JP2008182163A - 配線基板及びその製造方法と半導体装置 - Google Patents

配線基板及びその製造方法と半導体装置 Download PDF

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Publication number
JP2008182163A
JP2008182163A JP2007016246A JP2007016246A JP2008182163A JP 2008182163 A JP2008182163 A JP 2008182163A JP 2007016246 A JP2007016246 A JP 2007016246A JP 2007016246 A JP2007016246 A JP 2007016246A JP 2008182163 A JP2008182163 A JP 2008182163A
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JP
Japan
Prior art keywords
wiring
wiring pattern
lead frames
interlayer connection
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007016246A
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English (en)
Japanese (ja)
Other versions
JP2008182163A5 (enExample
Inventor
Hiroshi Shimizu
浩 清水
Hiroyuki Kato
広幸 加藤
Takeshi Kobayashi
壮 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007016246A priority Critical patent/JP2008182163A/ja
Publication of JP2008182163A publication Critical patent/JP2008182163A/ja
Publication of JP2008182163A5 publication Critical patent/JP2008182163A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2007016246A 2007-01-26 2007-01-26 配線基板及びその製造方法と半導体装置 Pending JP2008182163A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007016246A JP2008182163A (ja) 2007-01-26 2007-01-26 配線基板及びその製造方法と半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007016246A JP2008182163A (ja) 2007-01-26 2007-01-26 配線基板及びその製造方法と半導体装置

Publications (2)

Publication Number Publication Date
JP2008182163A true JP2008182163A (ja) 2008-08-07
JP2008182163A5 JP2008182163A5 (enExample) 2010-02-12

Family

ID=39725810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007016246A Pending JP2008182163A (ja) 2007-01-26 2007-01-26 配線基板及びその製造方法と半導体装置

Country Status (1)

Country Link
JP (1) JP2008182163A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010129998A (ja) * 2008-11-28 2010-06-10 Samsung Electro-Mechanics Co Ltd 金属バンプを持つプリント基板及びその製造方法
JP2011091111A (ja) * 2009-10-20 2011-05-06 Freesia Makurosu Kk 電子部品搭載用基板の製造方法及び電子部品搭載用基板
JP2013157566A (ja) * 2012-01-31 2013-08-15 Sumitomo Electric Printed Circuit Inc プリント配線板及び該プリント配線板の製造方法
JP7483595B2 (ja) 2020-11-13 2024-05-15 新光電気工業株式会社 配線基板、電子装置及び配線基板の製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07170077A (ja) * 1993-12-16 1995-07-04 Hitachi Cable Ltd 射出成形回路部品の製造方法
JPH10322027A (ja) * 1997-02-03 1998-12-04 Ibiden Co Ltd プリント配線板及びその製造方法
JP2001076785A (ja) * 1999-09-08 2001-03-23 Sato Seiki:Kk 電気的接合構造体並びにその成形方法
JP2001077488A (ja) * 1999-06-28 2001-03-23 Matsushita Electric Ind Co Ltd 回路基板とその製造方法およびリードフレーム
JP2001223289A (ja) * 2000-02-08 2001-08-17 Sony Corp リードフレームと、その製造方法と、半導体集積回路装置と、その製造方法
JP2005051155A (ja) * 2003-07-31 2005-02-24 Sony Corp 半導体集積回路装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07170077A (ja) * 1993-12-16 1995-07-04 Hitachi Cable Ltd 射出成形回路部品の製造方法
JPH10322027A (ja) * 1997-02-03 1998-12-04 Ibiden Co Ltd プリント配線板及びその製造方法
JP2001077488A (ja) * 1999-06-28 2001-03-23 Matsushita Electric Ind Co Ltd 回路基板とその製造方法およびリードフレーム
JP2001076785A (ja) * 1999-09-08 2001-03-23 Sato Seiki:Kk 電気的接合構造体並びにその成形方法
JP2001223289A (ja) * 2000-02-08 2001-08-17 Sony Corp リードフレームと、その製造方法と、半導体集積回路装置と、その製造方法
JP2005051155A (ja) * 2003-07-31 2005-02-24 Sony Corp 半導体集積回路装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010129998A (ja) * 2008-11-28 2010-06-10 Samsung Electro-Mechanics Co Ltd 金属バンプを持つプリント基板及びその製造方法
US8141241B2 (en) 2008-11-28 2012-03-27 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing a printed circuit board having metal bumps
US8464423B2 (en) 2008-11-28 2013-06-18 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing a printed circuit board having metal bumps
JP2011091111A (ja) * 2009-10-20 2011-05-06 Freesia Makurosu Kk 電子部品搭載用基板の製造方法及び電子部品搭載用基板
JP2013157566A (ja) * 2012-01-31 2013-08-15 Sumitomo Electric Printed Circuit Inc プリント配線板及び該プリント配線板の製造方法
JP7483595B2 (ja) 2020-11-13 2024-05-15 新光電気工業株式会社 配線基板、電子装置及び配線基板の製造方法

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