JP2006332246A5 - - Google Patents
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- Publication number
- JP2006332246A5 JP2006332246A5 JP2005152387A JP2005152387A JP2006332246A5 JP 2006332246 A5 JP2006332246 A5 JP 2006332246A5 JP 2005152387 A JP2005152387 A JP 2005152387A JP 2005152387 A JP2005152387 A JP 2005152387A JP 2006332246 A5 JP2006332246 A5 JP 2006332246A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- circuit
- circuit board
- connection
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 229920006015 heat resistant resin Polymers 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005152387A JP2006332246A (ja) | 2005-05-25 | 2005-05-25 | 回路基板、回路基板の接続構造および電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005152387A JP2006332246A (ja) | 2005-05-25 | 2005-05-25 | 回路基板、回路基板の接続構造および電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006332246A JP2006332246A (ja) | 2006-12-07 |
| JP2006332246A5 true JP2006332246A5 (https=) | 2008-07-03 |
Family
ID=37553638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005152387A Pending JP2006332246A (ja) | 2005-05-25 | 2005-05-25 | 回路基板、回路基板の接続構造および電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006332246A (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101803476A (zh) * | 2007-09-21 | 2010-08-11 | 松下电器产业株式会社 | 立体印刷布线板及其制造方法以及电子部件模块 |
| JP2011253926A (ja) * | 2010-06-02 | 2011-12-15 | Sumitomo Electric Printed Circuit Inc | 両面フレキシブルプリント配線板、接続構造、電子機器 |
| KR102622369B1 (ko) * | 2015-12-30 | 2024-01-09 | 엘지디스플레이 주식회사 | 연성인쇄회로필름 및 이를 포함하는 표시장치 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58140980A (ja) * | 1982-02-12 | 1983-08-20 | シャープ株式会社 | 配線基板コネクタ−の構成 |
| JPH0440562A (ja) * | 1990-06-06 | 1992-02-10 | Nec Corp | データベース及びデータ合成システム |
| US5337218A (en) * | 1992-06-02 | 1994-08-09 | International Business Machines Corporation | Circuit card interconnecting structure |
| JP3424272B2 (ja) * | 1993-08-25 | 2003-07-07 | 株式会社デンソー | 配線回路基板接続用フレキシブル基板 |
| JP2003249734A (ja) * | 2002-02-25 | 2003-09-05 | Nec Saitama Ltd | 積層配線基板及びその製造方法 |
| JP2003258401A (ja) * | 2002-02-28 | 2003-09-12 | Denso Corp | 多層配線基板 |
-
2005
- 2005-05-25 JP JP2005152387A patent/JP2006332246A/ja active Pending
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