JP2007123664A - 基板と部品間の接合構造びその製造方法 - Google Patents
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- Y10T428/12049—Nonmetal component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
【解決手段】 基板1上には、球状金属粉10とフレーク状金属粉11と熱可塑性樹脂12とを有して成る電極部3が形成され、前記電極部3と電子部品間は、低融点半田5により接合され、前記低融点半田5の一部5aは、前記電極部3の表面3aから前記電極部3の内部に侵入している。これにより、前記電極部3と低融点半田5間の電気的接続性を良好に保つことが可能である。
【選択図】 図3
Description
前記基板上には、金属粉と樹脂成分とを有して成る電極部が形成され、前記金属粉には、少なくとも球状金属粉とフレーク状金属粉とが含まれ、
前記電極部と前記部品間は、低融点半田により接合され、前記低融点半田は、前記電極部の表面から前記電極部の内部に侵入していることを特徴とするものである。
前記基板上に、球状金属粉とフレーク状金属粉と樹脂成分とを有して成る電極部を形成する工程、
低融点半田および熱硬化性樹脂を含む半田接着剤を、少なくとも前記電極部と前記部品間に塗布する工程、
低温加熱し、前記低融点半田を前記電極部上に凝集させるとともに前記電極部の表面から前記電極部の内部に侵入させて、前記電極部と部品間を前記低融点半田にて接合するとともに、前記熱硬化性樹脂を前記電極部上を除く前記基板上の少なくとも一部に流れ出させて前記基板と部品間を前記熱硬化性樹脂にて接着する工程、
とを有することを特徴とするものである。
また本実施形態では金属粉として銀粉を用いたが銀粉に限定されるものでない。例えば金属メッキ銅粉、銀コート銅粉、銀/銅合金粉、金属メッキニッケル粉、銀コートニッケル粉、銀/ニッケル合金粉等を提示できる。
2 導電パターン
3 電極部
5 低融点半田
6 電子部品
7 接続部
8 熱硬化性樹脂
10 球状金属粉
11 フレーク状金属粉
12 熱可塑性樹脂
Claims (12)
- 基板と部品間の接合構造において、
前記基板上には、金属粉と樹脂成分とを有して成る電極部が形成され、前記金属粉には、少なくとも球状金属粉とフレーク状金属粉とが含まれ、
前記電極部と前記部品間は、低融点半田により接合され、前記低融点半田は、前記電極部の表面から前記電極部の内部に侵入していることを特徴とする基板と部品間の接合構造。 - 前記電極部を除く前記基板と部品間の少なくとも一部は、樹脂により接着されている請求項1記載の基板と部品間の接合構造。
- 前記樹脂が熱硬化性樹脂であることを特徴とする請求項2記載の基板と部品間の接合構造。
- 前記低融点半田と熱硬化性樹脂とは、加熱前、混合された半田接着剤として少なくとも前記電極部上に塗布され、前記加熱により、前記低融点半田は前記電極部上に凝集したものであり、前記熱硬化性樹脂は前記電極部上を除く前記基板上の少なくとも一部に流れ出したものである請求項3記載の接合構造。
- 前記金属粉中に占める前記フレーク状金属粉の含有量は、5〜99.5質量%である請求項1ないし4のいずれかに記載の接合構造。
- 前記電極部中に占める前記金属粉の含有量は、90質量%〜97.5質量%である請求項1ないし5のいずれかに記載の接合構造。
- 前記球状金属粉の平均粒径は3μm以下である請求項1ないし6のいずれかに記載の接合構造。
- 前記樹脂成分は、熱可塑性樹脂である請求項1ないし7のいずれかに記載の接合構造。
- 前記電極部中に、硬化剤が含まれる請求項1ないし8のいずれかに記載の接合構造。
- 前記硬化剤は、イソシアネート化合物であり、イソシアネート当量は、前記熱可塑性樹脂の水酸基当量を1当量としたとき、2.5当量以下含まれる請求項9記載の接合構造。
- 基板と部品間の接合構造の製造方法において、
前記基板上に、球状金属粉とフレーク状金属粉と樹脂成分とを有して成る電極部を形成する工程、
低融点半田および熱硬化性樹脂を含む半田接着剤を、少なくとも前記電極部と前記部品間に塗布する工程、
低温加熱し、前記低融点半田を前記電極部上に凝集させるとともに前記電極部の表面から前記電極部の内部に侵入させて、前記電極部と部品間を前記低融点半田にて接合するとともに、前記熱硬化性樹脂を前記電極部上を除く前記基板上の少なくとも一部に流れ出させて前記基板と部品間を前記熱硬化性樹脂にて接着する工程、
とを有することを特徴とする基板と部品間の接合構造の製造方法。 - 加熱温度を前記低融点半田の融点と前記熱硬化性樹脂の硬化温度よりも高い温度に調整する請求項11記載の接合構造の製造方法。
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JP2005315931A JP4522939B2 (ja) | 2005-10-31 | 2005-10-31 | 基板と部品間の接合構造及びその製造方法 |
US11/553,387 US7935430B2 (en) | 2005-10-31 | 2006-10-26 | Bonding structure of substrate and component and method of manufacturing the same |
CNA2006101432120A CN1960598A (zh) | 2005-10-31 | 2006-10-31 | 基板和元件之间的接合结构及其制造方法 |
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JP2005315931A JP4522939B2 (ja) | 2005-10-31 | 2005-10-31 | 基板と部品間の接合構造及びその製造方法 |
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JP2007123664A true JP2007123664A (ja) | 2007-05-17 |
JP4522939B2 JP4522939B2 (ja) | 2010-08-11 |
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JP (1) | JP4522939B2 (ja) |
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JP2011054892A (ja) * | 2009-09-04 | 2011-03-17 | Nihon Superior Co Ltd | 導電性ペーストを用いたはんだ接合 |
JP2018007303A (ja) * | 2016-06-27 | 2018-01-11 | 株式会社デンソー | 回転電機 |
JP2018082003A (ja) * | 2016-11-15 | 2018-05-24 | 凸版印刷株式会社 | 非接触通信媒体 |
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TWI405710B (zh) * | 2009-10-29 | 2013-08-21 | Univ Chung Hua | 應用無線射頻識別標籤技術之熱氣泡式角加速儀 |
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Cited By (3)
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JP2011054892A (ja) * | 2009-09-04 | 2011-03-17 | Nihon Superior Co Ltd | 導電性ペーストを用いたはんだ接合 |
JP2018007303A (ja) * | 2016-06-27 | 2018-01-11 | 株式会社デンソー | 回転電機 |
JP2018082003A (ja) * | 2016-11-15 | 2018-05-24 | 凸版印刷株式会社 | 非接触通信媒体 |
Also Published As
Publication number | Publication date |
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US7935430B2 (en) | 2011-05-03 |
CN1960598A (zh) | 2007-05-09 |
US20070102487A1 (en) | 2007-05-10 |
JP4522939B2 (ja) | 2010-08-11 |
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