JP2007134404A5 - - Google Patents

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Publication number
JP2007134404A5
JP2007134404A5 JP2005323684A JP2005323684A JP2007134404A5 JP 2007134404 A5 JP2007134404 A5 JP 2007134404A5 JP 2005323684 A JP2005323684 A JP 2005323684A JP 2005323684 A JP2005323684 A JP 2005323684A JP 2007134404 A5 JP2007134404 A5 JP 2007134404A5
Authority
JP
Japan
Prior art keywords
electronic component
adhesive layer
mounting structure
component mounting
resist layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005323684A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007134404A (ja
JP4555211B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005323684A priority Critical patent/JP4555211B2/ja
Priority claimed from JP2005323684A external-priority patent/JP4555211B2/ja
Priority to CNB2006101445262A priority patent/CN100553403C/zh
Publication of JP2007134404A publication Critical patent/JP2007134404A/ja
Publication of JP2007134404A5 publication Critical patent/JP2007134404A5/ja
Application granted granted Critical
Publication of JP4555211B2 publication Critical patent/JP4555211B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005323684A 2005-11-08 2005-11-08 電子部品実装構造及びその製造方法 Expired - Fee Related JP4555211B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005323684A JP4555211B2 (ja) 2005-11-08 2005-11-08 電子部品実装構造及びその製造方法
CNB2006101445262A CN100553403C (zh) 2005-11-08 2006-11-08 电子部件安装组件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005323684A JP4555211B2 (ja) 2005-11-08 2005-11-08 電子部品実装構造及びその製造方法

Publications (3)

Publication Number Publication Date
JP2007134404A JP2007134404A (ja) 2007-05-31
JP2007134404A5 true JP2007134404A5 (https=) 2007-11-22
JP4555211B2 JP4555211B2 (ja) 2010-09-29

Family

ID=38083414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005323684A Expired - Fee Related JP4555211B2 (ja) 2005-11-08 2005-11-08 電子部品実装構造及びその製造方法

Country Status (2)

Country Link
JP (1) JP4555211B2 (https=)
CN (1) CN100553403C (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012104557A (ja) * 2010-11-08 2012-05-31 Ngk Spark Plug Co Ltd 電子部品付き配線基板及びその製造方法
JP5899517B2 (ja) * 2012-08-10 2016-04-06 パナソニックＩｐマネジメント株式会社 部品実装基板の製造方法及び製造システム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11111894A (ja) * 1997-10-02 1999-04-23 Fujitsu Ltd フリップチップ実装用基板
JPH11186334A (ja) * 1997-12-25 1999-07-09 Toshiba Corp 半導体実装装置及びその製造方法及び異方性導電材料

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