JP2008261750A - 圧力センサおよび圧力センサ用ダイヤフラム - Google Patents
圧力センサおよび圧力センサ用ダイヤフラム Download PDFInfo
- Publication number
- JP2008261750A JP2008261750A JP2007105146A JP2007105146A JP2008261750A JP 2008261750 A JP2008261750 A JP 2008261750A JP 2007105146 A JP2007105146 A JP 2007105146A JP 2007105146 A JP2007105146 A JP 2007105146A JP 2008261750 A JP2008261750 A JP 2008261750A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- diaphragm
- receiving portion
- pressure receiving
- pressure sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000463 material Substances 0.000 claims abstract description 69
- 230000001681 protective effect Effects 0.000 claims abstract description 61
- 238000005259 measurement Methods 0.000 claims description 19
- 230000010355 oscillation Effects 0.000 claims description 16
- 239000010453 quartz Substances 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 10
- 238000001514 detection method Methods 0.000 description 10
- 230000007547 defect Effects 0.000 description 9
- 238000004382 potting Methods 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000013078 crystal Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 238000009530 blood pressure measurement Methods 0.000 description 4
- 230000005284 excitation Effects 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Landscapes
- Measuring Fluid Pressure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007105146A JP2008261750A (ja) | 2007-04-12 | 2007-04-12 | 圧力センサおよび圧力センサ用ダイヤフラム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007105146A JP2008261750A (ja) | 2007-04-12 | 2007-04-12 | 圧力センサおよび圧力センサ用ダイヤフラム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008261750A true JP2008261750A (ja) | 2008-10-30 |
| JP2008261750A5 JP2008261750A5 (enExample) | 2010-05-20 |
Family
ID=39984333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007105146A Withdrawn JP2008261750A (ja) | 2007-04-12 | 2007-04-12 | 圧力センサおよび圧力センサ用ダイヤフラム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008261750A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010186824A (ja) * | 2009-02-10 | 2010-08-26 | Epson Toyocom Corp | 基板の加工方法、部品の製造方法、圧力センサ用ダイヤフラム板及び圧力センサの製造方法、並びに圧力センサ |
| JP2014174169A (ja) * | 2013-03-07 | 2014-09-22 | Sensata Technologies Inc | 自己整合特徴を有する圧力トランスデューサ基板 |
| US10921205B2 (en) | 2016-08-25 | 2021-02-16 | Denso Corporation | Pressure sensor including protective film to avoid adhesion of foreign material |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63281033A (ja) * | 1987-05-13 | 1988-11-17 | Daiwa Shinku Kogyosho:Kk | 圧力検出装置 |
| JPH0298174A (ja) * | 1988-10-04 | 1990-04-10 | Fujikura Ltd | 半導体圧力センサ |
| JP2573309Y2 (ja) * | 1992-06-16 | 1998-05-28 | 沖電気工業株式会社 | 半導体圧力センサ |
| JP2004132913A (ja) * | 2002-10-11 | 2004-04-30 | Toyo Commun Equip Co Ltd | 感圧素子、及びこれを用いた圧力センサ |
-
2007
- 2007-04-12 JP JP2007105146A patent/JP2008261750A/ja not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63281033A (ja) * | 1987-05-13 | 1988-11-17 | Daiwa Shinku Kogyosho:Kk | 圧力検出装置 |
| JPH0298174A (ja) * | 1988-10-04 | 1990-04-10 | Fujikura Ltd | 半導体圧力センサ |
| JP2573309Y2 (ja) * | 1992-06-16 | 1998-05-28 | 沖電気工業株式会社 | 半導体圧力センサ |
| JP2004132913A (ja) * | 2002-10-11 | 2004-04-30 | Toyo Commun Equip Co Ltd | 感圧素子、及びこれを用いた圧力センサ |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010186824A (ja) * | 2009-02-10 | 2010-08-26 | Epson Toyocom Corp | 基板の加工方法、部品の製造方法、圧力センサ用ダイヤフラム板及び圧力センサの製造方法、並びに圧力センサ |
| JP2014174169A (ja) * | 2013-03-07 | 2014-09-22 | Sensata Technologies Inc | 自己整合特徴を有する圧力トランスデューサ基板 |
| US10921205B2 (en) | 2016-08-25 | 2021-02-16 | Denso Corporation | Pressure sensor including protective film to avoid adhesion of foreign material |
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