JP2008251888A - パターン形成方法および電子素子の製造方法 - Google Patents

パターン形成方法および電子素子の製造方法 Download PDF

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Publication number
JP2008251888A
JP2008251888A JP2007092179A JP2007092179A JP2008251888A JP 2008251888 A JP2008251888 A JP 2008251888A JP 2007092179 A JP2007092179 A JP 2007092179A JP 2007092179 A JP2007092179 A JP 2007092179A JP 2008251888 A JP2008251888 A JP 2008251888A
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JP
Japan
Prior art keywords
plate
pattern
liquid composition
conductive
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007092179A
Other languages
English (en)
Japanese (ja)
Inventor
Toshio Fukuda
敏生 福田
Akihiro Nomoto
章裕 野元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2007092179A priority Critical patent/JP2008251888A/ja
Priority to PCT/JP2007/074694 priority patent/WO2008129738A1/ja
Priority to KR1020097020341A priority patent/KR20090127147A/ko
Priority to CN2007800524382A priority patent/CN101641769B/zh
Priority to US12/593,841 priority patent/US8048725B2/en
Priority to TW096149763A priority patent/TW200845445A/zh
Publication of JP2008251888A publication Critical patent/JP2008251888A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00—Bonding of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P58/00—Singulating wafers or substrates into multiple chips, i.e. dicing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/80—Constructional details
    • H10K10/82—Electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Thin Film Transistor (AREA)
  • Printing Methods (AREA)
  • Electroluminescent Light Sources (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2007092179A 2007-03-30 2007-03-30 パターン形成方法および電子素子の製造方法 Pending JP2008251888A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007092179A JP2008251888A (ja) 2007-03-30 2007-03-30 パターン形成方法および電子素子の製造方法
PCT/JP2007/074694 WO2008129738A1 (ja) 2007-03-30 2007-12-21 パターン形成方法および電子素子の製造方法
KR1020097020341A KR20090127147A (ko) 2007-03-30 2007-12-21 패턴 형성 방법 및 전자 소자의 제조 방법
CN2007800524382A CN101641769B (zh) 2007-03-30 2007-12-21 形成图案的方法以及制造电子元件的方法
US12/593,841 US8048725B2 (en) 2007-03-30 2007-12-21 Method of forming pattern and method of producing electronic element
TW096149763A TW200845445A (en) 2007-03-30 2007-12-24 Patterning method and method for fabricating electronic element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007092179A JP2008251888A (ja) 2007-03-30 2007-03-30 パターン形成方法および電子素子の製造方法

Publications (1)

Publication Number Publication Date
JP2008251888A true JP2008251888A (ja) 2008-10-16

Family

ID=39875276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007092179A Pending JP2008251888A (ja) 2007-03-30 2007-03-30 パターン形成方法および電子素子の製造方法

Country Status (6)

Country Link
US (1) US8048725B2 (https=)
JP (1) JP2008251888A (https=)
KR (1) KR20090127147A (https=)
CN (1) CN101641769B (https=)
TW (1) TW200845445A (https=)
WO (1) WO2008129738A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171165A (ja) * 2009-01-22 2010-08-05 Sony Corp 有機半導体装置およびその製造方法
JP2010219447A (ja) * 2009-03-18 2010-09-30 Toppan Printing Co Ltd 有機トランジスタ用インク、有機トランジスタの電極及びその形成方法並びに有機トランジスタ

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101093075B1 (ko) * 2011-04-04 2011-12-13 한국기계연구원 패턴 인쇄 장치
CN102522361A (zh) * 2011-12-19 2012-06-27 清华大学 一种无机柔性电子器件系统集成方法
CA2868261C (en) * 2012-03-27 2020-07-14 The Regents Of The University Of California Continuous whole-chip 3-dimensional dep cell sorter and related fabrication method
CN106926559B (zh) * 2017-03-24 2020-05-26 京东方科技集团股份有限公司 转印基板及其制作方法、oled器件制作方法
KR20210013108A (ko) * 2018-05-23 2021-02-03 주식회사 다이셀 도전성 잉크

