JP2007035743A5

JP2007035743A5 -

Info

Publication number: JP2007035743A5
Application number: JP2005213814A
Authority: JP
Filing date: 2005-07-25
Publication date: 2008-08-14
Anticipated expiration: 2025-07-25

Description

即ち、本発明は、下記の通りである。
１）相対峙する回路電極同士を、導電粒子と絶縁性接着剤を主成分とする異方導電性接着剤を用いて接続する回路接続方法において、接続電極間の導電粒子捕捉率が隣接電極間スペース部の導電粒子滞留率の３倍以上となる様に接続する回路接続方法。
２）回路の一方がＩＣチップであり、異方導電性接着剤が、導電粒子が面方向に略均等に分散され、厚み方向には単層に配置された異方導電性接着フィルムであって、接続時における隣接電極間スペース部に存在する導電粒子の流動性が、接続電極間に存在する導電粒子の流動性よりも高くなる様に接続する上記１）記載の回路接続方法。
３）接続時における隣接電極間スペース部の絶縁性接着剤の流動速度が、接続電極間の絶縁性接着剤の流動速度よりも速く、隣接電極間スペース部の絶縁性接着剤の流動速度に対しては、追従して導電粒子は流動するが、接続電極間の絶縁性接着剤の流動速度に対しては、それに抗して、導電粒子の流動性が抑制される様な固定強さで、導電粒子を固定用樹脂で固定した異方導電性接着剤を用いて接続する上記１）または２）に記載の回路接続方法。
４）回路基板とＩＣチップを、異方導電性接着剤で接続した接続構造体であって、接続電極間の導電粒子密度ｑ個／ｍｍ２と、隣接電極間スペース部の導電粒子密度ｒ個／ｍｍ２との間に、ｑ＞ｒ×３の関係を有することを特徴とする接続構造体。
５）異方導電性接着剤として、隣接電極間スペース部の絶縁性接着剤の流動速度に対しては、追従して導電粒子は流動するが、接続電極間の絶縁性接着剤の流動速度に対しては、それに抗して、導電粒子の流動性が抑制される様な固定強さで、導電粒子を固定用樹脂で固定した異方導電性接着剤を用いる上記４）記載の接続構造体。
６）回路基板とＩＣチップを、異方導電性接着剤で接続した接続構造体であって、ＩＣチップの電極を有さない中心部の導電粒子密度ｐ個／ｍｍ２と隣接電極間スペース部の導電粒子密度ｒ個／ｍｍ２との間に、ｐ＞ｒ×３の関係を有することを特徴とする接続構造体。
７）異方導電性接着剤として、隣接電極間スペース部の絶縁性接着剤の流動速度に対しては、追従して導電粒子は流動するが、電極を有さないＩＣチップ中心部の流動速度に対しては、それに抗して、導電粒子の流動性が抑制される様な固定強さで、導電粒子を固定用樹脂で固定した異方導電性接着剤を用いる上記６）記載の接続構造体。 That is, the present invention is as follows.
1) In a circuit connection method in which circuit electrodes facing each other are connected using an anisotropic conductive adhesive mainly composed of conductive particles and an insulating adhesive, the conductive particle capture rate between the connection electrodes is between adjacent electrodes. A circuit connection method in which connection is performed so that the conductive particle retention rate of the space portion is three times or more.
2) One of the circuits is an IC chip, and the anisotropic conductive adhesive is an anisotropic conductive adhesive film in which conductive particles are dispersed substantially evenly in the plane direction and arranged in a single layer in the thickness direction. The circuit connection method according to 1), wherein the connection is made so that the fluidity of the conductive particles existing in the space between adjacent electrodes at the time of connection is higher than the fluidity of the conductive particles existing between the connection electrodes.
3) The flow rate of the insulating adhesive in the space between adjacent electrodes during connection is faster than the flow rate of the insulating adhesive between the connecting electrodes, and the flow rate of the insulating adhesive in the space between adjacent electrodes In this case, the conductive particles flow following, but with respect to the flow rate of the insulating adhesive between the connecting electrodes, the fixing strength is such that the flowability of the conductive particles is suppressed against this, The circuit connection method according to 1) or 2), wherein the conductive particles are connected using an anisotropic conductive adhesive fixed with a fixing resin.
4 ) A connection structure in which a circuit board and an IC chip are connected with an anisotropic conductive adhesive, and the conductive particle density between connection electrodes is q / mm2, and the conductive particle density is r / in the space between adjacent electrodes. A connection structure having a relationship of q> r × 3 with mm2.
5) As the anisotropic conductive adhesive, the conductive particles flow following the flow rate of the insulating adhesive in the space between the adjacent electrodes, but the flow rate of the insulating adhesive between the connecting electrodes On the other hand, the connection structure according to 4) above using an anisotropic conductive adhesive in which the conductive particles are fixed with a fixing resin with a fixing strength that suppresses the fluidity of the conductive particles. .
6 ) A connection structure in which the circuit board and the IC chip are connected with an anisotropic conductive adhesive, and the density of the conductive particles in the central part without IC chip electrodes / mm 2 and the space between adjacent electrodes A connection structure characterized by having a relationship of p> r × 3 between the conductive particle density r / mm 2.
7) As the anisotropic conductive adhesive, the flow rate of the insulating adhesive in the space between adjacent electrodes follows the flow rate of the conductive particles, but the flow rate of the central part of the IC chip without the electrode. On the other hand, the connection structure according to 6) above using an anisotropic conductive adhesive in which the conductive particles are fixed with a fixing resin with a fixing strength against which the fluidity of the conductive particles is suppressed. body.

