JP6311844B2 - 接合方法 - Google Patents
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- JP6311844B2 JP6311844B2 JP2017537703A JP2017537703A JP6311844B2 JP 6311844 B2 JP6311844 B2 JP 6311844B2 JP 2017537703 A JP2017537703 A JP 2017537703A JP 2017537703 A JP2017537703 A JP 2017537703A JP 6311844 B2 JP6311844 B2 JP 6311844B2
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- 238000005304 joining Methods 0.000 title claims description 165
- 238000000034 method Methods 0.000 title claims description 32
- 238000002844 melting Methods 0.000 claims description 103
- 230000008018 melting Effects 0.000 claims description 103
- 239000002184 metal Substances 0.000 claims description 89
- 229910052751 metal Inorganic materials 0.000 claims description 89
- 239000002923 metal particle Substances 0.000 claims description 75
- 239000000463 material Substances 0.000 claims description 54
- 229910000765 intermetallic Inorganic materials 0.000 claims description 33
- 239000002245 particle Substances 0.000 claims description 28
- 239000000155 melt Substances 0.000 claims description 26
- 229910045601 alloy Inorganic materials 0.000 claims description 21
- 239000000956 alloy Substances 0.000 claims description 21
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 239000012530 fluid Substances 0.000 claims description 12
- 230000004907 flux Effects 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000003870 refractory metal Substances 0.000 claims description 8
- 229910017566 Cu-Mn Inorganic materials 0.000 claims description 4
- 229910002482 Cu–Ni Inorganic materials 0.000 claims description 4
- 229910017871 Cu—Mn Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910017767 Cu—Al Inorganic materials 0.000 claims description 3
- 229910017813 Cu—Cr Inorganic materials 0.000 claims description 3
- 229910017868 Cu—Ni—Co Inorganic materials 0.000 claims description 3
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 3
- 229910017881 Cu—Ni—Fe Inorganic materials 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 239000011162 core material Substances 0.000 description 21
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 19
- 239000010949 copper Substances 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 17
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 10
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 10
- 229910052742 iron Inorganic materials 0.000 description 10
- 238000005476 soldering Methods 0.000 description 10
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 238000005755 formation reaction Methods 0.000 description 6
- GHYOCDFICYLMRF-UTIIJYGPSA-N (2S,3R)-N-[(2S)-3-(cyclopenten-1-yl)-1-[(2R)-2-methyloxiran-2-yl]-1-oxopropan-2-yl]-3-hydroxy-3-(4-methoxyphenyl)-2-[[(2S)-2-[(2-morpholin-4-ylacetyl)amino]propanoyl]amino]propanamide Chemical compound C1(=CCCC1)C[C@@H](C(=O)[C@@]1(OC1)C)NC([C@H]([C@@H](C1=CC=C(C=C1)OC)O)NC([C@H](C)NC(CN1CCOCC1)=O)=O)=O GHYOCDFICYLMRF-UTIIJYGPSA-N 0.000 description 5
- 229940125797 compound 12 Drugs 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000012190 activator Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 238000002788 crimping Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910052748 manganese Inorganic materials 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 229910017034 MnSn Inorganic materials 0.000 description 2
- 229910005887 NiSn Inorganic materials 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- ONBQEOIKXPHGMB-VBSBHUPXSA-N 1-[2-[(2s,3r,4s,5r)-3,4-dihydroxy-5-(hydroxymethyl)oxolan-2-yl]oxy-4,6-dihydroxyphenyl]-3-(4-hydroxyphenyl)propan-1-one Chemical compound O[C@@H]1[C@H](O)[C@@H](CO)O[C@H]1OC1=CC(O)=CC(O)=C1C(=O)CCC1=CC=C(O)C=C1 ONBQEOIKXPHGMB-VBSBHUPXSA-N 0.000 description 1