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003123536A (ja) * 2001-08-07 2003-04-25 Murata Mfg Co Ltd 感光性導電ペースト、それを用いた回路基板及びセラミック多層基板の製造方法
JP2004161960A (ja) * 2002-11-15 2004-06-10 Brother Ind Ltd 導電性インク
JP2004265826A (ja) * 2003-03-04 2004-09-24 Niigata Prefecture 金属ペースト
JP2004342650A (ja) * 2003-05-13 2004-12-02 Ricoh Co Ltd 配線形成方法及び配線形成装置
JP2006045294A (ja) * 2004-08-02 2006-02-16 Hitachi Chem Co Ltd 印刷インキ組成物、塗膜及びその形成方法、並びに、電子部品及びその製造方法
JP2006269476A (ja) * 2005-03-22 2006-10-05 Toppan Printing Co Ltd 薄膜トランジスタの製造方法
JP2006289983A (ja) * 2005-04-13 2006-10-26 Korea Mach Res Inst ロールツーロール輪転印刷法を用いた電子素子の製造方法及び製造装置
JP2007005445A (ja) * 2005-06-22 2007-01-11 Toppan Printing Co Ltd 半導体装置の電極回路の形成方法、および、それに用いる除去版

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3689536B2 (ja) 1997-08-12 2005-08-31 光村印刷株式会社 画像形成法
JP2001225593A (ja) * 2000-02-14 2001-08-21 Dainippon Printing Co Ltd 曲面印刷用転写フィルムおよびその製造方法
JP4549651B2 (ja) 2003-10-24 2010-09-22 光村印刷株式会社 カラーフィルター作製用インキ組成物
JP2005246790A (ja) * 2004-03-04 2005-09-15 Hitachi Chem Co Ltd レジストパターン形成法、電子部品の製造法、および電子部品
JP2006156426A (ja) * 2004-11-25 2006-06-15 Seiko Epson Corp 導電性パターンの形成方法
JP4506605B2 (ja) * 2005-07-28 2010-07-21 ソニー株式会社 半導体装置の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003123536A (ja) * 2001-08-07 2003-04-25 Murata Mfg Co Ltd 感光性導電ペースト、それを用いた回路基板及びセラミック多層基板の製造方法
JP2004161960A (ja) * 2002-11-15 2004-06-10 Brother Ind Ltd 導電性インク
JP2004265826A (ja) * 2003-03-04 2004-09-24 Niigata Prefecture 金属ペースト
JP2004342650A (ja) * 2003-05-13 2004-12-02 Ricoh Co Ltd 配線形成方法及び配線形成装置
JP2006045294A (ja) * 2004-08-02 2006-02-16 Hitachi Chem Co Ltd 印刷インキ組成物、塗膜及びその形成方法、並びに、電子部品及びその製造方法
JP2006269476A (ja) * 2005-03-22 2006-10-05 Toppan Printing Co Ltd 薄膜トランジスタの製造方法
JP2006289983A (ja) * 2005-04-13 2006-10-26 Korea Mach Res Inst ロールツーロール輪転印刷法を用いた電子素子の製造方法及び製造装置
JP2007005445A (ja) * 2005-06-22 2007-01-11 Toppan Printing Co Ltd 半導体装置の電極回路の形成方法、および、それに用いる除去版

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171165A (ja) * 2009-01-22 2010-08-05 Sony Corp 有機半導体装置およびその製造方法
JP2010219447A (ja) * 2009-03-18 2010-09-30 Toppan Printing Co Ltd 有機トランジスタ用インク、有機トランジスタの電極及びその形成方法並びに有機トランジスタ

Also Published As

Publication number Publication date
KR20090127147A (ko) 2009-12-09
CN101641769A (zh) 2010-02-03
WO2008129738A1 (ja) 2008-10-30
CN101641769B (zh) 2011-06-08
TW200845445A (en) 2008-11-16
TWI375341B (https=) 2012-10-21
US20100221413A1 (en) 2010-09-02
US8048725B2 (en) 2011-11-01

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