスがガラス繊維である請求項1記載の織物。
- 前記織物が更に絶縁テープに成形される請求項1記載の織物。
- 前記織物が更に回路板に成形される請求項1記載の織物。
- 前記繊維マトリックスがポリイミド、ポリアミド、ポリエチレンテレフタレート、ポリマーミクロ繊維、プロピレンポリマー、およびオレフィンポリマーの少なくとも1種である請求項1記載の織物。
- 前記高い熱伝導性被覆が化学蒸着および物理蒸着の少なくとも1つにより前記繊維マトリックスに配置される請求項1記載の織物。
- 前記織物に樹脂が含浸されている請求項1記載の織物。
- 前記高い熱伝導性被覆が前記繊維マトリックス上に50〜100nmの平均厚さを有する請求項1記載の織物。
- 前記高い熱伝導性被覆がAl2O3、AlN、MgO2、ZnO、BN、Si3N4,SiCおよびSiO2の少なくとも1種を有する請求項1記載の織物。
- 少なくとも1種の雲母層、および少なくとも1種のガラス織物層を有する電気的絶縁テープにおいて、前記ガラス織物層がガラスマトリックスに配置された高い熱伝導性被覆を有するガラスマトリックスを有し、前記高い熱伝導性被覆が混合した化学量および非化学量の組合せを有し、前記ガラス織物層が50〜500W/mKの熱伝導率を有することを特徴とする、電気的絶縁テープ。
- 前記高い熱伝導性被覆がダイアモンド類似被覆である請求項10記載の電気的絶縁テープ。
- 前記ダイアモンド類似被覆が前記繊維マトリックス上に50〜100nmの平均深さを有する請求項11記載の電気的絶縁テープ。
- 前記高い熱伝導性被覆が金属酸化物、金属窒化物および金属炭化物の少なくとも1種である請求項10記載の電気的絶縁テープ。
- 前記高い熱伝導性被覆がAl2O3、AlN、MgO2、ZnO、BN、Si3N4、SiCおよびSiO2の少なくとも1種を有する請求項13記載の電気的絶縁テープ。
- 前記ガラス織物層が200〜500W/mKの熱伝導率を有する請求項10記載の電気的絶縁テープ。
- 織物以前のガラス繊維を高い熱伝導性被覆層で表面被覆し、
前記ガラス繊維を前記ガラス織物に成形することからなる、高い熱伝導性被覆を有するガラス織物を形成する方法において、前記高い熱伝導性(HTC)層がダイアモンド類似被覆、金属酸化物およびその組合せの少なくとも1種を有し、前記ガラス織物が50〜500W/mKの熱伝導率を有することを特徴とする、高い熱伝導性被覆を有するガラス織物を形成する方法。 - 前記織物以前のガラス繊維に、表面被覆の前に澱粉化合物を散布する請求項16記載の方法。
- 前記澱粉化合物が前記HTC層と前記ガラス繊維の間に非晶質炭素中間層を形成する請求項17記載の方法。
- 表面被覆工程で前記高い熱伝導性被覆層の代わりに前記澱粉化合物を使用する請求項17記載の方法。
- 高い熱伝導性被覆を有するガラス織物を形成する方法であり、織物以前のガラス繊維をガラス織物に成形し、前記ガラス織物を、高い熱伝導性被覆層で被覆することからなる、高い熱伝導性被覆を有するガラス織物を形成する方法において、前記高い熱伝導性(HTC)層がダイアモンド類似被覆、金属酸化物およびその組合せの少なくとも1種を有し、前記ガラス織物が50〜500W/mKの熱伝導率を有することを特徴とする、高い熱伝導性被覆を有するガラス織物を形成する方法。
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Cited By (6)
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JP2008502782A (ja) * | 2004-06-15 | 2008-01-31 | シーメンス パワー ジェネレーション インコーポレイテッド | 高熱伝導性充填剤を有する構造化樹脂系 |
JP2008507594A (ja) * | 2004-06-15 | 2008-03-13 | シーメンス パワー ジェネレーション インコーポレイテッド | 樹脂内に配列した高熱伝導性材料 |
WO2013009133A3 (ko) * | 2011-07-13 | 2013-04-11 | 주식회사 포스코 | 표면 처리용 수지 조성물 및 이에 의해 코팅된 강판 |
KR101271965B1 (ko) * | 2011-07-13 | 2013-06-07 | 주식회사 노루코일코팅 | 표면 처리용 수지 조성물 및 이에 의해 코팅된 강판 |
US9376576B2 (en) | 2011-07-13 | 2016-06-28 | Posco | Resin composition for a surface treatment, and steel sheet coated with same |
JP2020170828A (ja) * | 2019-04-05 | 2020-10-15 | Tdk株式会社 | 基板および積層基板 |
Also Published As
Publication number | Publication date |
---|---|
EP1761934A1 (en) | 2007-03-14 |
KR101270084B1 (ko) | 2013-05-31 |
KR20070022392A (ko) | 2007-02-26 |
EP1761934B1 (en) | 2017-09-27 |
US7967938B2 (en) | 2011-06-28 |
US20050277350A1 (en) | 2005-12-15 |
US20100215861A1 (en) | 2010-08-26 |
US7837817B2 (en) | 2010-11-23 |
US20090238959A1 (en) | 2009-09-24 |
WO2006002013A1 (en) | 2006-01-05 |
US7553781B2 (en) | 2009-06-30 |
JP4960861B2 (ja) | 2012-06-27 |
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