JP2008147317A5 - - Google Patents

Download PDF

Info

Publication number
JP2008147317A5
JP2008147317A5 JP2006331245A JP2006331245A JP2008147317A5 JP 2008147317 A5 JP2008147317 A5 JP 2008147317A5 JP 2006331245 A JP2006331245 A JP 2006331245A JP 2006331245 A JP2006331245 A JP 2006331245A JP 2008147317 A5 JP2008147317 A5 JP 2008147317A5
Authority
JP
Japan
Prior art keywords
electronic component
electrode
substrate
protruding electrode
alignment protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006331245A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008147317A (ja
JP4889464B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006331245A priority Critical patent/JP4889464B2/ja
Priority claimed from JP2006331245A external-priority patent/JP4889464B2/ja
Publication of JP2008147317A publication Critical patent/JP2008147317A/ja
Publication of JP2008147317A5 publication Critical patent/JP2008147317A5/ja
Application granted granted Critical
Publication of JP4889464B2 publication Critical patent/JP4889464B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006331245A 2006-12-08 2006-12-08 電子部品の実装方法 Expired - Fee Related JP4889464B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006331245A JP4889464B2 (ja) 2006-12-08 2006-12-08 電子部品の実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006331245A JP4889464B2 (ja) 2006-12-08 2006-12-08 電子部品の実装方法

Publications (3)

Publication Number Publication Date
JP2008147317A JP2008147317A (ja) 2008-06-26
JP2008147317A5 true JP2008147317A5 (https=) 2009-11-05
JP4889464B2 JP4889464B2 (ja) 2012-03-07

Family

ID=39607181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006331245A Expired - Fee Related JP4889464B2 (ja) 2006-12-08 2006-12-08 電子部品の実装方法

Country Status (1)

Country Link
JP (1) JP4889464B2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011165872A (ja) * 2010-02-09 2011-08-25 Renesas Electronics Corp Ｂｇａタイプ半導体装置の接続構造
JP5481249B2 (ja) 2010-03-26 2014-04-23 富士通株式会社 半導体装置及びその製造方法
JP5927756B2 (ja) * 2010-12-17 2016-06-01 ソニー株式会社 半導体装置及び半導体装置の製造方法
WO2014182239A1 (en) * 2013-05-07 2014-11-13 Smartflex Technology Pte Ltd Ultra-thin smart card modules with chip bumps disposed in susbtrate via holes and methods of fabricating the same
EP2819162B1 (en) 2013-06-24 2020-06-17 IMEC vzw Method for producing contact areas on a semiconductor substrate
JP2015149314A (ja) * 2014-02-04 2015-08-20 富士通株式会社 半導体装置及びその製造方法
CN109309069A (zh) * 2018-09-19 2019-02-05 深圳市心版图科技有限公司 焊球阵列封装芯片及其焊接方法
JP2021170582A (ja) 2020-04-15 2021-10-28 株式会社村田製作所 増幅モジュール

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02170444A (ja) * 1988-12-22 1990-07-02 Matsushita Electric Works Ltd 半導体素子の実装方法
JPH03218039A (ja) * 1990-01-23 1991-09-25 Sumitomo Electric Ind Ltd 半導体素子の実装方法
JPH04199524A (ja) * 1990-11-28 1992-07-20 Mitsubishi Electric Corp 半導体装置
JP2715793B2 (ja) * 1992-03-19 1998-02-18 日本電気株式会社 半導体装置及びその製造方法
JPH10256308A (ja) * 1997-03-06 1998-09-25 Oki Electric Ind Co Ltd 半導体チップ実装構造及びその実装方法
JPH11111772A (ja) * 1997-10-07 1999-04-23 Matsushita Electric Ind Co Ltd キャリア基板の実装位置決め方法、キャリア基板および配線基板
JPH11163194A (ja) * 1997-11-26 1999-06-18 Oki Electric Ind Co Ltd Ｖｌｓｉパッケージ
JP2002246512A (ja) * 2001-02-16 2002-08-30 Nec Corp Ｂｇａパッケージの構造及び実装基板の構造
JP2002373914A (ja) * 2001-06-15 2002-12-26 Ricoh Co Ltd 電子部品接続構造体
JP2006324577A (ja) * 2005-05-20 2006-11-30 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法

Similar Documents

Publication Publication Date Title
JP2007267113A5 (https=)
WO2009037964A1 (ja) 異方性導電膜及びその製造方法、並びに、該異方性導電膜を用いた接合体
WO2009044863A1 (ja) モジュール、配線板、及びモジュールの製造方法
TWI646879B (zh) 柔性電路板、電路板元件及柔性電路板的製作方法
JP2009141169A5 (https=)
JP2006303360A5 (https=)
WO2009057332A1 (ja) 回路接続方法
US8130508B2 (en) Electronic component embedded printed circuit board and manufacturing method thereof
JP2008147317A5 (https=)
JP2009200313A5 (https=)
JP2006339559A5 (https=)
JP2008311520A5 (https=)
JP2009289914A5 (https=)
JP5091200B2 (ja) ストレスセンサー及びストレスセンサーの組立方法
JP4807303B2 (ja) 電子部品ユニット
JP2010081308A5 (https=)
JP2009182274A5 (https=)
WO2009057614A1 (ja) 電子装置及びその製造方法、並びに実装基板
JP2013162295A5 (https=)
JP2011009488A5 (https=)
JP2007019267A5 (https=)
US9742091B2 (en) Method and structure for conductive elastomeric pin arrays using solder interconnects and a non-conductive medium
JP2009117496A5 (https=)
JP2007134402A5 (https=)
JP2006332246A5 (https=)