CN100553403C - 电子部件安装组件 - Google Patents
电子部件安装组件 Download PDFInfo
- Publication number
- CN100553403C CN100553403C CNB2006101445262A CN200610144526A CN100553403C CN 100553403 C CN100553403 C CN 100553403C CN B2006101445262 A CNB2006101445262 A CN B2006101445262A CN 200610144526 A CN200610144526 A CN 200610144526A CN 100553403 C CN100553403 C CN 100553403C
- Authority
- CN
- China
- Prior art keywords
- mentioned
- barrier layer
- electronic component
- substrate
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000000712 assembly Effects 0.000 title 1
- 238000000429 assembly Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 121
- 230000004888 barrier function Effects 0.000 claims abstract description 111
- 239000000463 material Substances 0.000 claims abstract description 40
- 239000000853 adhesive Substances 0.000 claims abstract description 24
- 230000001070 adhesive effect Effects 0.000 claims abstract description 23
- 238000005476 soldering Methods 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims description 56
- 239000011347 resin Substances 0.000 claims description 56
- 238000009434 installation Methods 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000013007 heat curing Methods 0.000 claims 1
- 238000005728 strengthening Methods 0.000 abstract 1
- 239000012790 adhesive layer Substances 0.000 description 111
- 239000010410 layer Substances 0.000 description 108
- 229910000679 solder Inorganic materials 0.000 description 67
- 229920001187 thermosetting polymer Polymers 0.000 description 42
- 238000010438 heat treatment Methods 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 15
- 238000002844 melting Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 12
- 230000008018 melting Effects 0.000 description 11
- 239000000178 monomer Substances 0.000 description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 229920002635 polyurethane Polymers 0.000 description 8
- 239000004814 polyurethane Substances 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 5
- 229910020830 Sn-Bi Inorganic materials 0.000 description 4
- 229910018728 Sn—Bi Inorganic materials 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000000411 inducer Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000000045 pyrolysis gas chromatography Methods 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005323684A JP4555211B2 (ja) | 2005-11-08 | 2005-11-08 | 電子部品実装構造及びその製造方法 |
| JP323684/2005 | 2005-11-08 | ||
| JP323672/2005 | 2005-11-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1964598A CN1964598A (zh) | 2007-05-16 |
| CN100553403C true CN100553403C (zh) | 2009-10-21 |
Family
ID=38083414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101445262A Expired - Fee Related CN100553403C (zh) | 2005-11-08 | 2006-11-08 | 电子部件安装组件 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4555211B2 (https=) |
| CN (1) | CN100553403C (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012104557A (ja) * | 2010-11-08 | 2012-05-31 | Ngk Spark Plug Co Ltd | 電子部品付き配線基板及びその製造方法 |
| JP5899517B2 (ja) * | 2012-08-10 | 2016-04-06 | パナソニックＩｐマネジメント株式会社 | 部品実装基板の製造方法及び製造システム |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11111894A (ja) * | 1997-10-02 | 1999-04-23 | Fujitsu Ltd | フリップチップ実装用基板 |
| JPH11186334A (ja) * | 1997-12-25 | 1999-07-09 | Toshiba Corp | 半導体実装装置及びその製造方法及び異方性導電材料 |
-
2005
- 2005-11-08 JP JP2005323684A patent/JP4555211B2/ja not_active Expired - Fee Related
-
2006
- 2006-11-08 CN CNB2006101445262A patent/CN100553403C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007134404A (ja) | 2007-05-31 |
| JP4555211B2 (ja) | 2010-09-29 |
| CN1964598A (zh) | 2007-05-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091021 Termination date: 20171108 |