JP2007134402A5 - - Google Patents
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- Publication number
- JP2007134402A5 JP2007134402A5 JP2005323672A JP2005323672A JP2007134402A5 JP 2007134402 A5 JP2007134402 A5 JP 2007134402A5 JP 2005323672 A JP2005323672 A JP 2005323672A JP 2005323672 A JP2005323672 A JP 2005323672A JP 2007134402 A5 JP2007134402 A5 JP 2007134402A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- adhesive layer
- mounting structure
- solder
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000012790 adhesive layer Substances 0.000 claims 11
- 229910000679 solder Inorganic materials 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 5
- 239000010410 layer Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005323672A JP2007134402A (ja) | 2005-11-08 | 2005-11-08 | 電子部品実装構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005323672A JP2007134402A (ja) | 2005-11-08 | 2005-11-08 | 電子部品実装構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007134402A JP2007134402A (ja) | 2007-05-31 |
| JP2007134402A5 true JP2007134402A5 (https=) | 2007-11-22 |
Family
ID=38155838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005323672A Withdrawn JP2007134402A (ja) | 2005-11-08 | 2005-11-08 | 電子部品実装構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007134402A (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102108198B1 (ko) * | 2014-04-11 | 2020-05-08 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 적층 세라믹 커패시터의 실장 기판 |
| KR102306713B1 (ko) * | 2014-04-11 | 2021-09-29 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 적층 세라믹 커패시터의 실장 기판 |
| JP7511180B2 (ja) * | 2020-07-27 | 2024-07-05 | パナソニックＩｐマネジメント株式会社 | 実装方法およびそれにより形成される実装構造体 |
-
2005
- 2005-11-08 JP JP2005323672A patent/JP2007134402A/ja not_active Withdrawn
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