JP2008277750A - 電子素子内蔵印刷回路基板の製造方法 - Google Patents

電子素子内蔵印刷回路基板の製造方法 Download PDF

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JP2008277750A
JP2008277750A JP2008028551A JP2008028551A JP2008277750A JP 2008277750 A JP2008277750 A JP 2008277750A JP 2008028551 A JP2008028551 A JP 2008028551A JP 2008028551 A JP2008028551 A JP 2008028551A JP 2008277750 A JP2008277750 A JP 2008277750A
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circuit board
printed circuit
manufacturing
built
connection
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Japanese (ja)
Inventor
Jee-Soo Mok
智 秀 睦
Jun Hyung Park
俊 炯 朴
Ki-Hwan Kim
起 換 金
Sung-Yong Kim
成 容 金
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49176—Assembling terminal to elongated conductor with molding of electrically insulating material

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2008028551A 2007-04-30 2008-02-08 電子素子内蔵印刷回路基板の製造方法 Pending JP2008277750A (ja)

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KR20170087765A (ko) * 2016-01-21 2017-07-31 삼성전기주식회사 인쇄회로기판
WO2018003391A1 (ja) * 2016-06-29 2018-01-04 株式会社村田製作所 部品内蔵基板及びその製造方法、並びに高周波モジュール

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WO2014091624A1 (ja) * 2012-12-14 2014-06-19 株式会社メイコー 部品内蔵基板および部品内蔵基板の製造方法
JP2015060912A (ja) * 2013-09-18 2015-03-30 日立化成株式会社 半導体素子搭載用パッケージ基板
KR20150102504A (ko) * 2014-02-28 2015-09-07 삼성전기주식회사 임베디드 기판 및 임베디드 기판의 제조 방법
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WO2016114400A1 (ja) * 2015-01-15 2016-07-21 コニカミノルタ株式会社 配線積層構造体及び配線積層構造体の形成方法
KR20170087765A (ko) * 2016-01-21 2017-07-31 삼성전기주식회사 인쇄회로기판
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CN101299908A (zh) 2008-11-05

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