JP2007134402A - 電子部品実装構造 - Google Patents

電子部品実装構造 Download PDF

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Publication number
JP2007134402A
JP2007134402A JP2005323672A JP2005323672A JP2007134402A JP 2007134402 A JP2007134402 A JP 2007134402A JP 2005323672 A JP2005323672 A JP 2005323672A JP 2005323672 A JP2005323672 A JP 2005323672A JP 2007134402 A JP2007134402 A JP 2007134402A
Authority
JP
Japan
Prior art keywords
electronic component
adhesive layer
substrate
solder
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005323672A
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English (en)
Japanese (ja)
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JP2007134402A5 (https=
Inventor
Hiroki Suzuki
宏記 鈴木
Masato Uehara
正人 上原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP2005323672A priority Critical patent/JP2007134402A/ja
Publication of JP2007134402A publication Critical patent/JP2007134402A/ja
Publication of JP2007134402A5 publication Critical patent/JP2007134402A5/ja
Withdrawn legal-status Critical Current

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  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2005323672A 2005-11-08 2005-11-08 電子部品実装構造 Withdrawn JP2007134402A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005323672A JP2007134402A (ja) 2005-11-08 2005-11-08 電子部品実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005323672A JP2007134402A (ja) 2005-11-08 2005-11-08 電子部品実装構造

Publications (2)

Publication Number Publication Date
JP2007134402A true JP2007134402A (ja) 2007-05-31
JP2007134402A5 JP2007134402A5 (https=) 2007-11-22

Family

ID=38155838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005323672A Withdrawn JP2007134402A (ja) 2005-11-08 2005-11-08 電子部品実装構造

Country Status (1)

Country Link
JP (1) JP2007134402A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150117925A (ko) * 2014-04-11 2015-10-21 삼성전기주식회사 적층 세라믹 커패시터 및 적층 세라믹 커패시터의 실장 기판
KR20200049740A (ko) * 2014-04-11 2020-05-08 삼성전기주식회사 적층 세라믹 커패시터 및 적층 세라믹 커패시터의 실장 기판
JP2022023625A (ja) * 2020-07-27 2022-02-08 パナソニックＩｐマネジメント株式会社 実装方法およびそれにより形成される実装構造体

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150117925A (ko) * 2014-04-11 2015-10-21 삼성전기주식회사 적층 세라믹 커패시터 및 적층 세라믹 커패시터의 실장 기판
JP2015204452A (ja) * 2014-04-11 2015-11-16 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層セラミックキャパシタ及び積層セラミックキャパシタの実装基板
KR102108198B1 (ko) * 2014-04-11 2020-05-08 삼성전기주식회사 적층 세라믹 커패시터 및 적층 세라믹 커패시터의 실장 기판
KR20200049740A (ko) * 2014-04-11 2020-05-08 삼성전기주식회사 적층 세라믹 커패시터 및 적층 세라믹 커패시터의 실장 기판
KR102306713B1 (ko) * 2014-04-11 2021-09-29 삼성전기주식회사 적층 세라믹 커패시터 및 적층 세라믹 커패시터의 실장 기판
JP2022023625A (ja) * 2020-07-27 2022-02-08 パナソニックＩｐマネジメント株式会社 実装方法およびそれにより形成される実装構造体
JP7511180B2 (ja) 2020-07-27 2024-07-05 パナソニックＩｐマネジメント株式会社 実装方法およびそれにより形成される実装構造体

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