JP2008182163A5 - - Google Patents

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Publication number
JP2008182163A5
JP2008182163A5 JP2007016246A JP2007016246A JP2008182163A5 JP 2008182163 A5 JP2008182163 A5 JP 2008182163A5 JP 2007016246 A JP2007016246 A JP 2007016246A JP 2007016246 A JP2007016246 A JP 2007016246A JP 2008182163 A5 JP2008182163 A5 JP 2008182163A5
Authority
JP
Japan
Prior art keywords
wiring pattern
wiring
lead frames
interlayer connection
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007016246A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008182163A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007016246A priority Critical patent/JP2008182163A/ja
Priority claimed from JP2007016246A external-priority patent/JP2008182163A/ja
Publication of JP2008182163A publication Critical patent/JP2008182163A/ja
Publication of JP2008182163A5 publication Critical patent/JP2008182163A5/ja
Pending legal-status Critical Current

Links

JP2007016246A 2007-01-26 2007-01-26 配線基板及びその製造方法と半導体装置 Pending JP2008182163A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007016246A JP2008182163A (ja) 2007-01-26 2007-01-26 配線基板及びその製造方法と半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007016246A JP2008182163A (ja) 2007-01-26 2007-01-26 配線基板及びその製造方法と半導体装置

Publications (2)

Publication Number Publication Date
JP2008182163A JP2008182163A (ja) 2008-08-07
JP2008182163A5 true JP2008182163A5 (enExample) 2010-02-12

Family

ID=39725810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007016246A Pending JP2008182163A (ja) 2007-01-26 2007-01-26 配線基板及びその製造方法と半導体装置

Country Status (1)

Country Link
JP (1) JP2008182163A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101022912B1 (ko) * 2008-11-28 2011-03-17 삼성전기주식회사 금속범프를 갖는 인쇄회로기판 및 그 제조방법
JP5380242B2 (ja) * 2009-10-20 2014-01-08 フリージア・マクロス株式会社 電子部品搭載用基板の製造方法及び電子部品搭載用基板
JP6048719B2 (ja) * 2012-01-31 2016-12-21 住友電工プリントサーキット株式会社 プリント配線板及び該プリント配線板の製造方法
JP7483595B2 (ja) 2020-11-13 2024-05-15 新光電気工業株式会社 配線基板、電子装置及び配線基板の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07170077A (ja) * 1993-12-16 1995-07-04 Hitachi Cable Ltd 射出成形回路部品の製造方法
JP3395621B2 (ja) * 1997-02-03 2003-04-14 イビデン株式会社 プリント配線板及びその製造方法
JP2001077488A (ja) * 1999-06-28 2001-03-23 Matsushita Electric Ind Co Ltd 回路基板とその製造方法およびリードフレーム
JP4070913B2 (ja) * 1999-09-08 2008-04-02 株式会社佐藤精機 電気的接合構造体並びにその成形方法
JP4794714B2 (ja) * 2000-02-08 2011-10-19 ソニー株式会社 半導体集積回路装置とその製造方法
JP2005051155A (ja) * 2003-07-31 2005-02-24 Sony Corp 半導体集積回路装置

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