JP2007134402A5 - - Google Patents

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Publication number
JP2007134402A5
JP2007134402A5 JP2005323672A JP2005323672A JP2007134402A5 JP 2007134402 A5 JP2007134402 A5 JP 2007134402A5 JP 2005323672 A JP2005323672 A JP 2005323672A JP 2005323672 A JP2005323672 A JP 2005323672A JP 2007134402 A5 JP2007134402 A5 JP 2007134402A5
Authority
JP
Japan
Prior art keywords
electronic component
adhesive layer
mounting structure
solder
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005323672A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007134402A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005323672A priority Critical patent/JP2007134402A/ja
Priority claimed from JP2005323672A external-priority patent/JP2007134402A/ja
Publication of JP2007134402A publication Critical patent/JP2007134402A/ja
Publication of JP2007134402A5 publication Critical patent/JP2007134402A5/ja
Withdrawn legal-status Critical Current

Links

JP2005323672A 2005-11-08 2005-11-08 電子部品実装構造 Withdrawn JP2007134402A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005323672A JP2007134402A (ja) 2005-11-08 2005-11-08 電子部品実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005323672A JP2007134402A (ja) 2005-11-08 2005-11-08 電子部品実装構造

Publications (2)

Publication Number Publication Date
JP2007134402A JP2007134402A (ja) 2007-05-31
JP2007134402A5 true JP2007134402A5 (https=) 2007-11-22

Family

ID=38155838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005323672A Withdrawn JP2007134402A (ja) 2005-11-08 2005-11-08 電子部品実装構造

Country Status (1)

Country Link
JP (1) JP2007134402A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102108198B1 (ko) * 2014-04-11 2020-05-08 삼성전기주식회사 적층 세라믹 커패시터 및 적층 세라믹 커패시터의 실장 기판
KR102306713B1 (ko) * 2014-04-11 2021-09-29 삼성전기주식회사 적층 세라믹 커패시터 및 적층 세라믹 커패시터의 실장 기판
JP7511180B2 (ja) * 2020-07-27 2024-07-05 パナソニックＩｐマネジメント株式会社 実装方法およびそれにより形成される実装構造体

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