JP4555211B2 - 電子部品実装構造及びその製造方法 - Google Patents

電子部品実装構造及びその製造方法 Download PDF

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Publication number
JP4555211B2
JP4555211B2 JP2005323684A JP2005323684A JP4555211B2 JP 4555211 B2 JP4555211 B2 JP 4555211B2 JP 2005323684 A JP2005323684 A JP 2005323684A JP 2005323684 A JP2005323684 A JP 2005323684A JP 4555211 B2 JP4555211 B2 JP 4555211B2
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JP
Japan
Prior art keywords
electronic component
adhesive layer
solder
resist layer
mounting structure
Prior art date
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Expired - Fee Related
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JP2005323684A
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English (en)
Japanese (ja)
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JP2007134404A (ja
JP2007134404A5 (https=
Inventor
宏記 鈴木
正人 上原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
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Alps Electric Co Ltd
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Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP2005323684A priority Critical patent/JP4555211B2/ja
Priority to CNB2006101445262A priority patent/CN100553403C/zh
Publication of JP2007134404A publication Critical patent/JP2007134404A/ja
Publication of JP2007134404A5 publication Critical patent/JP2007134404A5/ja
Application granted granted Critical
Publication of JP4555211B2 publication Critical patent/JP4555211B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2005323684A 2005-11-08 2005-11-08 電子部品実装構造及びその製造方法 Expired - Fee Related JP4555211B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005323684A JP4555211B2 (ja) 2005-11-08 2005-11-08 電子部品実装構造及びその製造方法
CNB2006101445262A CN100553403C (zh) 2005-11-08 2006-11-08 电子部件安装组件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005323684A JP4555211B2 (ja) 2005-11-08 2005-11-08 電子部品実装構造及びその製造方法

Publications (3)

Publication Number Publication Date
JP2007134404A JP2007134404A (ja) 2007-05-31
JP2007134404A5 JP2007134404A5 (https=) 2007-11-22
JP4555211B2 true JP4555211B2 (ja) 2010-09-29

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ID=38083414

Family Applications (1)

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JP2005323684A Expired - Fee Related JP4555211B2 (ja) 2005-11-08 2005-11-08 電子部品実装構造及びその製造方法

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JP (1) JP4555211B2 (https=)
CN (1) CN100553403C (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012104557A (ja) * 2010-11-08 2012-05-31 Ngk Spark Plug Co Ltd 電子部品付き配線基板及びその製造方法
JP5899517B2 (ja) * 2012-08-10 2016-04-06 パナソニックＩｐマネジメント株式会社 部品実装基板の製造方法及び製造システム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11111894A (ja) * 1997-10-02 1999-04-23 Fujitsu Ltd フリップチップ実装用基板
JPH11186334A (ja) * 1997-12-25 1999-07-09 Toshiba Corp 半導体実装装置及びその製造方法及び異方性導電材料

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Publication number Publication date
JP2007134404A (ja) 2007-05-31
CN100553403C (zh) 2009-10-21
CN1964598A (zh) 2007-05-16

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