JP2020170828A - 基板および積層基板 - Google Patents
基板および積層基板 Download PDFInfo
- Publication number
- JP2020170828A JP2020170828A JP2019073024A JP2019073024A JP2020170828A JP 2020170828 A JP2020170828 A JP 2020170828A JP 2019073024 A JP2019073024 A JP 2019073024A JP 2019073024 A JP2019073024 A JP 2019073024A JP 2020170828 A JP2020170828 A JP 2020170828A
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- Prior art keywords
- inorganic filler
- substrate
- cloth
- base material
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
Classifications
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- H—ELECTRICITY
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Abstract
Description
前記布状基材の表面に第1無機フィラーが存在している基板。
前記第2無機フィラーの長手方向の長さが5μm〜15μmである前記[6]に記載の基板。
前記布状基材と前記第2無機フィラーとを連結するように前記第1無機フィラーの集合体が存在している前記[8]または[9]に記載の基板。
前記第1無機フィラーの集合体の少なくとも一部が前記第1糸と前記第2糸との交差部に含まれている前記[8]〜[10]のいずれかに記載の基板。
図1に示すように、本発明の一実施形態に係る積層基板2は、布状基材6と、樹脂部8とを含む基板4と、導電層10と、を含む。また、図1には示していないが、本発明の一実施形態に係る基板4はさらに第1無機フィラーを含み、布状基材6の表面には、第1無機フィラーが存在する。
図1に示すように、本実施形態に係る基板4は、布状基材6と樹脂部8とを有する。図1には示していないが、本実施形態に係る基板4はさらに第1無機フィラーを有し、第1無機フィラーが表面に存在している布状基材6に樹脂部8が保持されている構成となっている。
本実施形態の布状基材6の厚みの上限は特に制限されない。本実施形態の布状基材6の厚み(Tc)は、20μm以上、100μm以下であり、特に75μm以下であることが好ましい。これにより、放熱性をより高められると共に、基板4を屈曲させ易くなる。また、基板4の強度を適切に確保することができる。さらに、布状基材6に後述する樹脂ペーストを含浸させ易くなる。本実施形態の布状基材6の厚みは、60μm以下であることがより好ましい。本実施形態の布状基材6の厚みの下限は特に制限されないが、たとえば10μm以上である。これにより、基板4の強度を適切に確保することができる。
本実施形態に係る第1無機フィラーの粒径は、布状基材6を構成する糸(第1糸6aおよび第2糸6b)の断面径よりも小さいことが好ましい。これにより、布状基材6の第1糸6aと第2糸6bとの交差部に近接して第1無機フィラーを配置することが可能となる他、第1無機フィラーの密度を高めることができる。これらの効果の結果として、基板4の放熱性をより高めることができる。
図1に示すように、本実施形態に係る基板4は樹脂部8を有する。
本実施形態に係る第2無機フィラー16a,16bの粒径は、第1無機フィラーの粒径よりも大きい。上記の通り、第1無機フィラーは粒径が小さいことから、後述する複合布状基材26を得ることで、布状基材6の第1糸6aと第2糸6bとの交差部に近接して配置されることが可能である。
本実施形態に係る樹脂部8を構成する樹脂18としては、公知の熱硬化性樹脂を用いることができる。具体的には、エポキシ樹脂、フェノール樹脂、シアネート樹脂、トリアジン樹脂、ポリイミド樹脂、ポリアミドイミド樹脂、シリコーン樹脂、メラミン樹脂、ユリア樹脂、フラン樹脂、アルキド樹脂、ポリエステル樹脂およびジアリルフタレート樹脂などが例示される。これらの樹脂を1種単独で用いてもよいし、2種以上を組み合わせて用いてもよい。
図1に示す本実施形態に係る導電層10の厚みTeは特に制限されない。導電層10の厚みTeは、1μm〜200μmであることが好ましく、30μm〜150μmであることがより好ましい。
本実施形態では、図4Cに示すように、表面に第1無機フィラー24が存在している複合布状基材26を用いて積層基板2を製造する。表面に第1無機フィラー24が存在している複合布状基材26の製造方法は公知の手法が用いられる。
上記において説明した本実施形態は、布状基材6を含む基板4であって、布状基材6の表面に第1無機フィラーが存在している基板4である。
布状基材6としてガラス繊維織布(株式会社有沢製作所製、IPC規格1080)を準備した。
硬化剤=1,3,5−トリス(4−ヒドロキシフェニル)ベンゼン(THPB)
硬化促進剤=2−エチルー4−メチルイミダゾール(四国化成社製 2E4MZ)
