JP2008296578A - 圧電インクジェットデバイスの製作方法 - Google Patents
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Abstract
【解決手段】圧力チャンバ(16)と、圧力チャンバを画定する可撓性薄膜(18)と、薄膜に取り付けられる圧電アクチュエータ(20)と、アクチュエータ(20)を保持する薄膜(18)の面に接着された剛性基板(22)とを有する圧電インクジェットデバイスの製作方法であって、
少なくとも1つの面に電極(32)を有する圧電アクチュエータ(20)を用意するステップと、
その電極面でアクチュエータ(20)をキャリアプレート(80)に接着するステップと、
アクチュエータ(20)を保持するキャリアプレート(80)の面に剛性基板(22)を接合するステップと、
アクチュエータ(20)とは反対側の面でキャリアプレート(80)から材料(82)を除去し、次に薄膜(18)を形成するキャリアプレートの薄層のみを残すステップとを含むことを特徴とする、方法。
【選択図】図12
Description
アクチュエータを保持するキャリアプレートの面に剛性基板を接合するステップと、
アクチュエータとは反対側の面でキャリアプレートから材料を除去し、薄膜を形成するキャリアプレートの薄層のみを残すステップとを含む方法に関する。
12 ノズル
14 チャンバプレート
16 圧力チャンバ
18 可撓性薄膜
20 圧電アクチュエータ
22 分配プレート
24 カバープレート
26、42、78 接着層
28 導電構造
30、40 ワイヤボンド
32 下部電極
34 上部電極
36 圧電層
38 絶縁層
44 アクチュエータチャンバ
46 インク供給チャネル
48 フィードスルー
50 フィルタ通路
51 誘電層
52 電子構成部材
54 開口部
56 チップ
58 横断壁
60 通気孔
62 ウェハ
64、68 層
66 導電路
70 ラビリンス
72 圧電材料スラブ
74 電極
76 溝
80 キャリアプレート
82 シリコン層
84 二酸化ケイ素層
86 部分
X 円
Claims (10)
- 可撓性薄膜(18)と、薄膜に取り付けられる圧電アクチュエータ(20)と、アクチュエータ(20)を保持する薄膜(18)の面に接着された剛性基板(22)とを有する圧電インクジェットデバイスの製作方法であって、
アクチュエータ(20)を保持するキャリアプレート(80)の面に剛性基板(22)を接合するステップと、
アクチュエータ(20)とは反対側の面でキャリアプレート(80)から材料(82)を除去し、次に薄膜(18)を形成するキャリアプレートの薄層のみを残すステップとを含み、
圧電アクチュエータ(20)の少なくとも1つの面に電極(32)が用意され、アクチュエータ(20)が次にその電極面でキャリアプレート(80)に接着され、キャリアプレート(80)の材料がエッチングによって除去されることを特徴とする、方法。 - キャリアプレート(80)が、SOIウェハであり、そのウェハの酸化物層(84)が、エッチストップとして用いられる、請求項1に記載の方法。
- インク供給システムを画定する分配プレート(22)およびアクチュエータ(20)を収容するためのチャンバ(44)が、剛性基板として用いられる請求項1または2に記載の方法。
- 分配プレート(22)が、シリコンウェハを構造化することによって形成される、請求項3に記載の方法。
- 複数のノズルおよびアクチュエータユニットを有する少なくとも1つのチップ(56)のための複数のアクチュエータ(20)が、共通のウェハ(62)上に形成される、請求項1から4のいずれか一項に記載の方法。
- 前記少なくとも1つのチップ(56)の分配プレート(22)が、共通のウェハの上に形成され、分配プレート(22)およびキャリアプレート(80)を形成するウェハが、個別のチップ(56)に分離される前に、共に接合される、請求項5に記載の方法。
- アクチュエータ(20)が、熱圧着によってキャリアプレートに接着される、請求項1から6のいずれか一項に記載の方法。
- 前記アクチュエータ(20)は、キャリアプレート(80)に接着される状態で、両面に電極(32、74)を有し、これらの電極が、熱圧着中に短絡される、請求項7に記載の方法。
- 複数のアクチュエータ(20)のための圧電層(36)が、アクチュエータの前記少なくとも1つの電極(32)を保持する面で、圧電材料の共通のスラブ(72)に溝(76)を切削することによって形成され、スラブ(72)が、キャリアプレート(80)に取り付けられ、アクチュエータの圧電層(36)が、スラブ(72)の連続上部部分を除去することによって、互いから離隔される、請求項1から8のいずれか一項に記載の方法。
- 剛性基板(22)と、アクチュエータ(20)を有する薄膜(18)のジョイント構造を圧力チャンバ(16)が形成されるチャンバプレート(14)に接合し、アクチュエータが薄膜の他方の面で圧力チャンバに対向するようにする別のステップを含む、請求項1から9のいずれか一項に記載の方法。
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