JP2009117496A5 - - Google Patents
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- Publication number
- JP2009117496A5 JP2009117496A5 JP2007286840A JP2007286840A JP2009117496A5 JP 2009117496 A5 JP2009117496 A5 JP 2009117496A5 JP 2007286840 A JP2007286840 A JP 2007286840A JP 2007286840 A JP2007286840 A JP 2007286840A JP 2009117496 A5 JP2009117496 A5 JP 2009117496A5
- Authority
- JP
- Japan
- Prior art keywords
- conductor wiring
- mounting structure
- manufacturing
- protruding electrode
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004020 conductor Substances 0.000 claims 25
- 239000000463 material Substances 0.000 claims 11
- 238000004519 manufacturing process Methods 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 5
- 239000002923 metal particle Substances 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 2
- 239000010419 fine particle Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 230000002093 peripheral Effects 0.000 claims 1
Claims (14)
実装構造体。 A conductive wiring provided on a base material is electrically connected by burying a protruding electrode of an electronic component, and the conductive wiring is a porous body in which at least a peripheral portion of the protruding electrode is formed of metal fine particles of 100 nm or less <<br/> Mounting structure.
請求項１記載の実装構造体。 The mounting structure according to claim 1, wherein the protruding electrode is in contact with the base material.
請求項１または請求項２記載の実装構造体。 The mounting structure according to claim 1, wherein the conductor wiring has a convex portion on the conductor wiring only at a joint portion with the protruding electrode.
第２導体配線に電子部品の突起電極を埋没させて電気接続するとともに、
第２導体配線は多孔質である
実装構造体。 A second conductor wiring is provided on the first conductor wiring provided on the substrate,
The second conductor wiring is electrically connected by burying the protruding electrode of the electronic component,
A mounting structure in which the second conductor wiring is porous.
請求項４記載の実装構造体。 The mounting structure according to claim 4, wherein the second conductor wiring is provided only at a joint portion between the first conductor wiring and the protruding electrode.
前記基材に形成した凹部に１００ｎｍ以下の粒径の金属粒子を含有したペースト材料を前記凹部の高さよりも低く充填して前記導体配線部を形成し、
前記導体配線部の材料が前記凹部から溢れ出ないように前記導電配線部に前記電子部品の突起電極を挿入し、
熱または光のエネルギーにより前記導体配部を硬化させる
実装構造体の製造方法。 When mounting electronic components on the conductor wiring provided on the substrate,
Filling the recess formed in the base material with a paste material containing metal particles having a particle size of 100 nm or less lower than the height of the recess to form the conductor wiring portion,
Insert the protruding electrode of the electronic component into the conductive wiring portion so that the material of the conductive wiring portion does not overflow from the recess,
A method for manufacturing a mounting structure, wherein the conductor arrangement portion is cured by heat or light energy.
請求項６記載の実装構造体の製造方法。 The protruding electrode is inserted into the conductive wiring portion so that the protruding electrode is in contact with the substrate.
The manufacturing method of the mounting structure of Claim 6 .
前記基材に形成した凹部にこの凹部の高さよりも低く第１の導体配線部を形成し、
第１の導体配線部の少なくとも一部に１００ｎｍ以下の粒径の金属粒子を含有したペースト材料を前記凹部から溢れ出ないように塗布して第２の導体配線部を形成し、
第２の導体配線部の材料が前記凹部から溢れ出ないように第２の導体配線部に前記電子部品の突起電極を挿入した後に第２の導体配線部を硬化する
実装構造体の製造方法。 When mounting electronic components on the conductor wiring provided on the substrate,
Forming a first conductor wiring portion lower than the height of the recess in the recess formed in the substrate;
A paste material containing metal particles having a particle size of 100 nm or less is applied to at least a part of the first conductor wiring portion so as not to overflow from the concave portion, thereby forming a second conductor wiring portion,
The manufacturing method of the mounting structure which hardens a 2nd conductor wiring part, after inserting the projection electrode of the said electronic component in a 2nd conductor wiring part so that the material of a 2nd conductor wiring part may not overflow from the said recessed part.
請求項８に記載の実装構造体の製造方法。 The first conductor wiring portion is formed of a paste material containing metal particles having a particle size of 100 nm or less, and the first conductor wiring portion is cured before applying the material of the second conductor wiring portion.
The manufacturing method of the mounting structure of Claim 8 .
請求項７または請求項９に記載の実装構造体の製造方法。 Before applying the material for the second conductor wiring portion, a resist film having an opening in the region of the second conductor wiring portion is formed.
The manufacturing method of the mounting structure of Claim 7 or Claim 9 .
請求項６〜請求項１０の何れか記載の実装構造体の製造方法。 The recess is formed from a resist film.
The manufacturing method of the mounting structure in any one of Claims 6-10 .
請求項１１に記載の実装構造体の製造方法。 Remove the resist film after mounting electronic components
The manufacturing method of the mounting structure of Claim 11 .
請求項６〜請求項１１の何れかに記載の実装構造体の製造方法。 Add a process to form additional conductor wiring at the connection with other parts in conductor wiring
The manufacturing method of the mounting structure in any one of Claims 6-11 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007286840A JP4979542B2 (en) | 2007-11-05 | 2007-11-05 | Mounting structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007286840A JP4979542B2 (en) | 2007-11-05 | 2007-11-05 | Mounting structure and manufacturing method thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009117496A JP2009117496A (en) | 2009-05-28 |
| JP2009117496A5 true JP2009117496A5 (en) | 2010-09-24 |
| JP4979542B2 JP4979542B2 (en) | 2012-07-18 |
Family
ID=40784316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007286840A Expired - Fee Related JP4979542B2 (en) | 2007-11-05 | 2007-11-05 | Mounting structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4979542B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6076114B2 (en) * | 2013-02-08 | 2017-02-08 | オリンパス株式会社 | Semiconductor device, solid-state imaging device, and manufacturing method of semiconductor device |
| JP2018197830A (en) * | 2017-05-25 | 2018-12-13 | スタンレー電気株式会社 | Transparent panel having light emitting function |
| JP7223946B2 (en) * | 2019-03-15 | 2023-02-17 | パナソニックＩｐマネジメント株式会社 | Electronic device and its manufacturing method |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5234049U (en) * | 1975-09-01 | 1977-03-10 | ||
| JPS5714470U (en) * | 1980-06-30 | 1982-01-25 | ||
| JPH06209151A (en) * | 1993-01-12 | 1994-07-26 | Sumitomo Bakelite Co Ltd | Manufacture of printed-wiring board |
| JP2001203229A (en) * | 2000-01-18 | 2001-07-27 | Seiko Epson Corp | Semiconductor device and manufacturing method thereof, and circuit substrate and electronic apparatus |
| EP1223612A4 (en) * | 2000-05-12 | 2005-06-29 | Matsushita Electric Ind Co Ltd | Semiconductor device mounting circuit board, method of producing the same, and method of producing mounting structure using the same |
| JP2005051204A (en) * | 2003-07-16 | 2005-02-24 | Matsushita Electric Ind Co Ltd | Module for mounting electrical component and method for manufacturing the same |
| WO2006033402A1 (en) * | 2004-09-24 | 2006-03-30 | Nihon University | Method for manufacturing ceramic electronic component |
| JP4510649B2 (en) * | 2005-01-20 | 2010-07-28 | パナソニック株式会社 | WIRING BOARD, MULTILAYER BOARD AND ELECTRONIC COMPONENT MOUNTING METHOD |
-
2007
- 2007-11-05 JP JP2007286840A patent/JP4979542B2/en not_active Expired - Fee Related
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