- DMRXISNUOWIOKV-UHFFFAOYSA-N 1-bromobutan-2-ol Chemical compound CCC(O)CBr DMRXISNUOWIOKV-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910003336 CuNi Inorganic materials 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 229910003271 Ni-Fe Inorganic materials 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910020935 Sn-Sb Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910018731 Sn—Au Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 229910008757 Sn—Sb Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229930183415 Suberin Natural products 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000004323 axial length Effects 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- AGEZXYOZHKGVCM-UHFFFAOYSA-N benzyl bromide Chemical class BrCC1=CC=CC=C1 AGEZXYOZHKGVCM-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229940126142 compound 16 Drugs 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- CUILPNURFADTPE-UHFFFAOYSA-N hypobromous acid Chemical class BrO CUILPNURFADTPE-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000009830 intercalation Methods 0.000 description 1
- 230000002687 intercalation Effects 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Powder Metallurgy (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Description
なお、線材2をSnとし、孔4にCu粒子を配置する効果は次の通りである。すなわち、この構成は、Cu粒子の酸化を防げること、具体的には、はんだ付けの際、Snが溶けだしてCuと反応するため、Cuが外部に露出して酸化することを防止できる。
なお、流動材6(フラックス)の効果は次の通りである。すなわち、流動材6は、金属粒5を孔4へ挿入する際、挿入したCu粒子どうしが密集しなくなり、溶融時にSnとの反応面積を増やすことができる。
2…線材
3…芯材
4…孔
5…金属粒
6…流動材
12…金属間化合物
16…残滓
105…溶融液
106…接合部
Claims (8)
- 複数の孔が設けられた、主たる材質が低融点金属である線材と、前記複数の孔に挿入された、前記低融点金属の溶融液との反応により、前記低融点金属よりも高い融点を有する金属間化合物を生成する高融点金属を含む金属粒と、を備え、前記線材が扁平状であり、前記複数の孔が前記線材の軸方向に沿って互いに平行に延びるように設けられている、接合用部材を、第1接合対象と第2接合対象との間に配置し、第1接合対象と第2接合対象との間に圧力をかけて加熱する工程、
を含む、接合方法。 - 前記複数の孔は、前記線材の軸方向から見た断面の長手方向に沿って並んでいる、
請求項1に記載の接合方法。 - 前記低融点金属はSnまたはSn合金であり、
前記高融点金属は、Cu−Ni合金、Cu−Ni−Co合金、Cu−Ni−Fe合金、Cu−Mn合金、Cu−Cr合金、または、Cu−Al合金、である、
請求項1または2に記載の接合方法。 - 前記接合用部材は、前記金属粒とともに前記複数の孔に挿入されていて、前記複数の孔への挿入時に前記金属粒の流動性を向上させる流動材を更に備える、
請求項1から3のいずれかに記載の接合方法。 - 前記流動材は、常温では固体状態であり、かつ、前記常温よりも高く前記低融点金属の融点よりも低い温度では軟化する、
請求項4に記載の接合方法。 - 前記流動材は、フラックスを含む、
請求項5に記載の接合方法。 - 前記金属粒と前記流動材との重量比は、75:25〜99.5:0.5の範囲内である、
請求項4乃至6のいずれかに記載の接合方法。 - 前記金属粒の平均粒径(D50)は、0.1〜30μmの範囲内である、
請求項1乃至7のいずれかに記載の接合方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2015170844 | 2015-08-31 | ||
JP2015170844 | 2015-08-31 | ||
PCT/JP2016/073533 WO2017038418A1 (ja) | 2015-08-31 | 2016-08-10 | 接合用部材、接合用部材の製造方法、および、接合方法 |
Publications (2)
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JPWO2017038418A1 JPWO2017038418A1 (ja) | 2018-04-05 |
JP6311844B2 true JP6311844B2 (ja) | 2018-04-18 |
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Country | Link |
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JP (1) | JP6311844B2 (ja) |
WO (1) | WO2017038418A1 (ja) |
Cited By (1)
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CN109465564A (zh) * | 2018-12-13 | 2019-03-15 | 郑州机械研究所有限公司 | 一种钎焊强度高、抗腐蚀性强的锌铝药芯钎料 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP6583391B2 (ja) | 2017-11-14 | 2019-10-02 | 千住金属工業株式会社 | フラックス、やに入りはんだおよびフラックスコートペレット |
CN113927212B (zh) * | 2021-11-12 | 2022-08-30 | 南京航空航天大学 | 一种面向电弧增材修复的焊丝结构设计的方法 |
Family Cites Families (7)
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JPH06126479A (ja) * | 1992-10-23 | 1994-05-10 | Tanaka Denshi Kogyo Kk | 複合半田 |
JPH11347783A (ja) * | 1998-06-09 | 1999-12-21 | Nippon Light Metal Co Ltd | アルミニウム又はアルミニウム合金接合用線状ろう材及びその製造方法 |
JP2004174522A (ja) * | 2002-11-25 | 2004-06-24 | Hitachi Ltd | 複合はんだ、その製造方法および電子機器 |
JP4012920B2 (ja) * | 2005-12-08 | 2007-11-28 | 株式会社山口製作所 | 鉛フリーフラックス入りハンダ母線製造方法及び該製造装置 |
JP5018978B1 (ja) * | 2010-11-19 | 2012-09-05 | 株式会社村田製作所 | 導電性材料、それを用いた接続方法、および接続構造 |
EP2756913A4 (en) * | 2011-09-16 | 2015-09-23 | Murata Manufacturing Co | ELECTROCONDUCTIVE MATERIAL, AND BONDING METHOD AND BINDING STRUCTURE USING THE SAME |
WO2013038816A1 (ja) * | 2011-09-16 | 2013-03-21 | 株式会社村田製作所 | 導電性材料、それを用いた接続方法、および接続構造 |
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2016
- 2016-08-10 WO PCT/JP2016/073533 patent/WO2017038418A1/ja active Application Filing
- 2016-08-10 JP JP2017537703A patent/JP6311844B2/ja active Active
Cited By (1)
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CN109465564A (zh) * | 2018-12-13 | 2019-03-15 | 郑州机械研究所有限公司 | 一种钎焊强度高、抗腐蚀性强的锌铝药芯钎料 |
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WO2017038418A1 (ja) | 2017-03-09 |
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