JP2008211090A5 - - Google Patents

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Publication number
JP2008211090A5
JP2008211090A5 JP2007048065A JP2007048065A JP2008211090A5 JP 2008211090 A5 JP2008211090 A5 JP 2008211090A5 JP 2007048065 A JP2007048065 A JP 2007048065A JP 2007048065 A JP2007048065 A JP 2007048065A JP 2008211090 A5 JP2008211090 A5 JP 2008211090A5
Authority
JP
Japan
Prior art keywords
manufacturing
semi
reliability
solve
above problems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007048065A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008211090A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007048065A priority Critical patent/JP2008211090A/ja
Priority claimed from JP2007048065A external-priority patent/JP2008211090A/ja
Priority to US12/528,811 priority patent/US8043963B2/en
Priority to CN2011102702679A priority patent/CN102290372A/zh
Priority to PCT/JP2008/053163 priority patent/WO2008105360A1/ja
Priority to KR1020097020079A priority patent/KR101181389B1/ko
Priority to CN2008800062867A priority patent/CN101627459B/zh
Priority to KR1020117019031A priority patent/KR20110099064A/ko
Priority to TW097106539A priority patent/TWI392025B/zh
Publication of JP2008211090A publication Critical patent/JP2008211090A/ja
Publication of JP2008211090A5 publication Critical patent/JP2008211090A5/ja
Priority to US13/273,612 priority patent/US8367542B2/en
Pending legal-status Critical Current

Links

JP2007048065A 2007-02-27 2007-02-27 半導体装置の製造方法及び半導体装置の製造装置 Pending JP2008211090A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2007048065A JP2008211090A (ja) 2007-02-27 2007-02-27 半導体装置の製造方法及び半導体装置の製造装置
KR1020117019031A KR20110099064A (ko) 2007-02-27 2008-02-25 반도체 소자의 제조 방법 및 반도체 소자의 제조 장치
KR1020097020079A KR101181389B1 (ko) 2007-02-27 2008-02-25 반도체 소자의 제조 방법 및 반도체 소자의 제조 장치
CN2011102702679A CN102290372A (zh) 2007-02-27 2008-02-25 半导体器件制造方法以及半导体器件制造设备
PCT/JP2008/053163 WO2008105360A1 (ja) 2007-02-27 2008-02-25 半導体装置の製造方法及び半導体装置の製造装置
US12/528,811 US8043963B2 (en) 2007-02-27 2008-02-25 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
CN2008800062867A CN101627459B (zh) 2007-02-27 2008-02-25 半导体器件制造方法以及半导体器件制造设备
TW097106539A TWI392025B (zh) 2007-02-27 2008-02-26 半導體裝置之製造方法及半導體裝置之製造裝置
US13/273,612 US8367542B2 (en) 2007-02-27 2011-10-14 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007048065A JP2008211090A (ja) 2007-02-27 2007-02-27 半導体装置の製造方法及び半導体装置の製造装置

Publications (2)

Publication Number Publication Date
JP2008211090A JP2008211090A (ja) 2008-09-11
JP2008211090A5 true JP2008211090A5 (enExample) 2010-04-02

Family

ID=39787121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007048065A Pending JP2008211090A (ja) 2007-02-27 2007-02-27 半導体装置の製造方法及び半導体装置の製造装置

Country Status (1)

Country Link
JP (1) JP2008211090A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5766098B2 (ja) * 2011-11-17 2015-08-19 株式会社アルバック 絶縁膜形成方法及び絶縁膜形成装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4239536A (en) * 1977-09-09 1980-12-16 Sumitomo Electric Industries, Ltd. Surface-coated sintered hard body
JP4350337B2 (ja) * 2001-04-27 2009-10-21 富士通マイクロエレクトロニクス株式会社 半導体装置
DE10258282A1 (de) * 2002-12-13 2004-07-08 Walter Ag CVD-Beschichtungsverfarhen für ZrBx CyNz-Schichten (x+y+z = 1) sowie beschichtetes Schneidwerkzeug
JP2004259753A (ja) * 2003-02-24 2004-09-16 Fujitsu Ltd 半導体装置およびその製造方法
JP4879509B2 (ja) * 2004-05-21 2012-02-22 株式会社アルバック 真空成膜装置
JP4480516B2 (ja) * 2004-08-23 2010-06-16 株式会社アルバック バリア膜の形成方法
JP5275038B2 (ja) * 2006-11-09 2013-08-28 株式会社アルバック バリア膜の形成方法

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