JP2009117496A5 - - Google Patents

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Publication number
JP2009117496A5
JP2009117496A5 JP2007286840A JP2007286840A JP2009117496A5 JP 2009117496 A5 JP2009117496 A5 JP 2009117496A5 JP 2007286840 A JP2007286840 A JP 2007286840A JP 2007286840 A JP2007286840 A JP 2007286840A JP 2009117496 A5 JP2009117496 A5 JP 2009117496A5
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JP
Japan
Prior art keywords
conductor wiring
mounting structure
manufacturing
protruding electrode
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007286840A
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English (en)
Japanese (ja)
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JP4979542B2 (ja
JP2009117496A (ja
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Publication date
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Priority to JP2007286840A priority Critical patent/JP4979542B2/ja
Priority claimed from JP2007286840A external-priority patent/JP4979542B2/ja
Publication of JP2009117496A publication Critical patent/JP2009117496A/ja
Publication of JP2009117496A5 publication Critical patent/JP2009117496A5/ja
Application granted granted Critical
Publication of JP4979542B2 publication Critical patent/JP4979542B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007286840A 2007-11-05 2007-11-05 実装構造体およびその製造方法 Expired - Fee Related JP4979542B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007286840A JP4979542B2 (ja) 2007-11-05 2007-11-05 実装構造体およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007286840A JP4979542B2 (ja) 2007-11-05 2007-11-05 実装構造体およびその製造方法

Publications (3)

Publication Number Publication Date
JP2009117496A JP2009117496A (ja) 2009-05-28
JP2009117496A5 true JP2009117496A5 (https=) 2010-09-24
JP4979542B2 JP4979542B2 (ja) 2012-07-18

Family

ID=40784316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007286840A Expired - Fee Related JP4979542B2 (ja) 2007-11-05 2007-11-05 実装構造体およびその製造方法

Country Status (1)

Country Link
JP (1) JP4979542B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6076114B2 (ja) * 2013-02-08 2017-02-08 オリンパス株式会社 半導体装置、固体撮像装置、および半導体装置の製造方法
JP2018197830A (ja) 2017-05-25 2018-12-13 スタンレー電気株式会社 発光機能を備えた透明パネル
JP7223946B2 (ja) * 2019-03-15 2023-02-17 パナソニックＩｐマネジメント株式会社 電子機器およびその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5234049U (https=) * 1975-09-01 1977-03-10
JPS5714470U (https=) * 1980-06-30 1982-01-25
JPH06209151A (ja) * 1993-01-12 1994-07-26 Sumitomo Bakelite Co Ltd 印刷配線板の製造方法
JP2001203229A (ja) * 2000-01-18 2001-07-27 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
US6909180B2 (en) * 2000-05-12 2005-06-21 Matsushita Electric Industrial Co., Ltd. Semiconductor device, mounting circuit board, method of producing the same, and method of producing mounting structure using the same
JP2005051204A (ja) * 2003-07-16 2005-02-24 Matsushita Electric Ind Co Ltd 電気部品実装モジュールおよびその製造方法
US7743493B2 (en) * 2004-09-24 2010-06-29 Nihon University Method for manufacturing a ceramic electronic component
JP4510649B2 (ja) * 2005-01-20 2010-07-28 パナソニック株式会社 配線基板、多層基板および電子部品実装体の製造方法

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