JP2008160874A - 無線icデバイス - Google Patents
無線icデバイス Download PDFInfo
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- JP2008160874A JP2008160874A JP2008017051A JP2008017051A JP2008160874A JP 2008160874 A JP2008160874 A JP 2008160874A JP 2008017051 A JP2008017051 A JP 2008017051A JP 2008017051 A JP2008017051 A JP 2008017051A JP 2008160874 A JP2008160874 A JP 2008160874A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
- H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
- H01Q9/285—Planar dipole
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Details Of Aerials (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
【解決手段】フレキシブルなシート10に、無線ICチップ5及び放射板11,11を配してなる無線ICデバイス。無線ICチップ5はシート10上に形成された所定の共振周波数及び所定のインピーダンスを有する給電回路15にAuバンプ6を介して接続されている。給電回路15は電極パターン15a,15bからなり、この給電回路15と放射板11,11とがシート10を介して容量結合されている。そして、放射板11,11から放射する送信信号の周波数及び無線ICチップ5に供給する受信信号の周波数は、給電回路15の共振周波数にて実質的に決められている。
【選択図】図2
Description
無線ICタグ活用のすべて 日経BPムック社 p112−p126
第1実施例である無線ICデバイス1aは、図1(A)に示すように、1枚のフレキシブルな誘電体シート10(例えば、PETなどの樹脂フィルム、紙)の第2主面(裏面)10bにフレキシブルなアルミ箔や金属蒸着膜などの金属薄膜にて放射板11,11を形成するとともに、図1(B)に示すように、第1主面(表面)10aに給電回路15を形成し、無線ICチップ5を給電回路15上に搭載したものである。なお、図1(B)では、無線ICチップ5を搭載した給電回路15を拡大して示している。
以下に説明する第2、第3及び第4実施例は、それぞれ、図3に示すように、フレキシブルな誘電体又は絶縁体からなる2枚のシート21,22を貼り合わせたものである。第1シート21にはその第1主面21aにフレキシブルなアルミ箔や金属蒸着膜などの金属薄膜にて給電回路15が形成され、この給電回路15上に無線ICチップ5が搭載されている。第2シート22にはその第1主面22aにフレキシブルなアルミ箔や金属蒸着膜などの金属薄膜にて広い面積の放射板25,25が形成されている。
第2実施例である無線ICデバイス1bは、図4に示すように、前記第1シート21の第1主面21aと前記第2シート22の第1主面22aとが互いに向かい合うように熱圧着にて貼り合わされており、給電回路15の一端部16と放射板25の一端部26とが直接電気的に結合されている。
第3実施例である無線ICデバイス1cは、図5に示すように、前記第1シート21の第1主面21aと前記第2シート22の第1主面22aとが互いに向かい合うように接着剤層29を介して貼り合わされており、給電回路15の一端部16と放射板25の一端部26とが接着剤層29を介して対向して容量結合している。
第4実施例である無線ICデバイス1dは、図6に示すように、前記第1シート21の第1主面21aと前記第2シート22の第2主面22bとが互いに向かい合うように熱圧着にて貼り合わされており、給電回路15の一端部16と放射板25の一端部26とが第2シート22を介して対向して容量結合している。
なお、本発明に係る無線ICデバイスは前記実施例に限定するものではなく、その要旨の範囲内で種々に変更することができる。
5…無線ICチップ
10,21,22…シート
11,25…放射板
15…給電回路
15a,15b…電極パターン
17…切欠き部
29…接着剤層
Claims (8)
- フレキシブルなシートに無線ICチップ及び放射板を配してなる無線ICデバイスにおいて、
前記無線ICチップは前記シート上に形成された所定の共振周波数を有する給電回路に接続されており、
前記給電回路と前記放射板とが結合されており、
前記放射板から放射する送信信号の周波数及び前記無線ICチップに供給する受信信号の周波数は、前記給電回路の前記共振周波数にて実質的に決められていること、
を特徴とする無線ICデバイス。 - 前記給電回路の電極パターンには、共振周波数及びインピーダンスを調整するための切欠き部が形成されていることを特徴とする請求項1に記載の無線ICデバイス。
- 前記放射板が前記シート上にフレキシブルな金属膜によって形成されていることを特徴とする請求項1又は請求項2に記載の無線ICデバイス。
- 前記シートの第1主面に前記無線ICチップ及び前記給電回路が配置され、前記第1主面とは反対側の第2主面に前記放射板が配置されており、
前記給電回路と前記放射板とが前記シートを介して容量結合されていること、
を特徴とする請求項1、請求項2又は請求項3に記載の無線ICデバイス。 - フレキシブルな第1シートの第1主面に前記無線ICチップ及び前記給電回路が配置され、フレキシブルな第2シートの第1主面に前記放射板が配置されており、
前記第1シートの第1主面と前記第2シートの第1主面とが互いに向かい合うように貼り合わされており、前記給電回路と前記放射板とが結合されていること、
を特徴とする請求項1、請求項2又は請求項3に記載の無線ICデバイス。 - 前記給電回路と前記放射板とが直接電気的に結合されていることを特徴とする請求項5に記載の無線ICデバイス。
- 前記給電回路と前記放射板とが接着剤層を介して容量結合されていることを特徴とする請求項5に記載の無線ICデバイス。
- フレキシブルな第1シートの第1主面に前記無線ICチップ及び前記給電回路が配置され、フレキシブルな第2シートの第1主面に前記放射板が配置されており、
前記第1シートの第1主面と前記第2シートの第1主面とは反対側の第2主面とが互いに向かい合うように貼り合わされており、前記給電回路と前記放射板とが前記第2シートを介して容量結合されていること、
を特徴とする請求項1、請求項2又は請求項3に記載の無線ICデバイス。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008017051A JP4321657B2 (ja) | 2006-04-14 | 2008-01-29 | 無線icデバイス |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006112351 | 2006-04-14 | ||
JP2008017051A JP4321657B2 (ja) | 2006-04-14 | 2008-01-29 | 無線icデバイス |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008510752A Division JP4572983B2 (ja) | 2006-04-14 | 2007-03-02 | 無線icデバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008160874A true JP2008160874A (ja) | 2008-07-10 |
JP4321657B2 JP4321657B2 (ja) | 2009-08-26 |
Family
ID=38609118
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008510752A Active JP4572983B2 (ja) | 2006-04-14 | 2007-03-02 | 無線icデバイス |
JP2008017051A Active JP4321657B2 (ja) | 2006-04-14 | 2008-01-29 | 無線icデバイス |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008510752A Active JP4572983B2 (ja) | 2006-04-14 | 2007-03-02 | 無線icデバイス |
Country Status (5)
Country | Link |
---|---|
US (1) | US7518558B2 (ja) |
EP (1) | EP2009736B1 (ja) |
JP (2) | JP4572983B2 (ja) |
CN (1) | CN101346852B (ja) |
WO (1) | WO2007119304A1 (ja) |
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JP2010279039A (ja) * | 2009-05-29 | 2010-12-09 | Fraunhofer Ges | Rfidトランスポンダ、rfidトランスポンダを含むrfid通信システム、rfidトランスポンダの製造方法、ならびにそれらの使用 |
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JP4321657B2 (ja) | 2009-08-26 |
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US20080143630A1 (en) | 2008-06-19 |
CN101346852B (zh) | 2012-12-26 |
WO2007119304A1 (ja) | 2007-10-25 |
JP4572983B2 (ja) | 2010-11-04 |
US7518558B2 (en) | 2009-04-14 |
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