溶剤=メチルエチルケトン
1回目の加熱プレス
温度:170℃
圧力:1MPa
時間:20分
2回目の加熱プレス
温度=200℃
圧力=4MPa
時間=1時間
基板4の枚数=6枚
基板4の厚み(Tp)=150μm
布状基材6の厚み(Tc)=50μm
導電層10の厚み(Te)=50μm
得られた積層基板2を切断して円形状の測定用試料(直径=10mm、厚さ=0.87〜0.9mm)を作製した。
λ=α×Cp×r
λ=熱伝導率(W/(m・K))
α=熱拡散係数(m2/s)
Cp=比熱(J/kg・K)
r=密度(kg/m3)
複合布状基材6を作製する際に、エアブラシの噴霧時間を変更した以外は実施例1と同様にして積層基板2を作製した。
第1無機フィラーが吸着していない布状基材6を用いた以外は実施例1と同様にして積層基板2を作製した。得られた積層基板2について、実施例1と同様にして熱伝導率を測定した。結果を表1に示す。
第1無機フィラーが吸着していない布状基材6を用い、第2無機フィラーも添加しなかった以外は実施例1と同様にして積層基板2を作製した。得られた積層基板2について、実施例1と同様にして熱伝導率を測定した。結果を表1に示す。
4,4a,4b,4c… 基板
6… 布状基材
6a… 第1糸
6b… 第2糸
8… 樹脂部
10… 導電層
14… 第1無機フィラーの集合体
24… 第1無機フィラー
16a,16b… 第2無機フィラー
18… 樹脂
26… 複合布状基材
Claims (15)
- 布状基材を含む基板であって、
前記布状基材の表面に第1無機フィラーが存在している基板。 - 前記布状基材の材質がガラスである請求項1に記載の基板。
- 前記第1無機フィラーの材質が窒化ホウ素、酸化アルミニウム、窒化アルミニウムおよび酸化マグネシウムからなる群から選ばれる少なくとも1つである請求項1または2に記載の基板。
- 前記第1無機フィラーの粒径が前記布状基材を構成する糸の断面径よりも小さい請求項1〜3のいずれかに記載の基板。
- 前記第1無機フィラーの粒径が1μm以下である請求項1〜4のいずれかに記載の基板。
- 前記第1無機フィラーの粒径よりも大きい第2無機フィラーを有する請求項1〜5のいずれかに記載の基板。
- 前記第2無機フィラーは鱗片状であり、
前記第2無機フィラーの長手方向の長さが5μm〜15μmである請求項6に記載の基板。 - 前記第1無機フィラーが集合している第1無機フィラーの集合体が、前記布状基材の表面に存在している請求項1〜7のいずれかに記載の基板。
- 前記布状基材に含まれる糸に近接して前記第1無機フィラーの集合体が存在している請求項8に記載の基板。
- 前記第1無機フィラーの粒径よりも大きい第2無機フィラーを有し、
前記布状基材と前記第2無機フィラーとを連結するように前記第1無機フィラーの集合体が存在している請求項8または9に記載の基板。 - 前記布状基材が第1糸と第2糸が交差するように織られており、
前記第1無機フィラーの集合体の少なくとも一部が前記第1糸と前記第2糸との交差部に含まれている請求項8〜10のいずれかに記載の基板。 - 前記第1糸に沿って前記第1無機フィラーの集合体が10μm以上の範囲で存在する請求項8〜11に記載の基板。
- 前記第1糸の短手方向端部から、前記第1糸の長手方向に対して垂直方向に前記第1無機フィラーの集合体が5μm以上の範囲で存在する請求項8〜12のいずれかに記載の基板。
- 前記第1糸の短手方向の端部から、前記第1糸の長手方向に対して垂直方向に1μm以下の範囲に第1無機フィラーが存在する請求項8〜13のいずれかに記載の基板。
- 請求項1〜14のいずれかに記載の基板が2以上積層されている積層基板。
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WO1999044956A1 (en) * | 1998-03-03 | 1999-09-10 | Ppg Industries Ohio, Inc. | Inorganic particle-coated glass fiber strands and products including the same |
JP2004231426A (ja) * | 2003-01-28 | 2004-08-19 | Asahi Schwebel Co Ltd | 表面処理ガラスクロス |
JP2005105035A (ja) * | 2003-09-29 | 2005-04-21 | Asahi Schwebel Co Ltd | プリプレグとその製造方法、及び積層板 |
JP2008502815A (ja) * | 2004-06-15 | 2008-01-31 | シーメンス パワー ジェネレーション インコーポレイテッド | 高い熱伝導性被覆を有する織物 |
JP2006036869A (ja) * | 2004-07-26 | 2006-02-09 | Shin Kobe Electric Mach Co Ltd | プリプレグ、積層板およびプリント配線板 |
JP2007224269A (ja) * | 2006-01-27 | 2007-09-06 | Shin Kobe Electric Mach Co Ltd | 加熱加圧成形用プリプレグおよび積層板 |
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