Claims

In a circuit connection method for connecting circuit electrodes facing each other using an anisotropic conductive adhesive mainly composed of conductive particles and an insulating adhesive, the conductive particle capturing rate between the connection electrodes is a space portion between adjacent electrodes. Circuit connection method for connecting the conductive particles so as to be 3 times or more of the conductive particle retention rate.

One of the circuits is an IC chip, and an anisotropic conductive adhesive is an anisotropic conductive adhesive film in which conductive particles are dispersed substantially evenly in the plane direction and arranged in a single layer in the thickness direction. The circuit connection method according to claim 1, wherein the connection is performed such that the fluidity of the conductive particles existing in the space between adjacent electrodes is higher than the fluidity of the conductive particles existing between the connection electrodes.

The flow rate of the insulating adhesive in the space between adjacent electrodes during connection is faster than the flow rate of the insulating adhesive between the connecting electrodes. The conductive particles flow, following the flow rate of the insulating adhesive between the connecting electrodes, but with a fixed strength that suppresses the fluidity of the conductive particles against the flow rate. The circuit connection method according to claim 1, wherein the connection is made using an anisotropic conductive adhesive fixed with a fixing resin.

A connection structure in which a circuit board and an IC chip are connected with an anisotropic conductive adhesive, and the conductive particle density between connection electrodes is q / mm ² and the conductive particle density is r / mm in the space between adjacent electrodes. ^2. A connection structure having a relationship of q> r × 3 between ² and ² .

As an anisotropic conductive adhesive, the conductive particles flow following the flow rate of the insulating adhesive in the space between adjacent electrodes, but the flow rate of the insulating adhesive between the connecting electrodes 5. The connection structure according to claim 4, wherein an anisotropic conductive adhesive is used in which the conductive particles are fixed with a fixing resin at a fixing strength against which the fluidity of the conductive particles is suppressed.

A connection structure in which a circuit board and an IC chip are connected with an anisotropic conductive adhesive, and the density of conductive particles in the central part, which does not have an electrode of the IC chip, p pieces / mm ^2, and the conductivity of the space part between adjacent electrodes A connection structure characterized by having a relationship of p> r × 3 between the particle density and r particles / mm ² .

As an anisotropic conductive adhesive, the conductive particles flow following the flow rate of the insulating adhesive in the space between adjacent electrodes, but the flow rate at the center of the IC chip that does not have an electrode. On the other hand, the connection structure according to claim 6, wherein an anisotropic conductive adhesive in which the conductive particles are fixed with a fixing resin with a fixing strength that suppresses the fluidity of the conductive particles is used.